KR20070000954A - 제 1 부재를 제 2 부재에 접착제로 부착하는 방법 및 장치 - Google Patents

제 1 부재를 제 2 부재에 접착제로 부착하는 방법 및 장치 Download PDF

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Publication number
KR20070000954A
KR20070000954A KR1020050092443A KR20050092443A KR20070000954A KR 20070000954 A KR20070000954 A KR 20070000954A KR 1020050092443 A KR1020050092443 A KR 1020050092443A KR 20050092443 A KR20050092443 A KR 20050092443A KR 20070000954 A KR20070000954 A KR 20070000954A
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KR
South Korea
Prior art keywords
adhesive
members
attaching
separated
glass transition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020050092443A
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English (en)
Korean (ko)
Inventor
로저 제임스 호프맨
데이비드 다니엘 백크룬드
데니스 쿠니토 크루즈
폴 웨인 맥러플린
Original Assignee
시게이트 테크놀로지 엘엘씨
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Application filed by 시게이트 테크놀로지 엘엘씨 filed Critical 시게이트 테크놀로지 엘엘씨
Publication of KR20070000954A publication Critical patent/KR20070000954A/ko
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/02—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4835—Heat curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4865—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives
    • B29C65/487—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical
    • B29C65/4875—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical being spherical, e.g. particles or powders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4865—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives
    • B29C65/4885—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their composition being non-plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/76—Making non-permanent or releasable joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/782—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined
    • B29C65/7823—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint
    • B29C65/7826—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint said distance pieces being non-integral with the parts to be joined, e.g. particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/024—Thermal pre-treatments
    • B29C66/0242—Heating, or preheating, e.g. drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
    • Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
KR1020050092443A 2005-06-28 2005-09-30 제 1 부재를 제 2 부재에 접착제로 부착하는 방법 및 장치 Withdrawn KR20070000954A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/168,805 2005-06-28
US11/168,805 US20060292377A1 (en) 2005-06-28 2005-06-28 Adhesive attachment of a first member to a second member

Publications (1)

Publication Number Publication Date
KR20070000954A true KR20070000954A (ko) 2007-01-03

Family

ID=37567811

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050092443A Withdrawn KR20070000954A (ko) 2005-06-28 2005-09-30 제 1 부재를 제 2 부재에 접착제로 부착하는 방법 및 장치

Country Status (4)

Country Link
US (1) US20060292377A1 (https=)
JP (1) JP2007009168A (https=)
KR (1) KR20070000954A (https=)
CN (1) CN1887998A (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9953910B2 (en) * 2007-06-21 2018-04-24 General Electric Company Demountable interconnect structure
US20080313894A1 (en) * 2007-06-21 2008-12-25 General Electric Company Method for making an interconnect structure and low-temperature interconnect component recovery process
US20080318413A1 (en) * 2007-06-21 2008-12-25 General Electric Company Method for making an interconnect structure and interconnect component recovery process
US20080318054A1 (en) * 2007-06-21 2008-12-25 General Electric Company Low-temperature recoverable electronic component
US20080318055A1 (en) * 2007-06-21 2008-12-25 General Electric Company Recoverable electronic component
US9610758B2 (en) * 2007-06-21 2017-04-04 General Electric Company Method of making demountable interconnect structure
US8118964B2 (en) * 2008-02-26 2012-02-21 Seagate Technology Llc Assembly of data storage components
EP2184774A1 (en) * 2008-11-05 2010-05-12 General Electric Company Low-temperature recoverable electronic component
EP2184776A1 (en) * 2008-11-05 2010-05-12 General Electric Company Method for making an interconnect structure and low-temperature interconnect component recovery process
CN104124835A (zh) * 2013-04-26 2014-10-29 新科实业有限公司 音圈马达的组装方法及组装装置
US10678118B2 (en) * 2015-12-31 2020-06-09 Flextronics Ap, Llc Method and system of sealing front half of camera module
JP6947188B2 (ja) * 2016-05-19 2021-10-13 シクパ ホルディング ソシエテ アノニムＳｉｃｐａ Ｈｏｌｄｉｎｇ Ｓａ 不活性材料の構成部品を組み立てるための接着剤

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3635754A (en) * 1966-01-21 1972-01-18 Johnson & Johnson Adhesive product
JPS5198738A (ja) * 1975-12-22 1976-08-31 Setsuchakuzaidesetsuchakushitafukusubutsutainobunrihoho
US4059467A (en) * 1976-09-27 1977-11-22 Bell Telephone Laboratories, Incorporated Method for removal of elastomeric silicone coatings from integrated circuits
US4255216A (en) * 1980-01-14 1981-03-10 International Business Machines Corporation Pellicle ring removal method and tool
JPS5774377A (en) * 1980-10-28 1982-05-10 Showa Alum Corp Method of peeling off adhesive tape from adhesive tape-converted metallic material
US4829395A (en) * 1985-09-06 1989-05-09 Warren Coon Load beam/assembly
US4783504A (en) * 1986-02-28 1988-11-08 Shell Oil Company Hot melt adhesive containing a silane grafted hydrogenated block polymer
JPH0832861B2 (ja) * 1989-01-13 1996-03-29 松下電器産業株式会社 電子部品用接着剤
JP2522549B2 (ja) * 1989-07-19 1996-08-07 シャープ株式会社 貼り合わせ構造
US5455074A (en) * 1992-12-29 1995-10-03 Kimberly-Clark Corporation Laminating method and products made thereby
JPH08339644A (ja) * 1995-06-06 1996-12-24 Hewlett Packard Co <Hp> 剛性アクチュエータアーム構造を有するディスク装置
US5783867A (en) * 1995-11-06 1998-07-21 Ford Motor Company Repairable flip-chip undercoating assembly and method and material for same
JPH09176590A (ja) * 1995-12-25 1997-07-08 Sekisui Chem Co Ltd 粘着テープ用蛍光性粘着剤
US5877919A (en) * 1996-06-07 1999-03-02 Western Digital Corporation Method and apparatus for a low-profile head-suspension attachment for a disk drive
US5759418A (en) * 1996-06-14 1998-06-02 International Business Machines Corporation Adhesively attached hard disk head suspension and etching process
JPH103764A (ja) * 1996-06-17 1998-01-06 Fujitsu Ltd サスペンションのアクチュエータアームへの固定方法及びアクチュエータアームアセンブリ
JPH1031872A (ja) * 1996-07-18 1998-02-03 Nhk Spring Co Ltd ディスク用ヘッド支持装置
US5734523A (en) * 1996-07-24 1998-03-31 Pemstar, Inc. Conductive film connectors for use on head assemblies in drives
US5803835A (en) * 1996-12-09 1998-09-08 Moton; James M. Musical hop scotch game kit
DE19705027C2 (de) * 1997-02-10 2002-09-19 Infineon Technologies Ag Verfahren zum Verkleben eines Bauelements mit einer Oberfläche
JPH10231354A (ja) * 1997-02-19 1998-09-02 Nagase Chiba Kk エポキシ樹脂組成物、熱硬化性樹脂フィルム及び基板に対する硬化樹脂フィルムの形成方法
JPH10330717A (ja) * 1997-05-27 1998-12-15 Nippon Kayaku Co Ltd 接着剤組成物、接着体及び液晶表示パネル
JP3288276B2 (ja) * 1997-08-29 2002-06-04 ティーディーケイ株式会社 有機ｅｌ素子
US6170983B1 (en) * 1998-05-15 2001-01-09 Germanow-Simon Corporation Thermometer calibrator
US6021023A (en) * 1998-06-17 2000-02-01 International Business Machines Corporation Transducer suspension system and method
JP2000051782A (ja) * 1998-08-07 2000-02-22 Car Mate Mfg Co Ltd 塗布方法
JP3575480B2 (ja) * 1999-11-10 2004-10-13 日立化成工業株式会社 半導体用接着フィルム
US6704165B2 (en) * 2001-06-08 2004-03-09 Seagate Technology Llc Attachment of a head-gimbal assembly to a printed circuit board actuator arm using Z-axis conductive adhesive film
JP2003317323A (ja) * 2002-04-19 2003-11-07 Matsushita Electric Ind Co Ltd 基板の貼り合せ方法及び装置
JP2004043739A (ja) * 2002-07-15 2004-02-12 Matsushita Electric Works Ltd 積層建材の分離方法
JP2004210802A (ja) * 2002-11-14 2004-07-29 Kansai Paint Co Ltd 紫外線硬化型接着剤組成物
US6869894B2 (en) * 2002-12-20 2005-03-22 General Chemical Corporation Spin-on adhesive for temporary wafer coating and mounting to support wafer thinning and backside processing
JP2004331926A (ja) * 2003-03-07 2004-11-25 Sekisui Chem Co Ltd 接着構造体及びその製造方法

Also Published As

Publication number Publication date
US20060292377A1 (en) 2006-12-28
CN1887998A (zh) 2007-01-03
JP2007009168A (ja) 2007-01-18

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PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20050930

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