CN1887998A - 第一部件和第二部件的胶粘连接 - Google Patents
第一部件和第二部件的胶粘连接 Download PDFInfo
- Publication number
- CN1887998A CN1887998A CNA200510108987XA CN200510108987A CN1887998A CN 1887998 A CN1887998 A CN 1887998A CN A200510108987X A CNA200510108987X A CN A200510108987XA CN 200510108987 A CN200510108987 A CN 200510108987A CN 1887998 A CN1887998 A CN 1887998A
- Authority
- CN
- China
- Prior art keywords
- parts
- binding agent
- isolation
- equipment
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title abstract description 12
- 230000001070 adhesive effect Effects 0.000 title abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000011230 binding agent Substances 0.000 claims description 106
- 238000002955 isolation Methods 0.000 claims description 16
- 238000012856 packing Methods 0.000 claims description 12
- 230000007704 transition Effects 0.000 claims description 9
- 239000000725 suspension Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 6
- 230000000717 retained effect Effects 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000003377 acid catalyst Substances 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 239000003999 initiator Substances 0.000 claims description 3
- 230000005622 photoelectricity Effects 0.000 claims description 3
- 230000001464 adherent effect Effects 0.000 claims description 2
- 238000013500 data storage Methods 0.000 abstract description 10
- 230000013011 mating Effects 0.000 abstract description 2
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 230000009477 glass transition Effects 0.000 abstract 1
- 230000008569 process Effects 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- PIVBPZFQXKMHBD-UHFFFAOYSA-N 1,2,3-trichloro-5-(2,5-dichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C=C(Cl)C(Cl)=C(Cl)C=2)=C1 PIVBPZFQXKMHBD-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/02—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
- B29C65/1406—Ultraviolet [UV] radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4835—Heat curing adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4865—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives
- B29C65/487—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical
- B29C65/4875—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical being spherical, e.g. particles or powders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4865—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives
- B29C65/4885—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their composition being non-plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/76—Making non-permanent or releasable joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
- B29C65/782—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined
- B29C65/7823—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint
- B29C65/7826—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint said distance pieces being non-integral with the parts to be joined, e.g. particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/024—Thermal pre-treatments
- B29C66/0242—Heating, or preheating, e.g. drying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/43—Joining a relatively small portion of the surface of said articles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
- Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/168,805 | 2005-06-28 | ||
| US11/168,805 US20060292377A1 (en) | 2005-06-28 | 2005-06-28 | Adhesive attachment of a first member to a second member |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1887998A true CN1887998A (zh) | 2007-01-03 |
Family
ID=37567811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA200510108987XA Pending CN1887998A (zh) | 2005-06-28 | 2005-09-29 | 第一部件和第二部件的胶粘连接 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20060292377A1 (https=) |
| JP (1) | JP2007009168A (https=) |
| KR (1) | KR20070000954A (https=) |
| CN (1) | CN1887998A (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104124835A (zh) * | 2013-04-26 | 2014-10-29 | 新科实业有限公司 | 音圈马达的组装方法及组装装置 |
| RU2744431C2 (ru) * | 2016-05-19 | 2021-03-09 | Сикпа Холдинг Са | Адгезивы для сборки компонентов инертного материала |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9953910B2 (en) * | 2007-06-21 | 2018-04-24 | General Electric Company | Demountable interconnect structure |
| US20080313894A1 (en) * | 2007-06-21 | 2008-12-25 | General Electric Company | Method for making an interconnect structure and low-temperature interconnect component recovery process |
| US20080318413A1 (en) * | 2007-06-21 | 2008-12-25 | General Electric Company | Method for making an interconnect structure and interconnect component recovery process |
| US20080318054A1 (en) * | 2007-06-21 | 2008-12-25 | General Electric Company | Low-temperature recoverable electronic component |
| US20080318055A1 (en) * | 2007-06-21 | 2008-12-25 | General Electric Company | Recoverable electronic component |
| US9610758B2 (en) * | 2007-06-21 | 2017-04-04 | General Electric Company | Method of making demountable interconnect structure |
| US8118964B2 (en) * | 2008-02-26 | 2012-02-21 | Seagate Technology Llc | Assembly of data storage components |
| EP2184774A1 (en) * | 2008-11-05 | 2010-05-12 | General Electric Company | Low-temperature recoverable electronic component |
| EP2184776A1 (en) * | 2008-11-05 | 2010-05-12 | General Electric Company | Method for making an interconnect structure and low-temperature interconnect component recovery process |
| US10678118B2 (en) * | 2015-12-31 | 2020-06-09 | Flextronics Ap, Llc | Method and system of sealing front half of camera module |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3635754A (en) * | 1966-01-21 | 1972-01-18 | Johnson & Johnson | Adhesive product |
| JPS5198738A (ja) * | 1975-12-22 | 1976-08-31 | Setsuchakuzaidesetsuchakushitafukusubutsutainobunrihoho | |
| US4059467A (en) * | 1976-09-27 | 1977-11-22 | Bell Telephone Laboratories, Incorporated | Method for removal of elastomeric silicone coatings from integrated circuits |
| US4255216A (en) * | 1980-01-14 | 1981-03-10 | International Business Machines Corporation | Pellicle ring removal method and tool |
| JPS5774377A (en) * | 1980-10-28 | 1982-05-10 | Showa Alum Corp | Method of peeling off adhesive tape from adhesive tape-converted metallic material |
| US4829395A (en) * | 1985-09-06 | 1989-05-09 | Warren Coon | Load beam/assembly |
| US4783504A (en) * | 1986-02-28 | 1988-11-08 | Shell Oil Company | Hot melt adhesive containing a silane grafted hydrogenated block polymer |
| JPH0832861B2 (ja) * | 1989-01-13 | 1996-03-29 | 松下電器産業株式会社 | 電子部品用接着剤 |
| JP2522549B2 (ja) * | 1989-07-19 | 1996-08-07 | シャープ株式会社 | 貼り合わせ構造 |
| US5455074A (en) * | 1992-12-29 | 1995-10-03 | Kimberly-Clark Corporation | Laminating method and products made thereby |
| JPH08339644A (ja) * | 1995-06-06 | 1996-12-24 | Hewlett Packard Co <Hp> | 剛性アクチュエータアーム構造を有するディスク装置 |
| US5783867A (en) * | 1995-11-06 | 1998-07-21 | Ford Motor Company | Repairable flip-chip undercoating assembly and method and material for same |
| JPH09176590A (ja) * | 1995-12-25 | 1997-07-08 | Sekisui Chem Co Ltd | 粘着テープ用蛍光性粘着剤 |
| US5877919A (en) * | 1996-06-07 | 1999-03-02 | Western Digital Corporation | Method and apparatus for a low-profile head-suspension attachment for a disk drive |
| US5759418A (en) * | 1996-06-14 | 1998-06-02 | International Business Machines Corporation | Adhesively attached hard disk head suspension and etching process |
| JPH103764A (ja) * | 1996-06-17 | 1998-01-06 | Fujitsu Ltd | サスペンションのアクチュエータアームへの固定方法及びアクチュエータアームアセンブリ |
| JPH1031872A (ja) * | 1996-07-18 | 1998-02-03 | Nhk Spring Co Ltd | ディスク用ヘッド支持装置 |
| US5734523A (en) * | 1996-07-24 | 1998-03-31 | Pemstar, Inc. | Conductive film connectors for use on head assemblies in drives |
| US5803835A (en) * | 1996-12-09 | 1998-09-08 | Moton; James M. | Musical hop scotch game kit |
| DE19705027C2 (de) * | 1997-02-10 | 2002-09-19 | Infineon Technologies Ag | Verfahren zum Verkleben eines Bauelements mit einer Oberfläche |
| JPH10231354A (ja) * | 1997-02-19 | 1998-09-02 | Nagase Chiba Kk | エポキシ樹脂組成物、熱硬化性樹脂フィルム及び基板に対する硬化樹脂フィルムの形成方法 |
| JPH10330717A (ja) * | 1997-05-27 | 1998-12-15 | Nippon Kayaku Co Ltd | 接着剤組成物、接着体及び液晶表示パネル |
| JP3288276B2 (ja) * | 1997-08-29 | 2002-06-04 | ティーディーケイ株式会社 | 有機el素子 |
| US6170983B1 (en) * | 1998-05-15 | 2001-01-09 | Germanow-Simon Corporation | Thermometer calibrator |
| US6021023A (en) * | 1998-06-17 | 2000-02-01 | International Business Machines Corporation | Transducer suspension system and method |
| JP2000051782A (ja) * | 1998-08-07 | 2000-02-22 | Car Mate Mfg Co Ltd | 塗布方法 |
| JP3575480B2 (ja) * | 1999-11-10 | 2004-10-13 | 日立化成工業株式会社 | 半導体用接着フィルム |
| US6704165B2 (en) * | 2001-06-08 | 2004-03-09 | Seagate Technology Llc | Attachment of a head-gimbal assembly to a printed circuit board actuator arm using Z-axis conductive adhesive film |
| JP2003317323A (ja) * | 2002-04-19 | 2003-11-07 | Matsushita Electric Ind Co Ltd | 基板の貼り合せ方法及び装置 |
| JP2004043739A (ja) * | 2002-07-15 | 2004-02-12 | Matsushita Electric Works Ltd | 積層建材の分離方法 |
| JP2004210802A (ja) * | 2002-11-14 | 2004-07-29 | Kansai Paint Co Ltd | 紫外線硬化型接着剤組成物 |
| US6869894B2 (en) * | 2002-12-20 | 2005-03-22 | General Chemical Corporation | Spin-on adhesive for temporary wafer coating and mounting to support wafer thinning and backside processing |
| JP2004331926A (ja) * | 2003-03-07 | 2004-11-25 | Sekisui Chem Co Ltd | 接着構造体及びその製造方法 |
-
2005
- 2005-06-28 US US11/168,805 patent/US20060292377A1/en not_active Abandoned
- 2005-09-29 CN CNA200510108987XA patent/CN1887998A/zh active Pending
- 2005-09-30 KR KR1020050092443A patent/KR20070000954A/ko not_active Withdrawn
- 2005-10-24 JP JP2005308026A patent/JP2007009168A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104124835A (zh) * | 2013-04-26 | 2014-10-29 | 新科实业有限公司 | 音圈马达的组装方法及组装装置 |
| RU2744431C2 (ru) * | 2016-05-19 | 2021-03-09 | Сикпа Холдинг Са | Адгезивы для сборки компонентов инертного материала |
| US11111417B2 (en) | 2016-05-19 | 2021-09-07 | Sicpa Holding Sa | Adhesives for assembling components of inert material |
Also Published As
| Publication number | Publication date |
|---|---|
| US20060292377A1 (en) | 2006-12-28 |
| KR20070000954A (ko) | 2007-01-03 |
| JP2007009168A (ja) | 2007-01-18 |
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