KR20060042871A - Surfacing type substrate transportation processing apparatus - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a floating substrate transfer processing apparatus, which is disposed above the floating stage 22 and the floating stage 22, which jet or spray and aspirate gas from the surface to float the substrate G to another height. Of the plurality of substrate holding members 24 and the floating stage 22 which detachably suction hold both sides of the resist supply nozzle 23 and the substrate G to supply the processing liquid to the surface of G). The moving mechanism for moving the slider 26 along the guide rails 25 arranged in parallel to each other on both sides and the substrate holding member 24 and the slider 26 are connected to each other and simultaneously follow the floating height of the substrate G. Provided is a technique of a floatable substrate transfer processing apparatus which is provided with a displaceable connecting means 50, which can reduce the size and simplification of the apparatus and improve the processing efficiency.

Description

Floating Substrate Transfer Processing Equipment {SURFACING TYPE SUBSTRATE TRANSPORTATION PROCESSING APPARATUS}

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic top view which shows the resist coating and developing apparatus of the glass substrate for LCD which applied the floating substrate conveyance apparatus which concerns on this invention.

It is a schematic perspective view which shows 1st Embodiment of the resist coating processing apparatus to which the said floating substrate conveyance processing apparatus was applied.

3 is a schematic cross-sectional view along a moving direction of a substrate of the resist coating apparatus.

4 is a schematic cross-sectional view along a direction to be orthogonal to the moving direction of the substrate of the resist coating processing apparatus.

It is a schematic sectional drawing which shows 1st Embodiment of the connecting means in this invention.

It is a perspective view at the time of forming the leaf | plate spring member which forms the said connecting means with 1 member.

7 is a schematic cross-sectional view showing another embodiment of the connecting means in the present invention.

8 is a schematic cross-sectional view showing still another embodiment of the connecting means in the present invention.

It is a schematic sectional drawing which shows the case where a rocking member and a balance weight are provided in another embodiment of the connecting means in this invention.

It is a schematic sectional drawing which shows the other form when the connection means in this invention is equipped with a rocking | fluctuation member and a balance weight.

10 is a schematic cross-sectional view showing still another embodiment of the connecting means in the present invention.

It is a perspective view which shows an example of the adsorption pad which forms the board | substrate holding member in this invention.

It is a schematic sectional drawing in the case of providing a bearing in another embodiment of the connecting means in this invention.

It is a schematic sectional drawing when the connection means in this invention is equipped with an air bearing.

Fig. 14 is a sectional view b along the line I-I of schematic sectional views a and a when the connecting means in the present invention includes a magnet bearing.

It is a schematic top view which shows 2nd Embodiment of the resist coating processing apparatus to which the floating substrate conveyance processing apparatus which concerns on this invention is applied.

16 is a side view of FIG. 15.

It is a schematic side view which shows the operation | movement shape of the guide pin in 2nd Embodiment.

It is a schematic side view which shows the operation shape of the modification of the said guide pin.

It is a schematic sectional drawing which shows the other form of the board | substrate holding member in this invention.

<Description of reference numerals indicating major parts>

Glass substrate for G LCD (to-be-processed substrate) 22 Floating stage

23 Resist supply nozzle (Process liquid supply means) 24 Substrate holding member

25 Guide rail 26 slider

27 linear motors (moving mechanism)

50 50A 50B 50C 50D 50E 50F 50G Connection Means

51 Leaf spring member 52 Female member

52a 52b 52c hinge pin

53) Return Spring (Spring Member)

54 54A Balance weight 54a Threaded portion

55 55A rocking member 55a female thread

56 Link member 57 Electromagnet

60 adsorption pad 60A electrostatic pad

70 guide pin

72 Horizontal cylinder (horizontal movement means for positioning)

73 vertical cylinders (vertical vehicle)

100 Support member 101 Cylindrical bearing

102 lifting shaft 200 gas supply means

201 202 O-Ring 203 Gas Supply Port

TECHNICAL FIELD This invention relates to the floating-type substrate conveyance processing apparatus which supplies a process liquid, for example, a resist liquid, and performs a process to a to-be-processed substrate, such as a glass substrate for LCDs, for example.

In general, in the manufacturing process of a semiconductor device, a resist liquid is applied to a glass substrate for LCD (hereinafter referred to as a substrate) as a substrate to be processed to form a resist film, and a circuit pattern is reduced using a photolithography technique to transfer the resist film. A series of treatments are performed to develop and remove the resist film from the substrate thereafter.

For example, as a method of forming a resist film, a resist supply nozzle for discharging a resist liquid formed by dissolving a photosensitive resin in a solvent and a spherical substrate are relatively coated in a direction perpendicular to the ejection direction of the resist and applied for coating treatment. Methods are known (see, eg, patent document l).

In this manner, a resist film can be formed on the entire surface of a spherical substrate in order to discharge (supply) the resist liquid from one side to the other side of the substrate in a band shape.

[Patent Document 1] Japanese Unexamined Patent Publication No. 10-156255 (Patent Claim 1)

However, in the technique described in Japanese Patent Laid-Open No. 10-156255, the apparatus is large because it has a structure in which at least one of the resist supply nozzles that are temporarily placed on the substrate or the stage for holding the substrate in a horizontal position is moved. At the same time, there is a problem that huge energy is required for movement of a resist supply nozzle or a stage, which becomes complicated and increases in weight. In addition, there is a problem that the treatment efficiency is lowered because the resist supply nozzle or stage, which has a large weight, is moved back to its original position after the treatment and moved again to perform the treatment.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a floating substrate transfer processing apparatus capable of miniaturizing and simplifying the apparatus and improving processing efficiency.

In order to solve the above problems, the invention described in claim 1 is provided on the surface of the substrate to be disposed above the floating stage and the floating stage which injects or injects and aspirates gas from the surface to float the substrate to a different height. A slider is provided along a plurality of substrate holding members for detachably sucking and holding the processing liquid supplying means for supplying the liquid in a strip shape, and both sides of the substrate to be detachably detached, and guide rails disposed in parallel to both sides of the floating stage. And a connecting means for connecting the moving mechanism, the substrate holding member, and the slider, and simultaneously displacing the floating height of the substrate to be processed.                         

In addition to the invention of claim 1, the invention of claim 2 is further provided with a vertically movable guide pin which is connected to the slider and deviates from front and rear edges of the movement direction of the substrate to be processed.

In the present invention, the connecting means connects the substrate holding member and the slider and simultaneously displaces the floating height of the substrate to be processed, and may be formed in any structure, for example, by a plate spring member (claim 3). A structure having a counterweight on the side opposite to the substrate holding portion in the rocking member formed by the arm member which is pushed to the slider with rocking material (claim 5) or the middle portion being rocked to the slider with rocking material. (Claim 7).

In this case, when the connecting means is formed by the leaf spring member, the leaf spring member is arranged in a line with the holding portion for holding the plurality of substrate holding members continuously in the moving direction of the substrate to be processed, and arranged at a distance from the holding portion and the slider. It may be provided with a connecting portion having flexibility to connect (claim 4).

In the case where the connecting means is formed by the arm member to be pulled by the swinging material on the slider, a spring member having a spring force that acts against the holding force of the substrate holding member may be further mounted on the extraction portion of the arm member (claim 6). ).

In the case where the connecting means is constituted by the swinging member and the balance weight, the balance weight may be screwed to the end of the swinging member on the side opposite to the substrate holding part side so as to be able to move forward and backward (claim 8).

In addition, the connecting means is formed by a substantially bell crank-shaped link member which is pushed to the slider as a swinging material, and at the same time, the substrate holding member is attracted to the vertical piece of the link member and the opposite surface of the slider by excitation. It is also possible to provide an electromagnet that generates a repulsive force smaller than the holding force (claim 9).

Further, the connecting means may be connected to the lower end of the support member having a cylindrical bearing at the other end and the board retaining member at the other end thereof, and a lifting shaft inserted into the cylindrical bearing as a sliding material may be provided (claim 10). In addition, the connecting means is connected to the lower end of the support member having a cylindrical bearing at the other end of the slider and the substrate holding member and inserted into the cylindrical bearing and inserted into the cylindrical bearing, and there is a regret in the porous bush. A gas supply means for supplying a gas between the porous bush and the lifting shaft via the lifting shaft inserted into the shape and the cylindrical bearing may be provided (claim 1l). Alternatively, the connecting means is connected to the lower end of the supporting member and the substrate holding member having one end connected to the slider and having the cylindrical bearing at the other end, and the lifting shaft inserted into the cylindrical bearing of the supporting member and the inner surface and the lifting shaft of the cylindrical bearing. It is also possible to have a magnet body mounted on the outer surface to promote magnetic attraction force (claim 12).

In addition, in the case where the guide pins are mounted on the front and rear edges of the movement direction of the substrate to be processed, the vertical movement means for moving the guide pins in the vertical direction, and the horizontal movement for positioning for moving the guide pins and the vertical movement means in the horizontal direction. It is preferable to further provide a means (claim 13).

Best Mode for Carrying Out the Invention Best embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Here, the case where the floating substrate conveyance processing apparatus which concerns on this invention is applied to the resist coating processing apparatus in the resist coating and developing apparatus of the glass substrate for LCD is demonstrated.

As shown in Fig. 1, the resist coating and developing apparatus 1 carries out a loading / unloading portion 1 on which a cassette C for accommodating a plurality of glass substrates G (hereinafter referred to as substrate G), which is a plurality of substrates to be processed, is placed. ) And an interface unit for carrying the substrate G between the processing unit 2 and the exposure apparatus 4 having a plurality of processing units for applying a series of processings including resist coating and development to the substrate G. (3), the carry-in / out part 1 and the interface part 3 are arrange | positioned at the both ends of the process part 2, respectively. In Fig. 1, the direction in which the long direction of the resist coating and developing apparatus is orthogonal to the X direction in the X-direction plane is set as the Y direction.

The carry-in / out part 1 is equipped with the conveyance mechanism 5 for carrying in / out of the board | substrate G between the cassette C and the process part 2, and the cassette with respect to the exterior in this carry-in / out part 1 is carried out. Import and export of (C). Moreover, the conveyance mechanism 5 can move on the conveyance path 6 provided along the Y direction which is the arrangement direction of the cassette C with the conveyance arm 5a, and the cassette C and the process part by the conveyance arm 5a. It is comprised so that the board | substrate G may carry in / out between (2).

The processing part 2 is basically a parallel two-line transfer line A for transporting the substrate G growing in the X direction; A scrub cleaning processing unit (SCR) 11 having a B and carrying the line A from the loading / unloading unit 1 side toward the interface unit 3, the first thermal processing unit section 16, the resist processing unit 13 And a second thermal processing unit section 17 is arranged. The second thermal processing unit section 17 developing processing unit (DEV, 14) and i-ray UV irradiation unit (i-UV, 15) from the interface part 3 side toward the loading-in / out part 1 along the conveying line B. And a third thermal processing unit 18 are arranged. In addition, an excimer UV irradiation unit (e-UV) 12 is provided on a part of the scrub cleaning processing unit SCR 11. In this case, the excimer UV irradiation unit (e-UV) 12 is provided in order to remove organic matter from the substrate G prior to scrubber cleaning. Moreover, i-ray UV irradiation unit (i-UV) 15 is provided in order to perform the decolorization process of image development.

The first thermal processing unit section 16 also has two thermal processing unit blocks (TB, 31; 32) formed by stacking thermal processing units that apply thermal processing to a substrate (G), and thermal processing unit blocks (TB). And 31) are provided on the scrub cleaning processing unit (SCR) 11 side, and the thermal processing unit blocks TB, 32 are provided on the resist processing unit 13 side. The 1st conveyance mechanism 33 is provided between these two thermal processing unit blocks TB, 31;

The second thermal processing unit section 17 also has two thermal processing unit blocks (TB, 34; 35) formed by stacking thermal processing units that apply thermal processing to the substrate G, and thermal processing unit blocks (TB). , 34 are provided on the resist processing unit 13 side, and the thermal processing unit blocks TB, 35 are provided on the developing processing unit 14 side. The second conveyance mechanism 36 is provided between these two thermal processing unit blocks TB, 34;

The third thermal processing unit section 18 also has two thermal processing unit blocks (TB, 37; 38) formed by stacking thermal processing units that apply thermal processing to the substrate G, and thermal processing unit blocks (TB). And 37) are installed on the development processing unit DEV 14 and the thermal processing unit blocks TB, 38 are installed on the cassette station 1 side. And the 3rd conveyance mechanism 39 is provided between these two thermal processing unit blocks TB, 37; 38.

In addition, the interface unit 3 includes an external device block 42, a buffer stage BUF, 43 having an extension cooling stage (EXT COL, 41), a peripheral exposure device EE, and a title TITLER formed by stacking them. The 4th conveyance mechanism 44 is arrange | positioned.

In the interface part 3 comprised in this way, the board | substrate G conveyed by the 2nd conveyance mechanism 36 is conveyed to the extension cooling stage EXT COL 41, and the 4th conveyance mechanism 44 is carried out. Is conveyed to the peripheral exposure apparatus EE of the external device block 42 and exposed for removal of the peripheral resist, and then conveyed to the exposure apparatus 4 by the 4th conveyance mechanism 44, and the board | substrate G The resist film on) is exposed and a predetermined pattern is formed. In some cases, the substrate G is accommodated in the buffer stage BUF, 43 and then conveyed to the exposure apparatus 4. After the exposure is completed, the substrate G is loaded into the title TITLER of the external device block 42 by the fourth transfer mechanism 44, and predetermined information is recorded on the substrate G. Then, the extension / cooling stage ( It is arrange | positioned so that it may be mounted in EXT COL 41 and conveyed to the process part 2 again.

The resist processing unit 13 depressurizes the resist coating processing apparatus 20 to which the floating substrate transfer processing apparatus according to the present invention is applied, and the resist film formed on the substrate G by the resist coating processing apparatus 20. The pressure reduction drying apparatus (VD) 21 which carries out pressure reduction drying in a container (not shown) is provided.

Next, the resist coating apparatus 20 to which the floating substrate transfer processing apparatus which concerns on this invention is applied is demonstrated.

FIG. 2 is a schematic perspective view showing the main part of the first embodiment of the resist coating apparatus 20, and FIG. 3 shows a state in which the resist liquid is supplied (discharged) to the substrate G by the resist coating apparatus 20. FIG. It is a schematic sectional drawing along the moving direction of the board | substrate G shown, and FIG. 4 is a schematic sectional drawing along the direction orthogonal to the moving direction of the board | substrate G. As shown in FIG.

The resist coating apparatus 20 is disposed above the floating stage 22 and the floating stage 22 which jets or sprays and sucks gas from the surface to raise the substrate G to another height. A plurality of substrate holding members for detachably suction holding and holding the resist supply nozzles 23, which are the processing liquid supply means for supplying the resist liquid R, which is the processing liquid, to the surface of the strip in a band shape, respectively ( Connects the moving mechanism 27 and the substrate holding member 24 and the slider 26 to move the slider 26 along the guide rail 25 disposed in parallel to both sides of the 24 and the floating stage 22. At the same time, it is mainly composed of a connecting means 50 that can follow the floating height of the substrate G and be displaceable.

In this case, the floating stage 22 is loaded with a plurality of liftable lifters 28a which can be lifted and received, for example, a substrate G carried by a carrier arm (not shown) as shown in FIGS. 2 and 3. A plurality of lifting and lowering examples of exchanging and exchanging the application region 22b and the substrate G for maintaining the distance between the region 22a, the resist supply nozzle 23, and the substrate G at a constant distance, for example, 100 to 150 μm. The carry-out area | region 22c provided with four lift pins 28b is provided. In the carry-in area | region 22a and the carry-out area | region 22c, gas, for example, air is injected from the several injection hole 29a provided in the surface of the floating stage 22, and the board | substrate G raises the height of about 100-150 micrometers. To the position of. In the application region 22b, a plurality of injection holes 29a and suction holes 29b are provided in a zigzag shape on the surface of the floating stage 22, for example, to inject gas, or air, from the injection holes 29a. At the same time, by sucking from the suction hole 29b, the substrate G is raised to a position of about 50 mu m in height. Moreover, the joint area | region 22d, 22e which connects the gap of both heights is provided between the loading area | region 22a and the application | coating area | region 22b, and between application | coating area | region 22b and carrying-out area | region 22c, respectively. In these joint areas 22d and 22e, many injection hole names 29a and suction holes 29b are provided so that the substrate G may be gradually lowered or raised by adjusting the injection amount and suction amount of air, which is gas. It is composed.

The resist supply nozzle 23 fixes the resist liquid R supplied by a supply pipe 23a which is fixed to a sentence frame (not shown) beyond the upper side of the floating stage 22 and connected to a resist tank (not shown). It is comprised so that it may supply (ejection dripping) to the surface of the board | substrate G in strip shape.

The substrate holding member 24 includes a plurality of suction pads 60 for detachably sucking and holding both side ends of the substrate G, and a suction tube for connecting each suction pad 60 with a vacuum device (not shown). 61). In this case, as shown in Fig. 11, the suction pad 60 is formed by providing a plurality of elongated suction holes 60b on the upper surface of the pad body 60a made of synthetic rubber, for example. The suction hole 60b may be replaced with a long hole to form a small hole. In addition, the vacuum tube 61 connected to the seal (not shown) provided in the pad main body 60a is formed by the strip | belt-shaped tube of synthetic rubber which has several channel | path 60c. As shown in FIG. 5, the vacuum tube 61 formed as described above is slidably extracted in the vertical direction via the hinge 62 on the upper portion of the slider 26 constituting the movement mechanism 27. By such a configuration, the support tube 61 can also be displaced following the displacement of the substrate holding member 24, that is, the suction pad 60. In addition, the vacuum pipe 61 connected to each suction pad 60 is connected to the vacuum apparatus via a common main vacuum pipe (not shown).

The movement mechanism 27 is formed by a linear motor which moves the slider 26 mounted by sliding material on the guide rail 25 arrange | positioned in parallel with each other to the both sides of the floating stage 22. As shown in FIG.

On the other hand, the connecting means 50 is connected to the suction pad 60 and the slider 26 of the substrate holding member 24 and at the same time by the leaf spring member 51 which can be displaced following the floating height of the substrate G. It is being formed. In this case, the spring constant is set so that the leaf spring member 51 has a spring force (carbon force) that is weaker than the holding force for holding the substrate G, that is, the suction force of the suction pad 60. . In this way, the plate spring member 51 sets the spring constant so as to follow the floating height of the substrate G while maintaining the holding force (adsorption force) of the substrate G by the substrate holding member 24, and thereby retaining the substrate. The member 24 can be displaced.

Although the leaf spring member 51 is not a hindrance as a plurality of members connecting the respective suction pads 60 and the sliders 26, it is preferable that the leaf spring member 51 is formed by one member. That is, as shown in FIG. 6, the space | interval is mutually provided through the holding | maintenance part 51a and the groove | channel 51b which hold | maintain the adsorption pad 60 of the several board | substrate holding member 24 continuously in the moving direction of the board | substrate G. As shown in FIG. It is preferable to form it as one member which is provided in a line and is provided with the connection part 51c which has the flexibility which connects the holding part 51a and the slider 26. As shown in FIG. Thus, by forming the leaf spring member 51 by one member, the rigidity of the conveyance direction of the board | substrate G in the connection means 50 can be ensured, and the board | substrate G can be conveyed more reliably.

Next, the operation mode of the resist coating apparatus 20 comprised as mentioned above is demonstrated. First, when the substrate G heat-treated by the thermal processing units TB and 32 is loaded onto the carry-in region 22a of the floating stage 22 by a transfer arm (not shown), the lift 28a is raised to raise the substrate G. Receive) The conveying arm then retracts outward onto the floating stage 22. After receiving the substrate G, the lift pin 28a is lowered while the substrate G is lifted to a position of about 100 to 150 占 퐉 by air blowing out from the surface of the loading area 22a, and in this state. The vacuum device operates to adsorb and hold the substrate G by the suction pad 60 of the substrate holding member 24. At this time, the plate spring member 51 absorbs the gap between the floating height of the substrate G and the height of the slider 26, so that the substrate G is about 100 to 150 μm on the loading area 22a of the floating stage 22. It is kept in a horizontal state at the position of the height.

Then, the linear motor 27 (moving mechanism) is driven and the board | substrate G is conveyed to the application | coating area | region 22b. In the application | coating area | region 22b, the board | substrate G is floated to the position of the height of about 50 micrometers by the balance of the blowing of air and suction from the surface of the floating stage 22. As shown in FIG. At this time, the plate spring member 51 absorbs the gap between the floating height of the substrate G and the height of the slider 26, so that the substrate G has a height of about 50 μm on the application area 22b of the floating stage 22. It is maintained in the horizontal state at the position of to maintain a predetermined interval (S, 100-150 μm) between the resist supply nozzles 23. In this state, a resist film is uniformly formed on the surface of the substrate G by feeding (ejecting) the resist liquid R in a band shape from the resist supply nozzle 23 and moving the substrate G.

When the substrate G on which the resist film is formed is moved to the carrying out region 22c, the substrate G is floated to a position having a height of about 100 to 150 µm by air blowing out from the surface of the carrying out region 22c, and is vacuumed in this state. The apparatus is stopped and the suction holding of the substrate G is released. As a result, the lift pin 28b is raised to move the substrate G to the upper and lower positions. The conveyance arm which is not shown in this state receives the board | substrate G, and conveys the board | substrate G to the pressure reduction drying apparatus VD and 21 of the next process.

7 is a cross-sectional view showing another embodiment of the connecting means 50A in the present invention. In FIG. 7, the connecting means 50A is formed by the arm member 52 which is extracted by the swinging material on the slider 26. That is, it is the case where the adsorption pad 60 of the board | substrate holding member 24 is connected to the other end of the arm member 52 with which one end is pushed by the rocking material in the vertical direction via the hinge pin 52a to the slider 26. As shown in FIG. In addition, the shape of the arm member 52 may be arbitrarily good, for example, either a rod shape or a plate shape may be sufficient.

In such a configuration, the arm member 52 follows and displaces the gap between the floating height position of the substrate G and the height position of the slider 26, so that the floating height of the substrate G can be maintained at a predetermined position.

In addition, a spring member, for example, a turn spring 53, may be attached to the extraction portion of the arm member 52 to form the connecting means 50B. That is, as shown in FIG. 8, the connecting means 50B is formed by the arm member 52 which is pushed to the slider 26 as the swinging material, and at the same time, the substrate holding member 24 A spring member having a spring force acting against holding force, for example, a turn spring 53 may be mounted.

In addition, in the embodiment shown to FIG. 7 and FIG. 8, since the other part is the same as 1st embodiment, the same code | symbol is attached | subjected to the same part, and description is abbreviate | omitted.

9A is a cross-sectional view showing still another embodiment of the connecting means 50C in the present invention. In FIG. 9A, the connecting means 50C is formed of a rocking member 55 having an intermediate portion extracted with a rocking material on the slider 26 and having a counterweight 54 on the side opposite to the substrate holding portion side. That is, the intermediate portion of the swinging member 55 having the suction pad 60 of the substrate holding member 24 connected to one end and having the balance weight 54 at the other end thereof is perpendicular to the slider 26 via the hinge pin 52b. This is the case when it is extracted with rocking material in the direction.

In this configuration, the balance weight 54 acts in the adsorption holding state of the substrate G so that the swinging member 55 follows the gap between the floating height position of the substrate G and the height position of the slider 26. Because of this displacement, the floating height of the substrate G can be maintained at a predetermined position.

In addition, in the above description, the case where the rocking member 55 and the balance weight 54 are integrally formed was described, but the rocking member 55A and the balance weight 54A may be formed separately. That is, as shown in Fig. 9B, the end opposite to the suction pad 60 side in the swinging member 55A which is slidably extracted by the hinge pin 52b to the bracket 26a protruding from the upper surface of the slider 26, as shown in Fig. 9B. The female screw portion 55A may be provided in the female screw portion 55A, and the screw portion 54A protruding from the balance weight 54A may be screwed to form the balance weight 54A. Further, the lock nut 54b is screwed into the screw portion 54A. The mounting position of the balance weight 54A is fixed by pressing the lock nut 54b against the end face of the swinging member 55A.

As described above, the balance weight 54A is screwed on the opposite side to the adsorption pad 60 side of the swinging member 55A so as to be retractable so as to affect the lift height of the substrate G defined in the floating stage 22. The load applied to the substrate G from the adsorption pad 60 can be adjusted so as not to affect the temperature.

In addition, in the embodiment shown to FIG. 9A and FIG. 9B, since the other part is the same as 1st Embodiment, the same code | symbol is attached | subjected to the same part, and description is abbreviate | omitted.

10 is a cross-sectional view showing still another embodiment of the connecting means 50D in the present invention. In Fig. 10, the connecting means 50D is formed by a substantially bell-crank link member 56 which is pushed out of the swinging material in the vertical direction via the hinge pin 52c on the slider 26 and at the same time the link member 56 The electromagnet 57 which produces a repulsion force smaller than the adsorption holding force of the board | substrate holding member 24 (adsorption pad 60) by an excitation is provided in the opposing surface of the vertical piece 56a of the ()) and the slider 26. As shown in FIG. In this case, when the electromagnet 57 is excited, the repelling force is generated in the electromagnet 57, and the adsorption pad 60 rises. When the electromagnet 57 is non-excited, the electromagnets 57 adsorb to each other and the adsorption pad. The 60 is configured to descend. Further, the link member 56 may be formed of a spring member. By forming the link member 56 by the spring member, a weak (small) spring constant can be obtained, so that the floating height of the substrate G can be maintained more accurately.

When the electromagnet 57 is excited when the adsorption pad 60 of the board | substrate holding member 24 attracts and holds the board | substrate G by the structure mentioned above, a repulsion force will arise in the electromagnet 57, and the adsorption pad 60 will be carried out. ) Rises to hold the substrate G. When conveying the board | substrate G in this state, the repulsive force of the electromagnet 57 acts and the adsorption pad 60 tracks and displaces with respect to the gap of the floating position of the board | substrate G, and the height position of the slider 26, and a board | substrate The floating height of (G) can be kept at a predetermined position.

In addition, in the embodiment shown in FIG. 10, since the other part is the same as 1st Embodiment, the same code | symbol is attached | subjected to the same part, and description is abbreviate | omitted.

12 is a cross-sectional view showing still another embodiment of the connecting means 50E in the present invention. In Fig. 12, the connecting means 50E is connected to the support member 100 having the cylindrical bearing 101 at one end thereof to the slider 26 and to the lower portion of the suction pad 60 at the other end thereof, so that the connecting member 50E is connected to the slider 26 in the cylindrical bearing 101. It is formed by the bearing provided with the lifting shaft 102 inserted into the sliding material. In this case, it is preferable to make the weight of the lifting shaft 102 as small as possible.

In this way, the connecting means 50E is inserted into the cylindrical bearing 101 provided at the end of the support member 100 connected to the slider 26 and the swinging material in the cylindrical bearing 101, thereby forming a telescope shape. The lifting shaft 102 follows the gap between the floating height position of the substrate G and the height position of the slider 26 by being formed by a bearing composed of the lifting shaft 102 that moves (elevates) to the displacement. Therefore, the floating height of the board | substrate G can be maintained in a predetermined position.

In addition, in the connecting means 50E, it is necessary to adjust the injection amount of the air injected from the floating stage 22 in consideration of the weight of the lifting shaft 102.

It is sectional drawing which shows still another embodiment of the connection means 50F in this invention. In Fig. 13, the connecting means 50F is spaced apart from the cylindrical bearing 101, the cylindrical porous bush 204 inserted into the cylindrical bearing 101, and in the porous bush 204 with a regrettable shape or a space therebetween. Gas supply means 200 for supplying gas, for example air, to form an air layer between the porous bush 204 and the lifting shaft 102 via the lifting shaft 102 and the cylindrical bearing 101 to be inserted. It is formed by the air bearing provided with. In this case, O-rings 201 and 202 pressed against the inner surface of the cylindrical bearing 101 are cast at two upper and lower points of the porous bush 204 to maintain the sealability of the air supplied. Moreover, the air supply port 203 which comprises the gas supply means 200 is provided between the both O-rings 201 and 202 in the cylindrical bearing 101, and the air supplied from the air supply source which is not shown in FIG. By supplying between 201 and 202, air starts to blow from the inner diameter pole of the porous bush 204, and the frictional resistance of vibration is reduced up and down of the lifting shaft 102 to secure the followability of the lifting shaft 102 to the substrate G. You can do it. Therefore, the conveyance of the board | substrate G can be stabilized. Also in this case, it is preferable to make the weight of the lifting shaft 102 as small as possible.

In addition, by forming the connecting means 50F by the air bearing as described above, the frictional resistance of the vibration is reduced up and down of the lifting shaft 102 to rise in a state in which the followability of the lifting shaft 102 to the substrate G is secured. Since the injection amount of the air injected from the stage 22 can be set, the floating height of the board | substrate G can be maintained at a predetermined position with high precision.

When a part of the connecting means 50F is formed by an air bearing, the stopper piece 103 is raised and raised inward toward the upper passage side of the cylindrical bearing 101 as shown by the two-dot chain line in FIG. 13. The lifting shaft 102 is raised by the air pressure by protruding the projection 104 engageable to the stopper piece 103 on the shaft 102, and the lifting shaft 102 is in a state where the stopper piece 103 and the projection 104 are engaged. The upper limit position of) can be regulated. Thereby, the adhesiveness of the board | substrate G and the suction pad 60 at the time of board | substrate adsorption holding can be aimed at.

Fig. 14 is a sectional view showing still another embodiment of the connecting means 50G in the present invention. In Fig. 14, the connecting means 50G has a magnet bearing in place of the bearing air bearing. In other words, the connecting means 50G is opposed to the first magnet body 301 and the outer surface of the elevating shaft 102, on which the inner surface of the cylindrical bearing 101 is mounted in the form of a four-pole spline having the same polarity. And a second magnet body 302 formed in the same pole and mounted in a four-pole spline shape for promoting magnetic attraction between the first magnet body 301.

By forming a part of the connecting means 50G by the magnet bearing as described above, the magnetic attraction force is promoted between the first magnet body 301 and the second magnet body 302 so that the weight of the lifting shaft 102 is increased. Canceled to zero gravity. Therefore, since the injection amount of the air injected from the floating stage 22 can be set without considering the weight of the lifting shaft 102, the floating height of the substrate G can be maintained at a predetermined position with high accuracy.

The magnets of the first magnet body 301 and the second magnet body 302 may be formed of an electromagnet so that the magnetic attraction force can be adjusted.

FIG. 15 is a schematic plan view showing an example of a second embodiment of a resist coating processing apparatus to which the floating substrate transfer processing apparatus according to the present invention is applied, FIG. 16 is a side view of FIG. 15, and FIG. 17 is a guide in the second embodiment. It is a schematic side view which shows a pin.

The second embodiment is constituted in the same manner as the resist coating apparatus of the first embodiment, and also includes a vertically movable guide pin 70 connected to the slider 26 and entrained on the front and rear edges of the movement direction of the substrate G. Moreover, it is a case where it is made to prevent inadvertent movement (deviation) of the board | substrate G by the acceleration at the time of conveyance start and stop of the board | substrate G. Here, the same reference numerals are given to the same parts as in the first embodiment, and description is omitted.

In the second embodiment, the retaining bracket 71 protrudes from the front-rear end of the movement direction of the two sliders 26 toward the inner side, and the horizontal cylinder 72 as the horizontal moving means for positioning is placed on the retaining bracket 71. Tact is fixed. In addition, a vertical cylinder 73, which is a vertical movement means, is connected to the piston rod 72a of the horizontal cylinder 72, and a guide pin 70 extends on the tip side of the piston rod 73a of the vertical cylinder 73. have.

According to the resist coating apparatus of 2nd Embodiment comprised in this way, as shown in FIG. 17A, the lift pin (not shown) is carried in the board | substrate G to the upper side of the floating stage 22 by the conveyance arm which is not shown in figure. ), The vertical cylinder 73 is first actuated to raise the guide pin 70 (see FIG. 17B). Then, the horizontal cylinder 72 is operated so that the guide pin 70 abuts the front and rear edges of the movement direction of the substrate G to position (align) the movement direction side of the substrate G (Fig. 17C). Reference). In this case, it is preferable to place the tip surface of the guide pin 70 and the surface of the substrate G on substantially the same surface so that the tip portion of the guide pin 70 does not interfere with the resist supply nozzle 23.

In addition, when the guide pin 70 has only a function of preventing the difference of the substrate G due to the acceleration at the time of starting and stopping the transfer of the substrate G, the guide pins at either front and rear ends of the substrate G ( 70) may be raised.

In addition, the positioning (alignment) of the direction (Y direction) orthogonal to the moving direction (X direction) of the board | substrate G is the pinstone of the horizontal cylinder 81 mounted in the vicinity of the both ends of the moving direction of both sliders 26. As shown in FIG. It is positioned by the guide pin 80 movable in the Y direction extending on the tip side of the piston rod 82a of the vertical cylinder 82 connected to the rod 81a.

When the substrate G is moved in a state where the guide pin 70 is brought into contact with the front and rear edges of the substrate G as described above, carelessness of the substrate G due to the acceleration at the time of starting and stopping the transfer of the substrate G is caused. One shift can be prevented. Therefore, the acceleration parameter can be afforded and the processing precision can be maintained. In addition, the number of substrate holding members 24 (adsorption pads 60) can be reduced, and the holding power of the substrate can be reduced, so that the structural members can be reduced and the apparatus can be downsized.

In addition, although the case where the connecting means 50 formed by the leaf | plate spring member 51 was used was demonstrated in FIG. 15, of course, you may use other connecting means 50A-50G.

In addition to the second embodiment, it is also possible to give the guide pin 70 a lift pin function. For example, when the support pin 90 protrudes in the horizontal direction in the middle part of the guide pin 70, the board | substrate G can be handed over by the lifting operation of the guide pin 70. That is, when the board | substrate G is carried in the upper part of the floating stage 22 as shown in FIG. 18A, first, the guide pin 70 is moved horizontally and abuts on the edge of the board | substrate G (refer FIG. 18B). Next, the guide pin 70 is raised to support the lower surface of the substrate G by the support pin 90 to receive the substrate G (see FIG. 8C). Next, after the substrate G is held by the adsorption pad 60, the guide pin 70 is lowered to release the support pin 90 to guide the guide pin 70 to the front and rear edges of the substrate G. The substrate G is moved in the contacted state (see FIG. 18 (d)). In the case of receiving the processed substrate G moved to the carry-out area 22c to the transfer arm, the above-described operation can be performed to carry out the substrate G from the resist coating processing apparatus 20.

<Other embodiments>

In the said embodiment, although the case where the board | substrate holding member 24 was formed by the adsorption pad 60 was demonstrated, it is also possible to use the electrostatic pad 60A as shown in FIG. 19 instead of the adsorption pad 60. The electrostatic pad 60A applies a voltage to the metal electrode 60d provided therein to generate positive and negative charges on the surface of the substrate G and the electrostatic pad 60A, and the substrate is moved by a sensen-Labeck force that has moved in the meantime. (G) is to hold adsorption. In addition, although the monopolar electrostatic pad 60A has been described in FIG. 9, a plurality of (for example, two) electrodes 60d are provided inside the electrostatic pad to provide a potential difference between the electrodes 60d to form the substrate G. It is also possible to use a bipolar electrostatic pad for adsorption holding.

Moreover, although the said embodiment demonstrated the case where the floating substrate conveyance processing apparatus which concerns on this invention was applied to the resist coating processing apparatus, it can of course apply to apparatuses other than a resist coating processing apparatus, for example, a developing processing apparatus. .

(1) According to the invention of Claims 1, 3 to 12, the both ends of the substrate to be floated on the floating stage are held and held by the substrate holding member so that the connecting means follows the height of the floating substrate. The processing liquid can be supplied in a strip form from the processing liquid supplying means while moving to the lower portion of the processing liquid supplying means to perform the processing. Therefore, even if the floating height of the substrate to be processed and the height between the sliders fluctuate, the processing can be carried out by conveying the substrate between the substrate to be processed and the processing liquid supplying means at a predetermined interval. In addition, since the floated substrate is conveyed, the size of the apparatus can be simplified and the processing efficiency can be improved.

(2) According to the invention of claim 2, in addition to the above (1), a vertically movable guide pin which rests on the front and rear edges of the movement direction of the substrate is further provided. Inadvertent movement of the substrate to be processed due to acceleration can be prevented. Therefore, the acceleration parameter can be afforded and the processing precision can be maintained. In addition, the number of substrate holding members can be reduced, and the board holding force can be reduced, so that the member can be reduced and the apparatus can be downsized.

(3) The leaf spring member constituting the connecting means according to the invention of claim 4 is arranged so as to be spaced apart from the holding portions holding the plurality of substrate holding members continuously in the moving direction of the substrate. Since the connection part which has flexibility to connect is provided, rigidity of the conveyance direction in a connection means can be ensured, and a to-be-processed board | substrate can be conveyed more reliably.

(4) According to the invention of claim 13, further comprising vertical moving means for moving the guide pins in the vertical direction and horizontal moving means for positioning the guide pins and the vertical moving means in the horizontal direction. In addition, since the processing target substrate can be further positioned, processing accuracy can be improved.

Claims (13)

Floating stages that spray or inject and aspirate gases from the surface to float the substrate to a different height Processing liquid supply means disposed above the floating stage and supplying the processing liquid to the surface of the substrate to be processed in a band shape; A plurality of substrate holding members for sucking and holding each side end of the substrate to be detached, respectively; A moving mechanism for moving the slider along guide rails disposed in parallel with each other on both sides of the floating stage; And a connecting means that connects the substrate holding member and the slider and is displaceable to follow the floating height of the substrate to be processed. A floating stage that injects or injects and aspirates gas from the surface to float the substrate to a different height, Processing liquid supplying means arranged above the floating stage and supplying the processing liquid to the surface of the substrate to be processed in a band shape; A plurality of substrate holding members for sucking and holding each side end of the substrate to be detached, respectively; A moving mechanism for moving the slider along guide rails disposed in parallel with each other on both sides of the floating stage; Connecting means capable of connecting the substrate holding member and the slider and simultaneously displacing the floating height of the substrate to be processed; And a vertically movable guide pin connected to the slider and retaining on front and rear edges of the movement direction of the substrate to be processed. In the floating substrate transfer processing apparatus according to claim 1 or 2, The floating substrate conveyance processing apparatus characterized by forming the said connection means by the leaf | plate spring member. In the floating substrate transfer processing apparatus according to claim 3, The leaf spring member is provided with a connecting portion having a flexible connection between the holding portion and the slider, which are arranged at a distance from each other and holding portions holding the plurality of substrate holding members continuously in the moving direction of the substrate to be processed. Floating substrate conveyance processing apparatus characterized by the above-mentioned. In the floating substrate transfer processing apparatus according to claim 1 or 2, Floating substrate conveyance processing apparatus, characterized in that the connecting means is formed by a female member that is extracted with a swinging material on the slider. In the floating substrate transfer processing apparatus according to claim 1 or 2, And a spring member having a spring force acting against the holding force of the substrate holding member while forming the connecting means by the arm member to be pulled to the slider as a swinging material. Common sense substrate conveyance processing apparatus. In the floating substrate transfer processing apparatus according to claim 1 or 2, The said connecting means is a floating substrate conveyance processing apparatus characterized by including the balance weight on the opposite side to the board | substrate holding part side in the rocking member by which the intermediate part is extracted by the rocking material to a slider. In the floating substrate transfer processing apparatus according to claim 7, Floating substrate conveyance processing apparatus, characterized in that the balance weight is screwed to the end of the swinging member in a retractable manner. In the floating substrate transfer processing apparatus according to claim 1 or 2, The connecting means is formed by an approximately bell crank-shaped link member which is pushed to the slider as a swinging material and at the same time, the suction holding force of the substrate holding member by excitation to the vertical piece of the link member and the opposing surface of the slider. Floating substrate conveyance processing apparatus comprising an electromagnet generating a smaller repulsive force. In the floating substrate transfer processing apparatus according to claim 1 or 2, The connecting means includes a support member having one end connected to the slider and having a cylindrical bearing at the other end thereof, and a lifting shaft connected to a lower portion of the substrate holding member and inserted into the cylindrical bearing of the support member as a sliding material. Common sense substrate conveyance processing apparatus. In the floating substrate transfer processing apparatus according to claim 1 or 2, The connecting means is connected to the support member having a cylindrical bearing at one end thereof and connected to the lower part of the substrate holding member and inserted into the cylindrical bearing and inserted into the cylindrical bearing, and relieved in the porous bush. And a gas supply means for supplying gas between the porous bush and the lifting shaft via the lifting shaft inserted into the shape and the cylindrical bearing. In the floating substrate transfer processing apparatus according to claim 1 or 2, The connecting means includes a support shaft having one end connected to the slider and having a cylindrical bearing at the other end and a lower portion of the substrate holding member and inserted into the cylindrical bearing of the support member. A floating substrate transfer processing apparatus comprising a magnet body mounted on an outer surface to promote magnetic attraction force. In the floating substrate transfer processing apparatus according to claim 2, And a vertical moving means for moving said guide pin in a vertical direction and a horizontal moving means for positioning said guide pin and a vertical moving means in a horizontal direction.

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