JP2017051885A - Coating device - Google Patents

Coating device Download PDF

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JP2017051885A
JP2017051885A JP2015175902A JP2015175902A JP2017051885A JP 2017051885 A JP2017051885 A JP 2017051885A JP 2015175902 A JP2015175902 A JP 2015175902A JP 2015175902 A JP2015175902 A JP 2015175902A JP 2017051885 A JP2017051885 A JP 2017051885A
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coating
suction
liquid
coating liquid
nozzle
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暁雄 鈴木
Akio Suzuki
暁雄 鈴木
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Toray Engineering Co Ltd
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Toray Engineering Co Ltd
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Priority to JP2015175902A priority Critical patent/JP2017051885A/en
Priority to TW105125649A priority patent/TW201718107A/en
Priority to KR1020160104015A priority patent/KR20170029380A/en
Priority to CN201610718005.7A priority patent/CN106493041A/en
Publication of JP2017051885A publication Critical patent/JP2017051885A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B05C11/101—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to weight of a container for liquid or other fluent material; responsive to level of liquid or other fluent material in a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02623—Liquid deposition

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a coating device capable of forming a coating film of a uniform thickness, by improving responsiveness of a liquid cut when finishing the coating film formation.SOLUTION: A coating device comprises a stage part for placing a substrate and a coating liquid supply part for supplying a coating liquid to a coating nozzle. The coating device forms a coating film on the substrate by relatively moving the coating nozzle and the stage part while discharging the coating liquid supplied from the coating liquid supply part from the coating nozzle. The coating device also comprises a coating liquid suction part for sucking the coating liquid in the coating nozzle, and the coating liquid suction part comprises a suction source and a suction tank arranged in a piping route for connecting such suction source and the coating nozzle, and having a larger diameter than piping. Suction operation of the coating liquid suction part is executed by decompressing the suction tank inside by the suction source in a state where a liquid level of the coating liquid from the coating nozzle exists in the suction tank.SELECTED DRAWING: Figure 1

Description

本発明は、塗布ノズルから塗布液を吐出することにより基板上に塗布膜を形成する塗布装置に関し、特に、塗布膜形成終了時の液切りの応答性を向上させる塗布装置に関する。   The present invention relates to a coating apparatus that forms a coating film on a substrate by discharging a coating liquid from a coating nozzle, and more particularly to a coating apparatus that improves the responsiveness of liquid draining at the end of coating film formation.

ガラス基板やフィルム等の基板に塗布膜を形成する装置として、塗布液を吐出する塗布ノズルを備えた塗布装置が知られている（例えば、特許文献１参照）。この塗布装置は、塗布液を供給する塗布液供給部を有しており、塗布液供給部から塗布ノズルに塗布液を供給することにより、塗布ノズルから塗布液が吐出されるようになっている。そして、塗布ノズルから塗布液を吐出させた状態で、この塗布ノズルとステージ部とを相対的に移動させることにより、ステージ部上に載置された基板上に一定厚さの塗布膜が形成される。   As a device for forming a coating film on a substrate such as a glass substrate or a film, a coating device provided with a coating nozzle for discharging a coating liquid is known (for example, see Patent Document 1). The coating apparatus includes a coating liquid supply unit that supplies a coating liquid, and the coating liquid is discharged from the coating nozzle by supplying the coating liquid from the coating liquid supply unit to the coating nozzle. . In a state where the coating liquid is discharged from the coating nozzle, the coating nozzle and the stage unit are relatively moved to form a coating film having a certain thickness on the substrate placed on the stage unit. The

高品質な製品（例えば高品質なカラーフィルタ）を製造するために、塗布膜形成開始から塗布膜形成終了までの全領域の膜厚の均一性を高精度にすることが求められている。特に、塗布膜形成終了時には、所定量の塗布液が吐出された後、塗布液の供給を停止する液切りが行われる。ところが、液切りを行っても塗布ノズルと基板とを連結する塗布液（いわゆるビード）の存在により、塗布膜の終端部の膜厚を均一にするのが困難である。そこで、塗布ノズルに連結される配管にサックバックバルブを設けることにより、塗布膜形成終了時の塗布液をサックバックバルブで吸引させることにより塗布液の供給量を制御し膜厚終端部を均一に形成されていた（下記特許文献２参照）。   In order to manufacture a high-quality product (for example, a high-quality color filter), it is required to make the film thickness uniformity in all regions from the start of coating film formation to the end of coating film formation highly accurate. In particular, at the end of the formation of the coating film, after a predetermined amount of the coating liquid is discharged, liquid draining is performed to stop the supply of the coating liquid. However, even if the liquid is removed, it is difficult to make the film thickness at the end of the coating film uniform due to the presence of the coating liquid (so-called bead) that connects the coating nozzle and the substrate. Therefore, by providing a suck back valve on the pipe connected to the coating nozzle, the coating liquid at the end of the coating film formation is sucked with the suck back valve to control the supply amount of the coating liquid and make the film thickness end uniform. (See Patent Document 2 below).

特開２００５−２４４１５５号公報JP 2005-244155 A 特開２０１４−１８０６０４号公報JP 2014-180604 A

近年では、一枚の基板にディスプレイに相当する大きさの塗布膜を複数形成する多面取りが行われている。この多面取りは、基板を一定速度で相対的に停止させることなく連続的に走行させ、塗布ノズルから塗布液の吐出及び停止を繰り返す、いわゆる間欠塗布により行われる。ところが、上記塗布装置では、サックバックバルブの吸引の応答性の問題から膜厚終端部における膜厚の均一性が損なわれる場合があり、間欠塗布のように連続して膜厚終端部の処理を行うと均一性が損なわれる現象が顕著であった。   In recent years, multi-sided processing has been performed in which a plurality of coating films having a size corresponding to a display are formed on a single substrate. This multiple chamfering is performed by so-called intermittent application in which the substrate is continuously run at a constant speed without being relatively stopped, and the discharge and stop of the application liquid are repeated from the application nozzle. However, in the above coating apparatus, the uniformity of the film thickness at the film thickness end part may be impaired due to the problem of the responsiveness of suction of the suck back valve, and the film thickness end part is processed continuously like intermittent application. When performed, the phenomenon that the uniformity was impaired was remarkable.

そこで、本発明は、塗布膜形成終了時の液切りの応答性を向上させることにより、均一厚さの塗布膜を形成することができる塗布装置を提供することを目的としている。   Accordingly, an object of the present invention is to provide a coating apparatus capable of forming a coating film having a uniform thickness by improving the responsiveness of draining at the end of coating film formation.

上記課題を解決するために本発明の塗布装置は、塗布液を吐出する塗布ノズルと、基板を載置するステージ部と、前記塗布ノズルに塗布液を供給する塗布液供給部と、を備え、前記塗布液供給部から供給された塗布液を前記塗布ノズルから吐出させつつ、前記塗布ノズルと前記ステージ部とを相対的に移動させることにより、基板上に塗布膜を形成する塗布装置において、前記塗布ノズル内の塗布液を吸引する塗布液吸引部をさらに備え、前記塗布液吸引部は、吸引源と、この吸引源と前記塗布ノズルとを連結する配管経路に配置され前記配管よりも大径の吸引用タンクとを有しており、前記塗布液吸引部の吸引動作は、前記塗布ノズルからの塗布液の液面が前記吸引用タンクに存在する状態で前記吸引源により前記吸引用タンク内を減圧させて行われることを特徴としている。   In order to solve the above problems, a coating apparatus according to the present invention includes a coating nozzle that discharges a coating liquid, a stage unit on which a substrate is placed, and a coating liquid supply unit that supplies the coating liquid to the coating nozzle, In the coating apparatus for forming a coating film on a substrate by relatively moving the coating nozzle and the stage unit while discharging the coating liquid supplied from the coating liquid supply unit from the coating nozzle, The apparatus further includes a coating liquid suction section that sucks the coating liquid in the coating nozzle, and the coating liquid suction section is disposed in a suction source and a pipe path connecting the suction source and the coating nozzle, and has a diameter larger than that of the pipe. The suction operation of the coating liquid suction section is performed by the suction source in the state where the liquid level of the coating liquid from the coating nozzle exists in the suction tank. The decompressed It is characterized by being performed Te.

本発明によれば、塗布ノズル内の塗布液を塗布液吸引部の吸引源（例えば真空ポンプ）により吸引させることができるため、サックバックバルブを用いる従来装置に比べて、吸引タイミングの設定が容易であり、吸引容量の制限もないため、塗布膜形成終了時の吸引の応答性を向上させることができる。そして、塗布液吸引部の吸引動作は、前記塗布ノズルからの塗布液の液面が吸引用タンクに存在する状態で行われることにより安定した吸引力を発生させることができる。すなわち、吸引用タンクがない状態では、吸引源により吸引された塗布液は、塗布ノズルから吸引源に連結される配管内に貯留される。この配管内に貯留された塗布液には、自重により塗布ノズル側に流れようとする力が作用する。そして、間欠塗布を行って連続して複数回吸引動作を行うことにより、次第に配管内を満たす塗布液の量が増加するため、塗布ノズル側に流れようとする力が次第に増大するとともに塗布液の粘度によっては配管表面との抵抗が増大し、吸引源の吸引力に対する塗布液の吸引量に変化が生じる。すなわち、配管内の塗布液が高さ方向に変化すると、次第に塗布液吸引部の吸引量が低下するため、間欠塗布により形成される塗布膜の膜厚終端部の均一性が塗布膜を形成するにしたがって次第に悪化する傾向が生じる。そこで、配管経路に配管よりも大径に形成された吸引用タンクを設けて塗布液の液面が吸引用タンクに存在する状態で吸引動作を行うことにより、間欠塗布により複数回の吸引動作を行って吸引される塗布液の量が増加しても、配管に比べて液面の高さ方向の変位量を小さくすることができる。したがって、間欠塗布動作中、液面が吸引用タンク内に存在する状態で吸引動作を行うことにより、配管に貯留する従来に比べて塗布液の吸引力の変化を極力抑えることができ、膜厚終端部の均一性を安定させることができる。   According to the present invention, since the coating liquid in the coating nozzle can be sucked by the suction source (for example, a vacuum pump) of the coating liquid suction section, it is easy to set the suction timing as compared with the conventional apparatus using the suck back valve. In addition, since there is no restriction on the suction capacity, the responsiveness of suction at the end of the formation of the coating film can be improved. Then, the suction operation of the coating liquid suction unit is performed in a state where the liquid level of the coating liquid from the coating nozzle is present in the suction tank, so that a stable suction force can be generated. That is, in a state where there is no suction tank, the coating liquid sucked by the suction source is stored in a pipe connected from the coating nozzle to the suction source. A force that tends to flow toward the coating nozzle by its own weight acts on the coating liquid stored in the pipe. Then, by performing intermittent suction and performing a plurality of suction operations continuously, the amount of the coating liquid that fills the pipe gradually increases, so that the force to flow to the coating nozzle side gradually increases and the coating liquid Depending on the viscosity, the resistance with the pipe surface increases, and the suction amount of the coating liquid with respect to the suction force of the suction source changes. That is, when the coating liquid in the pipe changes in the height direction, the suction amount of the coating liquid suction part gradually decreases, and the uniformity of the film thickness end part of the coating film formed by intermittent coating forms the coating film. The tendency to get worse gradually occurs. Therefore, a suction tank having a diameter larger than that of the pipe is provided in the piping path, and the suction operation is performed in a state where the liquid level of the coating liquid exists in the suction tank, so that a plurality of suction operations can be performed by intermittent application. Even if the amount of the coating liquid sucked is increased, the amount of displacement in the height direction of the liquid level can be reduced as compared with the piping. Therefore, during the intermittent application operation, by performing the suction operation in a state where the liquid level exists in the suction tank, it is possible to suppress the change in the suction force of the coating liquid as much as possible compared to the conventional case of storing in the pipe. The uniformity of the end portion can be stabilized.

また、前記塗布液吸引部は、塗布液を回収するための回収タンクを有しており、
前記吸引用タンクには、塗布液の液面の上限及び下限を検知する液面センサが設けられ、前記塗布液吸引部の吸引動作が行われることにより、前記液面センサにより塗布液の液面が上限に達したことを検知されると、前記吸引用タンク内の塗布液が前記回収タンクに送液され、前記液面センサにより塗布液の液面が下限に達したことを検知されると、回収タンクへの送液を停止させる構成にしてもよい。 Further, the coating liquid suction part has a collection tank for collecting the coating liquid,
The suction tank is provided with a liquid level sensor that detects an upper limit and a lower limit of the liquid level of the coating liquid, and the liquid level sensor detects the liquid level of the coating liquid by performing the suction operation of the coating liquid suction unit. Is detected to have reached the upper limit, the coating liquid in the suction tank is sent to the recovery tank, and the liquid level sensor detects that the liquid level of the coating liquid has reached the lower limit. The liquid supply to the recovery tank may be stopped.

この構成によれば、吸引用タンクとは別に回収タンクを備えているため、塗布液の液面を常に吸引用タンク内に留めておくことができ、長期に亘って塗布液の吸引力の変化を抑えることができる。   According to this configuration, since the recovery tank is provided separately from the suction tank, the liquid level of the coating liquid can always be kept in the suction tank, and the suction force of the coating liquid can be changed over a long period of time. Can be suppressed.

本発明によれば、塗布膜形成終了時の液切りの応答性を向上させることにより、均一厚さの塗布膜を形成することができる。   According to the present invention, it is possible to form a coating film having a uniform thickness by improving the responsiveness of draining at the end of coating film formation.

本発明の塗布装置を概略的に示す配管系統図である。It is a piping system diagram showing roughly the coating device of the present invention. 本発明の塗布装置の概略的な斜視図である。It is a schematic perspective view of the coating device of this invention. 塗布装置の塗布ユニットの脚部付近を示す図である。It is a figure which shows the leg part vicinity of the coating unit of a coating device. 吸引用タンクがない場合の配管内に塗布液が貯留される状態を示す図であり、（ａ）は、塗布液が吸引される前の状態を示す図であり、（ｂ）は、塗布液が吸引されて配管内に塗布液が貯留された状態を示す図である。It is a figure which shows the state in which a coating liquid is stored in piping when there is no tank for suction, (a) is a figure which shows the state before a coating liquid is sucked, (b) is a coating liquid It is a figure which shows the state by which was sucked and the coating liquid was stored in piping. 吸引用タンクに塗布液が貯留される状態を示す図であり、（ａ）は、塗布液が吸引される前の状態を示す図であり、（ｂ）は、塗布液が吸引されて吸引用タンク内に塗布液が貯留された状態を示す図である。It is a figure which shows the state by which a coating liquid is stored by the tank for suction, (a) is a figure which shows the state before a coating liquid is attracted | sucked, (b) It is a figure which shows the state by which the coating liquid was stored in the tank.

以下、本発明の実施の形態を図面に基づいて説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

本発明に係る実施の形態を図面を用いて説明する。   Embodiments according to the present invention will be described with reference to the drawings.

図１は、本発明の塗布装置を概略的に示す配管系統図、図２は、塗布装置本体の概略的な斜視図、図３は、塗布装置の塗布ユニットの脚部付近を示す図である。   FIG. 1 is a piping system diagram schematically showing a coating apparatus of the present invention, FIG. 2 is a schematic perspective view of a coating apparatus main body, and FIG. 3 is a view showing the vicinity of a leg portion of a coating unit of the coating apparatus. .

図１に示すように、塗布装置１は、基板Ｗを載置するステージ部３と、塗布液を基板Ｗ上に吐出する塗布ユニット１０と、この塗布ノズル１２に塗布液を供給する塗布液供給部２とを有している。そして、塗布液供給部２から塗布ユニット１０に塗布液を供給することにより、塗布ユニット１０から塗布液が吐出されるようになっており、塗布ユニット１０から塗布液を吐出させた状態で、この塗布ユニット１０とステージ部３とを相対的に移動させることにより、ステージ部３上に載置された基板Ｗ上に一定厚さの塗布膜が形成されるようになっている。   As shown in FIG. 1, the coating apparatus 1 includes a stage unit 3 on which a substrate W is placed, a coating unit 10 that discharges a coating solution onto the substrate W, and a coating solution supply that supplies the coating solution to the coating nozzle 12. Part 2. Then, by supplying the coating liquid from the coating liquid supply unit 2 to the coating unit 10, the coating liquid is discharged from the coating unit 10, and in a state where the coating liquid is discharged from the coating unit 10, By relatively moving the coating unit 10 and the stage unit 3, a coating film having a certain thickness is formed on the substrate W placed on the stage unit 3.

ステージ部３は、搬入された基板Ｗを載置するものである。このステージ部３は、平坦に形成された基板保持面を有しており、この基板保持面上に基板Ｗを水平姿勢を維持した状態で保持できるようになっている。すなわち、ステージ部３には、図示しない基板保持手段が設けられており、この基板保持手段により基板Ｗが保持されるようになっている。具体的には、ステージ部３の表面に形成された複数の吸引孔が形成されており、この吸引孔に吸引力を発生させることにより基板Ｗをステージ部３の表面に吸着させて保持できるようになっている（Ｐ１１１００）。   The stage unit 3 is for placing the loaded substrate W thereon. The stage unit 3 has a flat substrate holding surface, and the substrate W can be held on the substrate holding surface while maintaining a horizontal posture. That is, the stage unit 3 is provided with a substrate holding unit (not shown), and the substrate W is held by the substrate holding unit. Specifically, a plurality of suction holes formed on the surface of the stage unit 3 are formed, and a suction force is generated in the suction holes so that the substrate W can be adsorbed and held on the surface of the stage unit 3. (P11100).

塗布ユニット１０は、基板Ｗ上に塗布液を吐出して塗布膜を形成するものである。この塗布ユニット１０は、図２、図３に示すようにＸ軸方向に移動可能な脚部１１とＹ軸方向に延びる塗布ノズル１２とを有しており、塗布ノズル１２が、ステージ部３に保持された基板Ｗに対して接離可能に支持されている。この塗布ノズル１２は、塗布液を吐出して基板Ｗ上に塗布膜を形成するものである。本実施形態の塗布ノズル１２は、一方向（Ｙ軸方向）に延びる形状を有する柱状部材であり、塗布ユニット１０の脚部１１の走行方向とほぼ直交するように設けられている。そして、この塗布ノズル１２には、長手方向（Ｙ軸方向）に延びるスリットノズル１２ａが形成されており、塗布ノズル１２に供給された塗布液がスリットノズル１２ａから長手方向に亘って一様に吐出される。   The coating unit 10 discharges a coating liquid onto the substrate W to form a coating film. As shown in FIGS. 2 and 3, the coating unit 10 includes a leg portion 11 that can move in the X-axis direction and a coating nozzle 12 that extends in the Y-axis direction. It is supported so as to be able to contact and separate from the held substrate W. The coating nozzle 12 discharges a coating solution to form a coating film on the substrate W. The application nozzle 12 of this embodiment is a columnar member having a shape extending in one direction (Y-axis direction), and is provided so as to be substantially orthogonal to the traveling direction of the legs 11 of the application unit 10. The coating nozzle 12 is formed with a slit nozzle 12a extending in the longitudinal direction (Y-axis direction), and the coating liquid supplied to the coating nozzle 12 is uniformly ejected from the slit nozzle 12a in the longitudinal direction. Is done.

具体的には、塗布ノズル１２内には、塗布液を貯留するマニホールドが形成されており、塗布液供給部２から供給された塗布液が一時的に貯留できるようになっている。すなわち、塗布ノズル１２は、塗布液供給部２と配管４で接続されており、後述の塗布液供給部２から送液された塗布液がマニホールド内に供給される。そして、さらに塗布液供給部２の塗布液ポンプ２０を作動させることによりマニホールド内が加圧され、塗布液がスリットノズル１２ａを通じて吐出されるようになっている。したがって、このスリットノズル１２ａから塗布液を吐出させた状態で塗布ユニット１０をＸ軸方向に走行させることにより、スリットノズル１２ａの長手方向に亘って基板Ｗ上に一定厚さの塗布膜が形成されるようになっている。なお、本実施形態では、塗布ノズル１２がステージ部３に対して移動する例について説明するが、ステージ部３が塗布ノズル１２に対して移動するように構成してもよい。   Specifically, a manifold for storing the application liquid is formed in the application nozzle 12 so that the application liquid supplied from the application liquid supply unit 2 can be temporarily stored. That is, the application nozzle 12 is connected to the application liquid supply unit 2 by the pipe 4, and the application liquid sent from the application liquid supply unit 2 described later is supplied into the manifold. Further, the inside of the manifold is pressurized by operating the coating liquid pump 20 of the coating liquid supply unit 2, and the coating liquid is discharged through the slit nozzle 12a. Therefore, by running the coating unit 10 in the X-axis direction with the coating liquid being discharged from the slit nozzle 12a, a coating film having a certain thickness is formed on the substrate W over the longitudinal direction of the slit nozzle 12a. It has become so. In this embodiment, an example in which the coating nozzle 12 moves with respect to the stage unit 3 will be described. However, the stage unit 3 may be configured to move with respect to the coating nozzle 12.

塗布液供給部２は、塗布ユニット１０に塗布液を供給するものであり、塗布液タンク２１と塗布液ポンプ２０とを有している。これら塗布液タンク２１と塗布液ポンプ２０とは、それぞれ配管４で連結されており、塗布液タンク２１に貯留された塗布液が塗布液ポンプ２０に送液できるようになっている。   The coating liquid supply unit 2 supplies a coating liquid to the coating unit 10 and includes a coating liquid tank 21 and a coating liquid pump 20. The coating liquid tank 21 and the coating liquid pump 20 are connected to each other by a pipe 4 so that the coating liquid stored in the coating liquid tank 21 can be sent to the coating liquid pump 20.

塗布液タンク２１は、基板Ｗ上に形成する塗布膜の材料である薬液やレジスト液等の液状物（単に塗布液ともいう）を貯留するものである。この塗布液タンク２１には、送液加圧装置２２が設けられており、この送液加圧装置２２を作動させることにより、塗布液タンク２１内の塗布液を下流側に送液させることができる。すなわち、塗布液タンク２１の底面部２１ａには、配管４が接続されており、送液加圧装置２２で塗布液タンク２１内を加圧することにより、配管４を通じて下流側に位置する塗布液ポンプ２０に塗布液を送液することができる。本実施形態では、送液加圧装置２２として、塗布液タンク２１内にクリーンドライエア（ＣＤＡ）を供給するようになっており、塗布液タンク２１内にＣＤＡを供給することにより塗布液タンク２１内が加圧され塗布液が送液できるようになっている。   The coating liquid tank 21 stores a liquid material (also simply referred to as a coating liquid) such as a chemical liquid or a resist liquid that is a material of a coating film formed on the substrate W. The coating liquid tank 21 is provided with a liquid feeding and pressurizing device 22. By operating the liquid feeding and pressurizing device 22, the coating liquid in the coating liquid tank 21 can be fed downstream. it can. That is, the pipe 4 is connected to the bottom surface portion 21 a of the coating liquid tank 21, and the coating liquid pump positioned on the downstream side through the pipe 4 by pressurizing the inside of the coating liquid tank 21 with the liquid feeding and pressurizing device 22. The coating liquid can be sent to 20. In the present embodiment, clean dry air (CDA) is supplied into the coating liquid tank 21 as the liquid feeding and pressurizing device 22, and by supplying CDA into the coating liquid tank 21, the inside of the coating liquid tank 21 is supplied. Is pressurized so that the coating solution can be fed.

また、塗布液ポンプ２０は、塗布液タンク２１から供給された塗布液を塗布ノズル１２に送液するものである。この塗布液ポンプ２０は、配管４に接続されており、塗布液タンク２１及び塗布ノズル１２と連通して接続されている。本実施形態では、塗布液ポンプ２０として、シリンジポンプが使用されており、吸引動作により基板Ｗ１枚に対して必要な量の塗布液を収容し、吐出動作により塗布液を塗布ノズル１２に送液できるようになっている。   The coating liquid pump 20 is for feeding the coating liquid supplied from the coating liquid tank 21 to the coating nozzle 12. The coating liquid pump 20 is connected to the pipe 4 and connected to the coating liquid tank 21 and the coating nozzle 12. In this embodiment, a syringe pump is used as the coating liquid pump 20, a necessary amount of coating liquid is accommodated on one substrate W by suction operation, and the coating liquid is sent to the coating nozzle 12 by discharge operation. It can be done.

また、塗布液タンク２１、塗布液ポンプ２０、塗布ノズル１２は、複数の配管４を連結させて接続されている。そして、配管４の経路には、バルブが設けられており、図１の例では、塗布液タンク２１と塗布液ポンプ２０との間に吸引バルブ５１が設けられ、塗布液ポンプ２０と塗布ノズル１２との間に吐出バルブ５２が設けられている。これら吸引バルブ５１及び吐出バルブ５２は、例えばダイヤフラムバルブが用いられる。この吸引バルブ５１及び吐出バルブ５２を開閉動作させることにより、配管４で形成される流路を切替えることができる。例えば、吸引バルブ５１を開き、吐出バルブ５２を閉じることにより、塗布液タンク２１と塗布液ポンプ２０とが連通して接続されるため、塗布液タンク２１から塗布液ポンプ２０に塗布液を供給することができる。また、吸引バルブ５１を閉じ、吐出バルブ５２を開くことにより、塗布液ポンプ２０と塗布ノズル１２とが連通して接続されるため、塗布液ポンプ２０を作動させることにより塗布ノズル１２に塗布液を供給し、塗布ノズル１２から基板Ｗ上に塗布液を吐出することができる。   The coating liquid tank 21, the coating liquid pump 20, and the coating nozzle 12 are connected by connecting a plurality of pipes 4. A valve is provided in the path of the pipe 4. In the example of FIG. 1, a suction valve 51 is provided between the coating liquid tank 21 and the coating liquid pump 20, and the coating liquid pump 20 and the coating nozzle 12 are provided. A discharge valve 52 is provided between the two. As the suction valve 51 and the discharge valve 52, for example, diaphragm valves are used. By opening and closing the suction valve 51 and the discharge valve 52, the flow path formed by the pipe 4 can be switched. For example, by opening the suction valve 51 and closing the discharge valve 52, the coating liquid tank 21 and the coating liquid pump 20 are connected in communication, so that the coating liquid is supplied from the coating liquid tank 21 to the coating liquid pump 20. be able to. Further, by closing the suction valve 51 and opening the discharge valve 52, the coating liquid pump 20 and the coating nozzle 12 are connected in communication, so that the coating liquid is applied to the coating nozzle 12 by operating the coating liquid pump 20. Then, the coating liquid can be discharged from the coating nozzle 12 onto the substrate W.

また、本発明の塗布装置１は、塗布ノズル１２内の塗布液を吸引する塗布液吸引部７を備えている。すなわち、塗布液吸引部７により塗布膜形成終了時の液切りの際、基板Ｗと塗布ノズル１２とを連結する塗布液（ビード）が吸引され、塗布膜の終端部における膜厚の均一性を維持することができる。   In addition, the coating apparatus 1 of the present invention includes a coating liquid suction unit 7 that sucks the coating liquid in the coating nozzle 12. That is, when the coating liquid suction unit 7 drains the liquid after the formation of the coating film, the coating liquid (bead) that connects the substrate W and the coating nozzle 12 is sucked, and the uniformity of the film thickness at the end of the coating film is increased. Can be maintained.

塗布液吸引部７は、吸引源７１と、塗布ノズル１２に連通される配管４に設けられる吸引用タンク７２とを有している。吸引源７１は、動力源を作動させて継続的に吸引力を発生できる装置であり、例えば真空ポンプが使用されている。そして、真空ポンプを作動させることにより吸引用タンク７２内が減圧され、塗布ノズル１２内の塗布液が配管４を通じて吸引されるようになっている。これにより、基板Ｗと塗布ノズル１２とを連結するビードが吸引されて塗布ノズル１２のマニホールド内に収容されるため、塗布膜の終端部形成終了時における液切りを瞬時に行うことができ、液切りの応答性を向上させることができる。   The coating liquid suction unit 7 includes a suction source 71 and a suction tank 72 provided in the pipe 4 communicating with the coating nozzle 12. The suction source 71 is a device that can continuously generate a suction force by operating a power source. For example, a vacuum pump is used. Then, by operating the vacuum pump, the pressure in the suction tank 72 is reduced, and the coating liquid in the coating nozzle 12 is sucked through the pipe 4. As a result, the bead connecting the substrate W and the coating nozzle 12 is sucked and accommodated in the manifold of the coating nozzle 12, so that the draining can be instantaneously performed at the end of the formation of the terminal portion of the coating film. The responsiveness of cutting can be improved.

吸引用タンク７２は、塗布ノズル１２内の塗布液を吸引し貯留するものである。吸引用タンク７２は、配管４よりも大きな径を有する円筒形状に形成されており、塗布ノズル１２と吸引源７１との間の配管経路に設けられている。具体的には、吸引用タンク７２は、上面７２ａで吸引源７１と配管４を通じて接続され、底面７２ｂで塗布ノズル１２と配管４１を通じて接続されている。すなわち、吸引源７１を作動させると吸引用タンク７２内が減圧されることにより、塗布ノズル１２のマニホールド内の塗布液が吸引され、この吸引された塗布液が吸引用タンク７２内に収容されるようになっている。   The suction tank 72 sucks and stores the coating liquid in the coating nozzle 12. The suction tank 72 is formed in a cylindrical shape having a larger diameter than the pipe 4, and is provided in a pipe path between the application nozzle 12 and the suction source 71. Specifically, the suction tank 72 is connected to the upper surface 72a through the suction source 71 and the piping 4, and is connected to the coating nozzle 12 and the piping 41 at the bottom surface 72b. That is, when the suction source 71 is operated, the suction tank 72 is depressurized, so that the coating liquid in the manifold of the coating nozzle 12 is sucked and the sucked coating liquid is stored in the suction tank 72. It is like that.

この吸引用タンク７２は、塗布ノズル１２と連結される配管４１が塗布液で満たされており、塗布液の液面が吸引用タンク７２内に存在する状態で使用される。具体的には、吸引用タンク７２には、液面の上限と下限を検知するための液面センサ６が設けられており、上限及び下限の液面センサ６（上限センサ６１及び下限センサ６２）の間に塗布液の液面が存在する状態で使用される。これにより、塗布液の吸引力の変化を抑えることができる。すなわち、図４に示すように、吸引用タンク７２がない状態で吸引動作を行うと、吸引された塗布液は配管４内に貯留されるため、間欠塗布を行って連続して複数回吸引動作を行うと、塗布液の液面が吸引源７１側に大きく変位し（図４において液面がαだけ上昇）、配管４を占める塗布液の量が増加する。そして、配管４を占める塗布液の量が増加すると自重等により塗布ノズル１２側に流れようとする力（図４において下向きの黒矢印）が増大するとともに塗布液の粘度によっては配管４表面との抵抗が増大し、吸引源７１の吸引力に対する塗布液の吸引量に変化が生じる。一方、図５に示す本発明のように配管４よりも大径の吸引用タンク７２を設けることにより、塗布液の吸引量に対する高さ方向の変化（図５において液面がαだけ上昇）が小さくなるため、塗布液の吸引力の変化を極力抑えることができ、膜厚終端部の均一性を安定させることができる。   The suction tank 72 is used in a state where the pipe 41 connected to the application nozzle 12 is filled with the application liquid and the liquid level of the application liquid exists in the suction tank 72. Specifically, the suction tank 72 is provided with a liquid level sensor 6 for detecting the upper limit and the lower limit of the liquid level, and the upper and lower liquid level sensors 6 (upper limit sensor 61 and lower limit sensor 62). The coating liquid is used in a state where the liquid level exists. Thereby, the change of the suction | attraction force of a coating liquid can be suppressed. That is, as shown in FIG. 4, when the suction operation is performed in the absence of the suction tank 72, the suctioned application liquid is stored in the pipe 4, so that intermittent application is performed and a plurality of suction operations are performed continuously. As a result, the liquid level of the coating liquid is greatly displaced toward the suction source 71 (in FIG. 4, the liquid level increases by α), and the amount of the coating liquid occupying the pipe 4 increases. When the amount of the coating liquid occupying the pipe 4 increases, the force (flowing black arrow in FIG. 4) that tends to flow toward the coating nozzle 12 due to its own weight increases, and depending on the viscosity of the coating liquid, The resistance increases, and a change occurs in the suction amount of the coating liquid with respect to the suction force of the suction source 71. On the other hand, by providing the suction tank 72 having a diameter larger than that of the pipe 4 as in the present invention shown in FIG. Therefore, the change in the suction force of the coating liquid can be suppressed as much as possible, and the uniformity of the film thickness end can be stabilized.

また、塗布液吸引部７は、吸引用タンク７２とは別に、不要な塗布液を回収するための回収タンク７３を有している。この回収タンク７３は、吸引用タンク７２と配管４で連結されており、吸引用タンク７２内の塗布液が一定量を超えた場合に塗布液を貯留させることにより、塗布液の液面が常に吸引用タンク７２の上限及び下限内に存在させるものである。具体的には、間欠塗布による塗布動作が行われることにより吸引用タンク７２内の塗布液が増加すると、上限センサ６１が反応し退避バルブ５３が開かれる。そして、送液加圧装置７２に吸引用タンク７２が加圧されることにより吸引用タンク７２内の塗布液が回収タンク７３に送液される。そして、下限センサ６２が反応すると退避バルブ５３が閉じられることにより、吸引用タンク７２の液面が下限センサ６２位置まで低下した状態で送液が停止される。このように、吸引用タンク７２内の塗布液の液面は、常に上限センサ６１と下限センサ６２との間に位置させることができるため、塗布液の吸引力の変化を長期に亘って抑えることができる。   The coating liquid suction unit 7 has a collection tank 73 for collecting unnecessary coating liquid, in addition to the suction tank 72. The recovery tank 73 is connected to the suction tank 72 by the pipe 4, and when the coating liquid in the suction tank 72 exceeds a certain amount, the liquid level of the coating liquid is always kept by storing the coating liquid. It exists in the upper limit and lower limit of the tank 72 for suction. Specifically, when the application liquid in the suction tank 72 increases due to the application operation by intermittent application, the upper limit sensor 61 reacts and the retraction valve 53 is opened. Then, the suction tank 72 is pressurized by the liquid feeding pressurizer 72, whereby the coating liquid in the suction tank 72 is fed to the recovery tank 73. When the lower limit sensor 62 reacts, the retraction valve 53 is closed, so that the liquid feeding is stopped in a state where the liquid level of the suction tank 72 is lowered to the position of the lower limit sensor 62. Thus, since the liquid level of the coating liquid in the suction tank 72 can always be positioned between the upper limit sensor 61 and the lower limit sensor 62, the change in the suction force of the coating liquid can be suppressed over a long period of time. Can do.

また、上記実施形態の塗布装置について間欠塗布における液切り工程の動作について説明する。   Moreover, the operation | movement of the liquid removal process in intermittent application is demonstrated about the coating device of the said embodiment.

塗布液タンク２１から送液されることにより塗布液ポンプ２０、塗布ノズル１２、及びこれらを連結する配管４に塗布液が満たされた状態で基板Ｗへの塗布動作が行われる。このとき、塗布液吸引部７では、吸引用タンク７２と塗布ノズル１２とを連結する配管４が塗布液で満たされており、塗布液の液面が吸引用タンク７２の上限センサ６１と下限センサ６２との間に位置するように調整されている。   By feeding the liquid from the coating liquid tank 21, the coating liquid pump 20, the coating nozzle 12, and the pipe 4 connecting them are applied to the substrate W in a state where the coating liquid is filled. At this time, in the coating liquid suction unit 7, the pipe 4 that connects the suction tank 72 and the coating nozzle 12 is filled with the coating liquid, and the liquid level of the coating liquid is the upper limit sensor 61 and the lower limit sensor of the suction tank 72. It is adjusted so that it may be located between 62.

次に、基板Ｗ上の所定位置に塗布膜を形成する。具体的には、塗布開始位置において塗布液ポンプ２０を作動させることにより塗布ノズル１２のスリットから塗布液を吐出させる。すなわち、スリットと基板Ｗとの間にビードを形成させる。そして、塗布液ポンプ２０を作動させて一定量の塗布液を供給しつつ、塗布ノズル１２を走査させることにより基板Ｗ上に均一厚さの塗布膜を形成する。   Next, a coating film is formed at a predetermined position on the substrate W. Specifically, the coating liquid is discharged from the slit of the coating nozzle 12 by operating the coating liquid pump 20 at the coating start position. That is, a bead is formed between the slit and the substrate W. Then, a coating film having a uniform thickness is formed on the substrate W by scanning the coating nozzle 12 while operating the coating solution pump 20 to supply a certain amount of coating solution.

次に、液切り工程を行う。すなわち、塗布ノズル１２が塗布終了位置に到達すると、塗布液ポンプ２０を停止させ、塗布ノズル１２への塗布液の送液を停止させるのと同時に、塗布液吸引部７の吸引源７１を作動させ塗布ノズル１２内の塗布液を吸引させる。これにより、塗布ノズル１２のスリットに発生する吸引力により瞬時にビードが切れ、余分な塗布液が塗布膜に流れるのを抑えることができる。すなわち、塗布膜の終端部に設計通りの塗布液が供給されるため、膜厚の均一性を保つことができる。   Next, a liquid draining process is performed. That is, when the application nozzle 12 reaches the application end position, the application liquid pump 20 is stopped and the supply of the application liquid to the application nozzle 12 is stopped, and at the same time, the suction source 71 of the application liquid suction unit 7 is operated. The coating liquid in the coating nozzle 12 is sucked. Thereby, it is possible to suppress the bead from being instantaneously cut by the suction force generated in the slit of the coating nozzle 12 and the excess coating liquid from flowing into the coating film. That is, since the coating liquid as designed is supplied to the terminal portion of the coating film, the film thickness can be kept uniform.

そして、塗布動作を行うことなく一定領域通過した後、次の塗布膜の形成が行われる。すなわち、上記塗布動作及び液切り動作を繰り返すことにより、次の領域に塗布膜を形成する。このように、塗布動作及び液切り動作を行うことにより、徐々に吸引用タンク７２内の塗布液が増加するが、吸引用タンク７２が配管４に比べて大径に形成されているため、塗布液の液面の高さ位置がほぼ変化せず、塗布液の吸引力の変化を極力抑えることができ、膜厚終端部の均一性を安定させることができる。   Then, after passing through a certain region without performing the coating operation, the next coating film is formed. That is, a coating film is formed in the next region by repeating the coating operation and the liquid draining operation. As described above, by performing the application operation and the liquid draining operation, the application liquid in the suction tank 72 gradually increases. However, since the suction tank 72 is formed with a larger diameter than the pipe 4, The height position of the liquid surface of the liquid does not substantially change, the change in the suction force of the coating liquid can be suppressed as much as possible, and the uniformity of the film thickness end portion can be stabilized.

一方、複数枚の基板Ｗに間欠塗布を行うと、吸引用タンク７２に貯留される塗布液が増大することにより塗布液の液面が上限センサ６１に検知される。上限センサ６１で検知されると、警告アラームにより吸引用タンク７２の塗布液を回収タンク７３に送液するよう警告される。すなわち、一時的に塗布動作を停止させ、吸引用タンク７２から配管４を通じて回収タンク７３に塗布液を送液させる。すなわち、下限センサ６２が反応するまで吸引用タンク７２から回収タンク７３に塗布液の送液が行われる。このようにして、吸引用タンク７２の液面が下限センサ６２位置に達すると、再度上述の塗布動作及び液切り工程が行われる。   On the other hand, when intermittent coating is performed on a plurality of substrates W, the liquid level of the coating liquid is detected by the upper limit sensor 61 as the coating liquid stored in the suction tank 72 increases. When detected by the upper limit sensor 61, a warning alarm warns that the coating liquid in the suction tank 72 is sent to the recovery tank 73. That is, the application operation is temporarily stopped, and the application liquid is sent from the suction tank 72 to the recovery tank 73 through the pipe 4. That is, the coating liquid is fed from the suction tank 72 to the recovery tank 73 until the lower limit sensor 62 reacts. In this way, when the liquid level of the suction tank 72 reaches the lower limit sensor 62 position, the above-described application operation and liquid draining process are performed again.

このように、本発明の塗布装置では、塗布液吸引部７に継続的に吸引力を発生できる真空ポンプを用いているため、サックバックバルブを用いる従来装置に比べて、吸引タイミングの設定が容易であり、吸引容量の制限もないため、塗布膜形成終了時の吸引の応答性を向上させることができる。そして、配管経路に配管４よりも大径に形成された吸引用タンク７２を設けて塗布液の液面が吸引用タンク７２に存在する状態で吸引動作を行うことにより、間欠塗布により複数回の吸引動作を行って吸引される塗布液の量が増加しても、配管４に比べて液面の高さ方向の変位量を小さくすることができる。したがって、間欠塗布動作中、液面が吸引用タンク７２内に存在する状態で吸引動作を行うことにより、配管４に貯留する従来に比べて塗布液の吸引力の変化を極力抑えることができ、膜厚終端部の均一性を安定させることができる。   Thus, in the coating apparatus of the present invention, since the vacuum pump that can continuously generate the suction force is used in the coating liquid suction unit 7, the suction timing can be easily set as compared with the conventional apparatus using the suck back valve. In addition, since there is no restriction on the suction capacity, the responsiveness of suction at the end of the formation of the coating film can be improved. Then, a suction tank 72 having a diameter larger than that of the pipe 4 is provided in the piping path, and the suction operation is performed in a state where the liquid level of the coating liquid is present in the suction tank 72, so that a plurality of times can be obtained by intermittent application. Even if the amount of the coating liquid sucked by performing the suction operation is increased, the amount of displacement in the height direction of the liquid level can be reduced as compared with the pipe 4. Therefore, during the intermittent application operation, by performing the suction operation in a state where the liquid level exists in the suction tank 72, the change in the suction force of the coating liquid can be suppressed as much as possible compared to the conventional case of storing in the pipe 4, The uniformity of the film thickness end can be stabilized.

なお、上記実施形態では、液面センサ６が設けられた例について説明したが、液面センサ６を設けずに、所定の時間が経過した際に新しい吸引用タンク７２と取り替える構成であってもよい。   In the above embodiment, the example in which the liquid level sensor 6 is provided has been described. However, even if the liquid level sensor 6 is not provided, a new suction tank 72 may be replaced when a predetermined time has elapsed. Good.

１ 塗布装置
２ 塗布液供給部
３ ステージ部
７ 塗布液吸引部
１０ 塗布ユニット
１２ 塗布ノズル
２０ 塗布液ポンプ
２１ 塗布液タンク
７１ 吸引源
７２ 吸引用タンク
７３ 回収タンク
Ｗ 基板 DESCRIPTION OF SYMBOLS 1 Coating device 2 Coating liquid supply part 3 Stage part 7 Coating liquid suction part 10 Coating unit 12 Coating nozzle 20 Coating liquid pump 21 Coating liquid tank 71 Suction source 72 Suction tank 73 Recovery tank W Substrate

Claims (2)

塗布液を吐出する塗布ノズルと、
基板を載置するステージ部と、
前記塗布ノズルに塗布液を供給する塗布液供給部と、
を備え、前記塗布液供給部から供給された塗布液を前記塗布ノズルから吐出させつつ、前記塗布ノズルと前記ステージ部とを相対的に移動させることにより、基板上に塗布膜を形成する塗布装置において、
前記塗布ノズル内の塗布液を吸引する塗布液吸引部をさらに備え、
前記塗布液吸引部は、吸引源と、この吸引源と前記塗布ノズルとを連結する配管経路に配置され前記配管よりも大径の吸引用タンクと、を有しており、前記塗布液吸引部の吸引動作は、前記塗布ノズルからの塗布液の液面が前記吸引用タンクに存在する状態で前記吸引源により前記吸引用タンク内を減圧させて行われることを特徴とする塗布装置。 An application nozzle for discharging the application liquid;
A stage portion on which the substrate is placed;
A coating solution supply section for supplying a coating solution to the coating nozzle;
A coating apparatus for forming a coating film on a substrate by relatively moving the coating nozzle and the stage unit while discharging the coating liquid supplied from the coating liquid supply unit from the coating nozzle In
A coating liquid suction part for sucking the coating liquid in the coating nozzle;
The coating liquid suction unit includes a suction source, and a suction tank that is disposed in a pipe path connecting the suction source and the coating nozzle and has a diameter larger than that of the pipe. The suction operation is performed by reducing the pressure in the suction tank by the suction source in a state where the liquid level of the coating liquid from the coating nozzle is present in the suction tank. 前記塗布液吸引部は、塗布液を回収するための回収タンクを有しており、
前記吸引用タンクには、塗布液の液面の上限及び下限を検知する液面センサが設けられ、前記塗布液吸引部の吸引動作が行われることにより、前記液面センサにより塗布液の液面が上限に達したことが検知されると、前記吸引用タンク内の塗布液が前記回収タンクに送液され、前記液面センサにより塗布液の液面が下限に達したことが検知されると、回収タンクへの送液を停止させることを特徴とする請求項１に記載の塗布装置。 The coating liquid suction part has a collection tank for collecting the coating liquid,
The suction tank is provided with a liquid level sensor that detects an upper limit and a lower limit of the liquid level of the coating liquid, and the liquid level sensor detects the liquid level of the coating liquid by performing the suction operation of the coating liquid suction unit. Is detected to have reached the upper limit, the coating liquid in the suction tank is sent to the recovery tank, and the liquid level sensor detects that the liquid level of the coating liquid has reached the lower limit. The coating apparatus according to claim 1, wherein liquid feeding to the recovery tank is stopped.
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