TWI253359B - Substrate processing device and liquid feeding device - Google Patents

Abstract

This invention provides a high-precision device for transporting treating liquid, which generates no micro particles. A photoresist pump 81 and a driving device 82 are disposed in a liquid feeding device 80 for transporting a photoresist (treating liquid) to a slit nozzle 41. A small-diameter first corrugated pipe, a large-diameter second corrugated pipe, a joint part for the first and the second corrugated pipes and a pipe constituting the photoresist flow passage are disposed in the photoresist pump 81. Through the driving device 82 in figure 3 to move the joint part downwards, the internal volumetric capacity is reduced so that the photoresist in the pipe is transported to the slit nozzle 41. Moreover, through the driving device 82 in figure 3 to move the joint part downwards, the internal volumetric capacity is increased so that the photoresist is drawn to the photoresist pump 81.

Description

1253359 发明Invention Description: TECHNICAL FIELD The present invention relates to a technique for conveying a treatment liquid applied to a substrate. [Prior Art] When a photoresist liquid helium treatment liquid is applied to a substrate, it is known that a liquid supply device for transporting a photoresist liquid by various pumps such as a syringe pump (piston pump), a bellows pump, a gear pump, or a diaphragm pump And a pressure feed type device that transports the photoresist liquid at a certain pressure. In particular, a slit coater for applying a photoresist by a slit nozzle determines the film thickness of the photoresist applied to the substrate in accordance with the moving speed of the slit nozzle and the amount of the photoresist. Therefore, in order to control the film thickness of the photoresist with high precision, a bellows pump or a piston pump has been used. However, there is a problem that the bellows pump is apt to generate pulsation in the transported photoresist, and that there is a narrow gap in the structure of the bellows portion, and it is impossible to completely clean the portion. Therefore, the main purpose of the slit coater is to use a piston pump as a mechanism for conveying the photoresist. Such a slit coater using a piston pump is disclosed in Patent Document 1. Fig. 11 is a schematic view showing the configuration of a liquid supply mechanism 100 used in a slit coater disclosed in the patent document. The liquid supply mechanism 1 is composed of a piston pump H0, a piping mechanism 120, and a drive mechanism 13A. The piston pump 11A is provided with a cylinder 111/tongue base 112, a sealing material 113, and a discharge port 114. Further, the piping mechanism prepares and discharges the valve 121 and the discharge valve port 22. Furthermore, the drive mechanism 丨3 〇 = spare: motor m, ball screw 132 and nut member 133. Further, the drive 13Cit-step is provided with a speed reducer or the like for reducing the rotational speed of the motor 131, but the drawings are omitted.

O: \90\90600.DOC 1253359 The discharge port 114 of the piston pump 110 is connected to the discharge pipe 121 of the piping mechanism 120, and the discharge pipe 121 is connected in communication to a slit nozzle not shown. The discharge pipe 121 is connected to the discharge port 114 by opening the discharge valve 122 to an open state. When the liquid supply mechanism 100 rotates the ball screw 132 by the motor 13 1 , the nut member 133 moves along the ball screw 132. Since the piston 112 is fixed in the nut member 133, when the nut member 133 moves along the ball screw 132, the piston 112 moves along the Z axis along with the movement. The direction of movement of the nut member 133 is defined by the direction of rotation of the motor 131. When the photoresist nozzle discharges the photoresist liquid, the liquid supply mechanism 1 causes the discharge valve 122 to form an open shape, and the piston member 2 is pressed into the cylinder by driving the nut member 133 in the (+z) direction by the motor 13 1 . In the cylinder m, the photoresist liquid in the cylinder is transported to the slit nozzle. Further, when the photoresist is sucked into the inside of the cylinder 1, the discharge valve 122 is brought into a locked state, and the motor 133 is rotated in the opposite direction to that of the discharge, by pulling the piston 112 out of the cylinder iU. Move in the direction ((_z) direction), attracting the photoresist from the suction port not shown on the figure. By this action, the slit coater disclosed in Patent Document 1 can transport the photoresist to the slit nozzle. However, when the above-mentioned apparatus is pushed into the piston 112, there is a problem that a part of the inner wall of the inner tube is exposed to the external atmosphere, causing the anti-deformation of the adhered photoresist liquid. . In this state, in order to attract the new photoresist liquid to the inside of the cylinder iu, the piston 112 is moved, and the photoresist is attracted by the photoresist.

O:\90\90600.DOC 1253359 into fine particles. Further, in order to remove such a deteriorated photoresist liquid R, the piston 112 and the sealing material 113 must be removed for cleaning, and there is a problem that the maintenance of the pump takes time. In addition, since the machining mechanism (the motor 131, the ball screw 132, and the nut member 133) of the moving piston 112 is processed with high precision and low control accuracy, the feeding accuracy of the female member 133 (the active base 112) is low. As a result, the accuracy of the liquid supply is lowered. Further, by driving the piston pump 11 〇, the sealing material 113 is rubbed by rubbing with the cartridge Hi, and there is a problem that the particulate matter is mixed in the treatment liquid, and the sealing material 11 3 is replaced in a required period. In view of the above problems, the object of the present invention is to deliver the treatment liquid with high precision without generating fine particles. Further, the second object is to transport the treatment liquid without using a wear member such as the sealing material 113. [Summary of the Invention] The board of the invention has the problem that the invention is based on the first aspect of the invention, and the substrate is formed on the substrate, and the substrate is formed on the substrate, and the substrate is maintained. a slit nozzle which is specific to the main surface of the substrate; a supply mechanism for supplying the treatment liquid; and a means for describing the specific nozzle: the slitting nozzle; Member, = = internal volume; pipe member, which forms a flow path inside, and can change the internal volume; and driving means, the internal volume of the above-mentioned container; the part of the container member:

O:\90\90600.DOC 1253359 A pipe member in which an indirect liquid is sealed between the container member and the pipe member. In addition, the invention of claim 2 is the substrate processing apparatus according to the first aspect of the invention, wherein the container members have different inner diameters, and the first and second wave tubes are connected to each other. The driving means moves the vicinity of the boundary between the first and second bellows in a specific direction. In addition, the invention of claim 3 is the substrate processing apparatus of the invention, wherein the slitting nozzle is opposite to the substrate while discharging the specific processing liquid, the first and second corrugations. The speed at which the boundary moves is controlled to be at a speed synchronized with the moving speed of the slit nozzle. In addition, the invention of claim 4 is the substrate processing apparatus according to the invention of claim No. 1, wherein the preparation of the $, +, and 1 has the control of the detection means, and the control means Having: a fixed capacity supply means, a delivery amount of the specific treatment liquid conveyed by the potted turbulent means; and a solid portion: controlling the delivery of the liquid supply means to the specific treatment: the second invention: the invention of the fifth item For example, if the scope of the patent application is set in the above-mentioned tube material (4), the towel material means (4) have a separate suction port: the suction point and the row are arranged, and are arranged in the foregoing side. The height position of any one of the outlets is lower than In addition, in addition, the invention of claim 6 of the scope of patent application is as for the scope of patent application.

O:\90\90600.DOC -9- 1253359 The base plate processing device of the present invention, wherein the buffer tank for supplying the specific treatment liquid, the first one has the above-mentioned pressure to attract the specific treatment liquid: Further, the liquid supply means is in the atmosphere, and the substrate processing apparatus according to the invention of claim 7 is characterized in that the buffering range is the height of the discharge port of the slit nozzle. a liquid level is set to be low. In addition, the invention of claim 8 of the patent scope, the substrate processing apparatus of the 6 inventions, the middle of the patent range, the supply unit is added to the + and the woman can add the aforementioned specificity in the buffer tank. The processing step is carried out by means of a special (four) force to be stored in the buffer tank = said = supplementary fluid to the aforementioned slit nozzle. a. 此外 此外 , , 申请 申请 申请 此外 此外 此外 此外 此外 此外 此外 此外 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板. The invention of the first application of the first application of the patent application of the first month of the present invention is a substrate processing apparatus of the patent application scope, wherein the advance step has a preparatory flow path, which is supplemented by The method of dusting and conveying the specific treatment liquid does not pass through the mouth. The first liquid processing means, and the specific processing liquid is introduced into the above-mentioned sew 嗔 嗔 : 发明 发明 发明 发明 发明 系 系 系 系 系 系 系 系 系 系 系 系 如 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 : : The second is to transport the specific treatment liquid to the slit nozzle, and the error is driven by the driving method of the river, and supplemented by the foregoing

O:\90\90600.DOC -10- 1253359 means to send any one of the liquids; and the flow before and after the selection means, which are selected to be transported by means of k/ or via the aforementioned preparatory flow path. In addition, 'the patent of the 12th item of the patent application scope is your gentleman's number" Lebei's ^ Ming, before the opening and closing of the patent application scope, +.% /, the middle of the flow path selection means has the opening and closing, then the preparatory flow path valve. In addition, the hair-d Irm ^ of the thirteenth application patent is a substrate processing apparatus of the invention of the invention of the scope of the patent application, and the above-mentioned crying 媸 / 、 、 述 述 手段 手段 手段 手段 手段 手段 手段 手段 手段 手段 手段And a plurality of the above-mentioned pipe members are disposed one by one. The number of W in the 偁仵 此外 此外 此外 此外 申请 申请 申请 申请 , , , , , , , , , , , , , , The treatment further includes a liquid supply pipe, and i = a plurality of container members and the slit nozzle are formed between the plurality of nozzles, and a plurality of processing liquid supply ports are provided on the slit nozzle, and The liquid feeding pipe is connected one by one, and a plurality of processing liquids are connected to the ground to supply a port and the plurality of container members. Further, the scope of the patent patent is hereinafter referred to as the fifth item of the cigarette. Further, the substrate processing apparatus of the invention of the fourth aspect further includes a thickness of the film formed on the surface of the substrate by the film thickness detecting hand, and the detection result of the thickness detecting means before the ^=:t, controlling the _ pumping; Make the thickness of the ruthenium film uniform. The invention of claim 16 is the substrate processing apparatus according to the thirteenth aspect of the invention, wherein the drive mechanism separately changes the internal volume of the plurality of container members. Further, the patent application scope Item 17 is issued as follows:

O:\90\90600_DOC -11 - 1253359 < 1 · First Embodiment><1·1 Description of Structure> Diagram, and the outline of the substrate processing apparatus of the present invention Fig. 2 is a front view of the main body 2 of the substrate processing apparatus 1. The substrate processing apparatus i substantially separates the cost body 2 from the control system 6, and uses a square glass substrate for the screen panel of the (four) crystal display device as the substrate to be processed. In the case where the electrode layer formed on the surface of the substrate 90 is selectively etched, etc., a coating device (slit coater) for applying a photoresist on the surface of the substrate 90 is formed. Therefore, the thickness of this embodiment is fine. The slit nozzle 41 can discharge the photoresist liquid to the substrate 9. In addition to the glass substrate for the liquid crystal display device, the substrate processing apparatus 1 can be generally modified to be applied to various substrates for the flat panel display device. Device for liquid (medicine solution) The main body 2 is provided with a stage 3 which functions as a holding table for holding a substrate to be processed, and also serves as a base function of each of the attached mechanisms. One shape The upper surface (holding surface 3〇) and the side surface are processed into a flat surface. The upper surface of the stage 3 forms a horizontal surface and serves as a holding surface 3〇 of the substrate 9. The plurality of vacuum suction ports are formed on the holding surface 30, Each of the vacuum suction ports is connected to a vacuum pump (not shown). When the substrate 90 is processed in the substrate processing apparatus, the substrate 90 is held at a specific horizontal position by sucking the substrate 90. The holding surface 30 A pair of moving rails 31a extending in a substantially horizontal direction in a substantially horizontal direction are fixed to both end portions of the holding region (the region of the holding substrate 9A) sandwiching the substrate 90. The moving rail 31a is guided and fixed to the support portions at both ends of the bridge structure 4. :\90\90600.DOC -13- 1253359 = movement of the block 31b and the bridge structure 4 (limiting the direction of movement to a specific square). That is, the moving rail 31_ supports the bridge structure 4 above the holding surface 30. The linear guide is provided. The bridge structure 4 is disposed substantially horizontally from the two sides of the stage 3, and the bridge structure 4 is mainly composed of: a nozzle branch portion 40 with carbon-fat as material; And a material mechanism 43 and 44 supporting both ends thereof. Inner support portion 40 is attached to the helmet: slit nozzle 41, like the gap sensors are connected to the feed nozzle 41 was slit mechanism 80. In addition, the slit nozzle 41.

The slit nozzle 41 extending in the horizontal Y direction sends the liquid supply mechanism 8 of the treatment liquid (photoresist). Here, the photoresist coating region refers to a region of the main surface of the substrate 9 to which the photoresist is to be applied, and usually a region of a specific width region along the edge is removed from the entire area of the substrate 9G. The lower side is provided with a discharge port 41a along the Y-axis direction. The slit nozzle 41 transports the photoresist by the liquid supply mechanism 80, and by scanning the surface of the substrate 9, the specific area of the surface of the substrate 90 (hereinafter referred to as "resistance coating region") is discharged. The detector 42 is mounted on the nozzle support portion 4 of the bridge structure 4 at a position opposite to the holding surface 30, and detects the distance (gap) between the object (such as the substrate 90 and the photoresist film) in a specific direction (a z direction). And outputting the detection result to the control system 6. Further, each of the gap sensors 42 is preferably mounted at an upper position in the vicinity of both end portions in the Y-axis direction of the photoresist flooding region. Thereby, the respective mounting positions of the two gap sensing states 42 are arranged in the γ-axis direction and at the same position. Thus, the relative positional relationship is fixed by mounting the slit nozzle Μ and the gap O: \90\90600.DOC -14 - 1253359 gap sensing 42 on the nozzle support portion 40, respectively. Therefore, the control system 6 can detect the distance between the surface of the substrate 90 and the field spray 4 1 based on the detection result of the gap sensor 42. Further, the substrate processing apparatus 1 of the present embodiment includes two gap sensors 42, but the number of the gap sensors 42 is not limited thereto, and more gap sensors 42 may be provided. In the mouth support portion 40, a liquid supply mechanism 8 is provided at a position above the slit nozzle 4?. Fig. 3 is a schematic view showing a configuration for supplying and transporting the photoresist to the slit nozzle 4m. Further, the respective structures in Fig. 3 are connected in a state in which signals can be transmitted and received by the control system 6, and can be respectively operated in accordance with control signals from the control system 6. The supply mechanism 7 for supplying the resist liquid to the substrate processing I is provided with the replenishing device 71, the buffer tank 72, and the sensor 73, and the pipe for the fine liquid is sucked into the pipe 74, opened and closed, and the second is 77. The return valve 78, the discharge pipe 79, the opening and closing valves 83, 84, and the preliminary pipe μ. The replenishing device 71 has a function of supplying the photoresist from the photoresist bottle to the buffer tank 72. In addition, it also has the function of pumping the photoresist liquid stored in the buffer tank (4). The buffer tank 72 is provided by temporarily separating the green liquid and separating and removing the air mixed in the photoresist. That is, the air mixed in the photoresist liquid is concentrated in the buffer tank when the photoresist liquid is stored in the buffer tank 72, and is opened and ventilated by the air suction valve 88 described later. Evil is discharged to the outside of the device via the exhaust pipe 89. In addition, the buffer groove 72 also has a function of attracting at atmospheric pressure when the photoresist (4) is sucked into the photoresist. The sensor 73 is stored in the buffer tank for detection. 72 θ 1 of the amount of photoresist is set. Step-by-step details 'Sensor 73 contains 3 liquid level sensors, each

O:\90\90600.DOC •15- 1253359 Upper limit and lower limit. The liquid level sensing is configured to transmit the liquid level position information detected by the detectable overflow detector 73 to the control system 6, and the control system 6 generates a control signal based on the detection result to control the replenishing device 71. Thereby, a suitable amount of photoresist can be stored in the buffer tank 72 in advance. The buffer tank 72 (four) is turned to the position of the same height as the fine shot, but not shown in Fig. 2, the liquid level in the buffer tank 72 is set slightly lower than the discharge port 41a of the slit nozzle 41. . The suction pipe 74 and the discharge pipe 79 introduce the photoresist liquid into the pipe for the slit nozzle 41 via the resist pump 81. When the control signal of the control system 6 is in an open state, the photoresist is sucked by the light-resistance 81 by the suction valve 74, and then sent to the slit through the discharge pipe 79. The nozzle 41 is shown in Fig. 3. The filter 77 is provided on the primary side of the resistive pump 81 and has a function of removing impurities from the photoresist liquid sent to the slit nozzle 41. Further, the check valve 78 is disposed to prevent the photoresist liquid in the suction pipe 74 from flowing backward, and in Fig. 3, the valve is passed through only the photoresist in the right direction. The on-off valves 83, 84 and the preliminary piping 85 are configured to convey the photoresist without passing through the resist pump 81. In other words, when the opening and closing valve 75 is in a closed state and the opening and closing valves 83 and 84 are in an open state, the photoresist liquid is transported to the thin portion through the preliminary piping 85 without passing through the suction pipe 74, the photoresist pump 8 1 and the discharge pipe 79. The nozzle 41 is slit. That is, the control system 6 and the opening and closing valves 75, 83, 84 mainly correspond to the flow path selecting means of the present invention. Further, the substrate processing apparatus 1 includes a liquid supply mechanism 80 that generates a driving force for feeding from the supply mechanism 70 to the slit nozzle 41.

0: \90\90600.DOC -16- 1253359 Fig. 4 is a detailed structural view showing the liquid supply mechanism 8A. The liquid supply mechanism 8 is mainly composed of a resist pump 81 and a drive mechanism 82. In addition, a cross section of the resistive pump 81 is shown in FIG. The resistive pump 81 has a first bellows 81A, a second bellows 812, a joint member 813, and a pipe 814. In addition, the photoresist pump 8 is respectively provided with a suction port 8 1 5 'which serves as an entrance of the photoresist liquid when the photoresist is attracted, and a discharge port 8丨6 which serves as a photoresist liquid when the photoresist is discharged. Export. The suction port 8丨5 is connected to the supply mechanism 70 via the suction valve 74, and the discharge port 8 16 is connected to the slit nozzle 41 via the discharge pipe 79. Further, the suction port 81 5 is disposed to be located below the discharge port 816. In addition, in order to improve the discharge accuracy of the slit nozzle 4, it is preferable to shorten the distance from the discharge port § 16 of the photoresist pump 8 1 to the slit nozzle 4 . In the substrate processing apparatus 1 of the present embodiment, in order to shorten the distance, the liquid supply mechanism 80 is disposed on the nozzle support portion 40, so that the discharge accuracy of the slit nozzle 4 can be improved. The first bellows 811 and the second bellows 812 are constituted by members that are contractible in the z-axis direction. Further, the end portions of the (1) side of the first bellows 811 on the (+z) side of the first bellows 812 are fixed to each other via the joint members 8丨3, and the insides communicate with each other. Further, both ends of the first bellows 811 and the second bellows 812 are supported by the rigid body outside the figure via the cover 81, so that the total length X (Fig. 4) is kept constant. Since the inner diameter area of the first bellows 811 (the area perpendicular to the surface of the z-axis) is smaller than the inner diameter area of the second bellows 812, the state of the first bellows 811 is extended and the second bellows 812 is extended. The volume of the photoresist pump 81 can be changed by changing the state. A conduit is disposed inside the first bellows 811 and the second bellows 812

O:\90\90600.DOC -17- 1253359 814. The pipe 814 is composed of a tubular plastic member, and both ends are connected to the suction port (1) and the discharge port 816, respectively. That is, the conduit 814 constitutes a flow path for the photoresist. Further, as shown in Fig. 4, the substrate processing apparatus 1 of the present embodiment is disposed in a substantially vertical direction along the Z axis. The in-line liquid LQ is sealed in the * door surrounded by the first bellows 811, the second bellows 812, and the pipe 814. The indirect liquid LQ uses a change in pressure, temperature, etc., and a liquid whose volume change rate is low. Thereby, even if the first bellows 8" and the second bellows 812 are deformed by expansion and contraction, the volume of the indirect liquid 1〇 hardly changes. With such a configuration, the substrate processing apparatus according to the present embodiment is in the indirect liquid when the first bellows 8 is extended (when the joining member 813 is moved downward). The pressure is reduced by the decrease in the volume surrounded by the first bellows 81A and the second bellows 812 of the photoresist pump 81. Since the indirect liquid LQ system pressurizes the liquid whose volume is hardly reduced, the line 814 is contracted (reduced) by pressurizing the contact liquid LQ, and the line 814 is pressurized. At this time, when the control system 6 causes the opening and closing valve material and the waste liquid valve 86 to be in a locked state, and the opening and closing valve 76 is opened, the photoresist liquid in the pipe 8 14 is discharged from the discharge port 816, and is conveyed to the slit nozzle. In addition, since the check valve 78 is provided on the side of the suction port 815, the photoresist liquid in the pipe 8 is not reversed from the suction port 815. In addition, when the second bellows is extended (joining The member 813 moves upward k) 'the volume of the space surrounded by the first bellows 8 11 and the second bellows 8丨2 of the photoresist pump 8 1 increases 'indirect liquid LQ decompression. Since the indirect liquid lq system is even reduced The liquid whose pressure is hardly increased is pressed, so that the line 814 is expanded by the indirect liquid Lq, and the pressure is reduced in the line 814. At this time, the control system opens and closes the valve 76, 84.

O:\90\90600.DOC -18- 1253359

When the waste liquid valve 86 is in the locked state, the photoresist liquid in the buffer tank 72 is attracted from the port 815 to the inside of the pipe 814. That is, the photoresist pump 81 has the shutter member 81 movable back and forth along the z-axis. Move, repeat the attraction and discharge of the photoresist, and rotate the function of the photoresist. j FIG. 5 is a detailed configuration diagram showing the drive mechanism 82. The drive mechanism u includes a base 82A, a drive motor 821, a ball screw 822, a nut member 823, a mounting member 824, a guide 825, a bearing member 826, and a guide fixing member. ? The photoresist pump 8 has a function of generating a driving force for transporting the photoresist. The substrate processing apparatus according to the present embodiment is formed by the rotation driving force generated by the drive motor 821, and is mainly converted into a linear motion driving force by the structure including the ball screw 822 and the nut member 823, thereby forming the driving force of the resist pump 8丨. . The susceptor 820 is a member for mounting the respective structures of the drive mechanism 82 and integrating them. Further, the base 820 is provided with a member fixed to the nozzle support portion, etc., but the drawing is omitted in Fig. 5. As described above, in a state in which the respective structures of the drive mechanism 82 are integrally formed, the drive accuracy can be improved by being fixed to the nozzle support portion 4A. Further, the guide 82 is fixed to the nozzle support portion 4A along the Z-axis by the guide direction of the guide 825, which will be described later. The drive motor 82 1 is a DD (Direct Drive) motor with high speed accuracy when rotating at a low speed (below 500 rpm). In this way, by using the DD motor on the drive motor 821, the conventional substrate processing apparatus can directly connect the ball screw 8 2 2 and the drive motor $ 21 without a speed reducer or the like, thereby making the apparatus inexpensive. And miniaturization, and it is possible to prevent the accuracy of feeding of the nut member 823 due to the accuracy of the reducer and the backlash from being lowered. Furthermore, when the ball screw 822 is screwed into the through hole of the nut member 823 using the synchronous skin O:\90\90600.DOC -19-1253359, the nut member 823 is along the central axis P, and the ball screw 822 is specified. The direction moves linearly. Since the nut member 823 and the joint member 813 are coupled via the attachment member, when the nut member 823 is moved as described above, the joint member 813 moves in the same direction in conjunction with each other. Thus, the rotational driving force of the driving motor 82 1 of the substrate processing apparatus 1 around the central axis p is converted into the linear motion driving force of the resist pump 8 1 in the z-axis direction. Further, the direction in which the drive motor 82 is rotated when the nut member 823 is moved toward the drive motor 821 side along the ball screw 822 is referred to as "positive direction". Further, a guide portion (not shown) for welcoming the guide 825 is provided on the nut member 823. A plurality of balls are provided in the guide portion, and the nut member M3 and the guide 825 are engaged by the ball, and the friction when the nut member 823 is moved can be suppressed. Further, a resin spacer or a spacer ball is disposed between each ball and the ball. Thereby, vibration and feed unevenness caused by the rotation and circulation of the ball can be suppressed, so that the speed accuracy of the south nut member 8 2 3 can be improved. The guide 825 is engaged with the guiding portion (not shown) of the nut member 823, and is integrally assembled with the ball screw 822 on the base 820 by a pair of guiding fixing members 827, and has sufficient accuracy. With rigidity. The guide 825 has a linear guide shaft J and has a movement limit of the nut member $2 3 that is moved by the rotation of the ball screw 8 2 2 by the engagement with the nut member 823. The function of guiding the direction of the axis J. As described above, the nut member 823 is moved along the central axis P of the spherical screw 822 by the rotation of the ball screw 822, but the direction of the central axis P varies depending on the driving vibration of the spherical screw 822. Therefore, only the spherical screw 822 cannot be refined. O:\90\90600.DOC -21 - 1253359 The degree of movement of the nut member 823 is well defined. Conversely, since the guide 825 is stationary 'the direction of the guide axis j is more stable than the central axis ρ. Therefore, the nut member 823 of the drive mechanism 82 defines the moving direction with the guide shaft j, and the accuracy of the moving speed and the moving direction of the nut member 823 can be improved. In the bearing member 826, a support bearing (not shown) is provided inside, and the bearing abuts against the ball screw 822. Thereby, the ball screw 822 can be attached to the base 82A without hindering the rotation of the ball screw 822 around the center axis ρ. Further, in order to obtain the rotational rigidity of the ball screw 822, a bearing having a suitable rigidity or the like is used in consideration of the shaft load. Further, the rotational stability of the ball screw 822 can be improved by using a larger type of bearing. Referring back to Fig. 3, the substrate processing apparatus includes a waste liquid valve 86, a waste liquid pipe 87, an exhaust valve 88, and an exhaust pipe, which are mainly used for maintenance and the like. The waste liquid valve 86 is a valve for opening and closing the flow path between the suction pipe 74 and the waste liquid pipe 87. The waste liquid valve 86 performs opening and closing control in accordance with a control signal of the control system 6. The waste liquid pipe 87 is connected to a recovery mechanism (not shown), and when the waste liquid valve % is in an open state, the photoresist liquid in the resist pump 81 and the suction pipe 74 is recovered to the recovery mechanism via the waste liquid pipe 87. Inside. The purge valve 88 is a valve for opening and closing the flow path between the buffer tank 72 and the exhaust pipe 89. The suction valve 88 performs opening and closing control in accordance with a control signal of the control system 6. The exhaust pipe 89 is connected to an exhaust pump (not shown), and when the intake valve is "opened, the air separated from the photoresist in the buffer tank 72 is exhausted via the exhaust pipe 89. Further, the device is exhausted. All of the valves used in the system use a so-called elimination type that does not cause a pressure change or a volume change in the liquid in the pipe due to the operation of the valve.

O:\90\90600.DOC -22- 1253359 Returning to Fig. 1 and Fig. 2, the lifting mechanism 43, 44 is disposed on both sides of the slit nozzle 41. JL is separated from the slit nozzle by the sprayed support portion 4〇. link. The lifting mechanism 43, 44 causes the slit nozzle 41 to move up and down, and is also used to adjust the posture of the slit nozzle 41 in the YZ plane. The two ends of the bridge structure 4 are respectively fixed to the AC hollow linear motor (referred to as τ, simply referred to as "linear motor") 50 along the both side edges of the stage 3, and 5 linear motor 5G system is provided. a stator (additional and movable), and generated by the electromagnetic interaction of the stator 5〇a and the moving element 5〇b, so that the bridge structure 4 is in the X-axis direction (in the direction of the surface of the substrate 9) The driving force of the motor for moving. The moving amount and moving direction of the linear motor 50 can be controlled by the control signal of the control system 6. The linear motor 51 also has substantially the same function and configuration. The linear encoders 52, 53 respectively The scale portion and the detector (not shown) are detected to detect the relative positional relationship between the scale portion and the detector, and are transmitted to the control system 6. Each of the detectors is fixed to both ends of the bridge structure 4, The linear encoders 52 and 53 have a function of detecting the position of the bridge structure 4. The control system 6 includes therein: a calculation unit 6 that processes various poor materials according to a program; and a memory unit 6 that stores programs and various programs. Information. In addition, The front portion is provided with an operation unit 62 for inputting necessary instructions to the substrate processing apparatus, and a display unit 63 for displaying various materials. The control system 6 is attached to the body by a cable not shown. Each of the two mechanisms is connected, and the stage 3, the bridge structure 4, the elevating mechanism 43, 44, the linear motor 50, 51, and the control unit are controlled according to the signals of the operation unit 62 and various sensors.

O:\90\90600.DOC -23- 1253359 Each structure of the mechanism 70 and the liquid supply mechanism 80 is given. In particular, the control system 6 controls the opening and closing of the opening and closing valves 75, 76, 83, 84 in accordance with the instruction of the operator to turn in, and when the photoresist liquid is introduced into the slit nozzle 41, the suction pipe 74 and the discharge pipe 79 are selectively used. Or use the preliminary piping 85. The rotation direction of the drive motor 821, the amount of rotation per i stroke, and the rotation speed are controlled by a control signal. Since the substrate processing apparatus i determines the amount of movement of the bonding member 813 (the amount of change in the volume of the resistive pump 81) by the amount of rotation of each stroke of the driving motor 821, the amount of rotation is controlled to be equivalent. In addition, the substrate processing apparatus determines the moving speed of the joint member 813 by the rotational speed of the drive motor 821 (the volume change speed of the resist pump 81). Therefore, controlling the rotation speed corresponds to controlling the flow rate of the photoresist liquid of the photoresist pump. The specific structure of the control system 6 is such that the memory unit 61 is equivalent to a temporary memory RAM, a read-only R〇M, a disk device, and the like. a removable medium such as a magneto-optical disk or a memory card, a reading device, etc. Further, the operation unit 62 is a button and a switch for the operator to input an instruction for the substrate processing device (including The keyboard, the mouse, etc., etc., may be displayed on the touch panel, such as the display unit 63. The display unit 63 corresponds to a liquid crystal display device, various lights, etc. <1·2 Operation Description> Description Shu means of plate processing operation. Shu substrate processing apparatus mainly two kinds of operation modes (coating mode, pre-coating mode, maintenance mode), the operation mode is selected based according to any one of the instruction input of the operator, and by

O:\90\90600.DOC -24- 1253359 The control system 6 controls each structure to perform the operation of the U2A coating mode. First, the general coating mode is used to indicate the coating die cutting. "Operator input 3 valve 86 and exhaust valve 88 form a system 6 which will open and close 阙83, 84, and cancel the state. Thereby, the suction bow I is selected, and the opening and closing chamber 75 is formed, and the flow path is formed. And discharging the curry liquid into a photoresist liquid. At this time, the detection result of the photoresist liquid to the storage unit 73 is previously stored in the buffer tank 72 by the replenishing device, 81, and the photo-resistance is performed. 72: Supply of photoresist to the top: position error by the control system 6 of the control substrate processing device 1 by the pot structure, moving, its 4 mussels or not shown on the map; f| π holding surface: 〇 up to At a specific position, the stage 3 sucks and holds the substrate 9 (=the temple surface 3. the upper position. Continuing, the lifting mechanism 43, 44 controls the gap sensor 4 attached to the nozzle support portion 40 according to the control of the control. : ^ Move to a specific height higher than the thickness of the base (4) (hereinafter referred to as "measure"). When the gap sensor 42 is set to measure the height, the bridge structure xe4 is in the (+χ) direction by the linear motors 50, 51. Moving up, moving the gap sensor core above the photoresist coating area. At this time, the control system 6 is based on a linear encoder 3, the test results, the control signal is supplied to each linear motor 5, to control the position of the gap sensor 42 in the X-axis direction. The person-to-person, the gap sensor 42 starts to measure the surface of the substrate 9 The gap between the surface of the substrate 90 in the photoresist application region and the slit nozzle 41. When starting the measurement, borrow

O:\90\90600.DOC -25 - 1253359 The bridge structure 4 is further moved in the (+ χ) direction by the linear motor 5 Ο, 5 1 , and the gap sensor 42 scans the photoresist coating area and will scan The measurement, and the result are transmitted to the control system 6. When 匕, the control system 6 stores the measurement result of the gap sensor 42 in the memory unit 61 in association with the horizontal position detected by the linear encoders 5 2, 5 3 . The bridge structure 4 passes over the substrate 9〇 in the (+X) direction. After the scanning by the gap sensor 42 is finished, the control system 6 stops the bridge structure 4 at its position, according to the detection result of the gap sensor 42. The posture of the slit nozzle 41 on the ¥2 plane is calculated to be in a proper posture (the interval between the slit nozzle 41 and the photoresist application region is a suitable interval for applying the photoresist liquid. Hereinafter, it is referred to as "appropriate posture"). The position of the nozzle support portion 40 is supplied with a control signal to each of the lift mechanisms 43 and 44 in accordance with the calculation result. Each of the elevating mechanisms 43, 44 moves the nozzle support portion 40 in the Z-axis direction in accordance with the control k, and adjusts the slit nozzle 4 i to an appropriate posture. Thus, in order to achieve a uniform coating of the photoresist liquid, the distance between the slit nozzle 41 and the surface of the substrate 90 must be strictly adjusted. The substrate processing apparatus adjusts the distance by controlling the lifting mechanism 43 and 44 based on the detection result of the gap sensor 42 by the control system 6. Further, the linear motor 5A, 51 moves the bridge structure 4 in the (one) direction, and moves the slit nozzle 41 to the start discharge position. Here, the start of the discharge position means that the slit nozzle 41 is located substantially along one side of the photoresist coating region. When the slit nozzle 41 is moved to the start discharge position, the control system 6 supplies a control signal to the linear motors 50, 51. By means of the linear motor 5, 51, according to the control 仏旒, the bridge structure 4 is moved in the (X) direction, and the slit nozzle 4 is scanned.

O:\90\90600.DOC -26- 1253359 The surface of the substrate 9〇. At this time, the control system 6 also supplies a control signal to the opening and closing valve 76 and the drive motor 821. That is, when the slitting nozzle 41 scans, the control system 6 opens the opening and closing valve 76 and rotates in the positive direction. The motor 821 is driven to move the engaging member 813 of the resistive pump 81 in the (Z) direction. By this action, the first bellows of the resist pump 81 is elongated, and the second corrugation is contracted, and the indirect liquid Lq is pressurized. Indirect liquid [When the crucible is pressurized, the pipeline receives and attracts the photoresist liquid in the official road 8 14 and the self-discharge outlet 8丨6 to the slit nozzle 41. The b, , , and the nozzles 41 are relatively moved toward the substrate, and the photoresist is discharged on or in the photoresist coating region. Thereby, a layer of a photoresist liquid is formed on the surface of the substrate 9. In addition, the control system 6 controls the drive motor 821 so that the moving speed of the first bellows 811 and the second bellows 812 near the boundary of the photoresist pump 81 (the first bellows Η) becomes the moving speed of the slit nozzle 41 (scanning) Speed) Synchronization speed, whereby the amount of the photoresist liquid discharged from the light barrier 81 can be appropriately controlled. Further, in the substrate processing apparatus of the present embodiment, the joint member 813 of the photoresist pump 81 and the nut member 823 are used. At the same time, it moves smoothly, so that the pulsation caused by pumping or the like does not occur in the transported photoresist liquid, and the liquid supply unevenness can be suppressed. ^ In addition, the buffer groove 72 is arranged in the structure, and the m height is made into a slit spray purple 41 The south degree of the discharge port 41a is higher than the liquid level of the photoresist liquid in the buffer tank 72, thereby preventing the photoresist liquid from flowing out of the slit nozzle 4 at the time of coating. Further, at this time, (4) the rotation speed of the motor 821 The thickness of the photoresist layer formed by the control system 达到^ reaches a set value throughout the photoresist application region. The control system 6 performs the rotation of the drive motor 821 for such control.

O:\90\90600.DOC -27- 1253359 The gap sensor 42 scans the photoresist coating area, and measures and forms a gap between the substrate and the resist film, and transmits it to the control system. The gap value (the distance between the substrate and the surface of the substrate) and the gap value measured after the photoresist coating (the distance from the surface of the photoresist film) are measured to determine the light formed on the substrate 90. The thickness of the resist film is further determined by comparing the thickness of the thickness to a specific value set in advance as the allowable thickness range, and determining whether the coating process on the substrate 90 is good or not, and determining The result is shown on the display (10). / By this, since the layer (the photoresist film) of the treatment liquid is formed on the surface of the substrate 90, it is possible to quickly determine whether it is good or not, and therefore, based on the determination result displayed on the display portion, The operator g竺7 has a rapid response to the situation of the people. In addition, since the inspection using the gap sensor 42 is mainly performed in the direction of the x-axis, it is also possible to detect the uncoated photoresist. Liquid (insufficient photoresist), start to discharge The discharge position deviation is set and the abnormality such as the thickening phenomenon occurs at the end of the coating position. Further, it is suitable for the measurement result according to the film, and if the film thickness is thinner than the required thickness, the next coating can be improved. The speed of the motor 821, etc. 'elastically controls the resist pump 81 depending on the condition to obtain the desired coating result. 0 At this time, the control system 6 reverses the drive motor 821 of the drive mechanism 8 by the control signal. The nut member 823 is moved in the (+ζ) direction. Thereby, since the interface member 8 1 3 is moved in the (+ ζ) direction, the first bellows 8 ii is contracted, and the second bellows 812 is elongated. The indirect liquid (3) is decompressed, the line 814 is expanded, and the photoresist liquid is sucked into the line 814 from the supply mechanism 7 through the suction port 815. O:\90\90600.DOC -29- 1253359 Thus, the photoresist pump 8丨 In the discharge action and the suction action, the portion constituting the photoresist flow path is not exposed to the outside air. That is, it is not exposed to the outside air as in the apparatus using the uranium-based active pump shown in FIG. Light = liquid metamorphism and mixed into the coated photoresist solution. After the photoresist film inspection, the stage 3 stops sucking the substrate 9 , and the operator or the transport mechanism takes out the substrate 90 from the holding surface 30 and transports it to the next processing step. The operation of the substrate processing apparatus d of the present embodiment is the operation of the coating type <1 · 2 · 2 pre-coating mode operation> Next, the substrate processing apparatus j-type substrate processing apparatus 1 is not conveyed to The mode of the slit nozzle 41. The pre-coating mode. The so-called pre-coated die light block 81 is driven, and the photoresist liquid substrate processing apparatus is formed, such as the end of the slit nozzle 41, before the coating mode. However, the state in which the photoresist is not normally discharged or the pre-coating (trying to apply) is performed based on the pre-disposal at the end portion of the slit nozzle 41 and the removal of the deteriorated photoresist. In addition, precoating is also carried out during washing. At the time of the boring, the valve is opened and closed by the operator's instruction, and the pre-coating 杈 type, the first control, the washing, and the opening and closing of the valve 75, 76 is opened, and the valve 83 is opened and closed. 84. The waste liquid closes a 1 _ 86 and the pumping air is in a locked state. Thereby, the suction pipe 74 and the discharge stage fitting g 79 are used as the light-blocking liquid flow path from the supply mechanism 70 to the slit 1 U41.

O:\90\90600.DOC -30- 1253359 Next, by controlling the linear motor 5〇, 51 by the control system 6, the bridge structure* is moved from the standby position to the position where the pre-coating is performed (pre-not shown on the figure) The position where the coating plate is applied). Further, the buffer tank 72 is controlled by the control system 6, and the photoresist is supplied to the slit nozzle 41 at atmospheric pressure. In the precoating process of the substrate processing apparatus 1, high-precision discharge is not required. Therefore, it is not necessary to control the photoresist pump 81 to perform high-precision control of the discharge amount and the discharge flow rate. Therefore, the square of the photoresist liquid is supplied, and the photoresist liquid is not driven by the selection of the buffer tank 72 by the method of driving the photoresist 81, and the photoresist can be transported without generating a driving force. When the slit coater uses a high-viscosity photo-resistance liquid, and when it is used to wash and discard the deteriorated photoresist and fine particles, it is necessary to press the liquid at a high pressure. On the other hand, the substrate processing apparatus of the present embodiment can be used by precoating even in such a process. When the high pressure pre-coating is selected by the operator's input instruction, the first = ' control system 6 will open and close the valve 83 by the control signal, and the material is formed into an open shape =, and the opening and closing valve 75, the waste liquid valve 86 and the pumping The gas valve is in a locked state. Thereby, the remote selection preliminary pipe 85 serves as a photoresist liquid flow path from the supply mechanism 7 to the slit nozzle. Next, the control system 6 controls the linear motors 5, 51 to move the bridge structure 4. When k is applied to the substrate 90, the bridge structure 4 is placed at the above-described start discharge position, and the bridge structure is applied to the precoat plate when the measurement is performed by the gap sensing 42 in the same manner as the coating mode. The 4 series is disposed at the aforementioned pre-coating position.

O:\90\90600.DOC -31- 1253359 When the bridge structure 4 is placed at a specific position, the linear motor 50, 51 is controlled by the control system 6 to move the bridge structure 4 in a specific direction while being fine, (4) 41 to scan. At this time, the control line 6 opens the opening and closing valve 76, and controls the supply mechanism 7 to replenish the photoresist 71. The photoresist is pressurized from the supply mechanism 7 to the slit. The nozzle 41 is supplied with liquid, and the photoresist is discharged from the slit nozzle 41. As described above, the substrate processing apparatus 1 includes the preliminary piping 85, and the control system 6 has the function of selecting the preliminary piping 85, even if the pressure of the light barrier 81 is likely to be applied to the photoresist. In the case of liquid, the substrate processing apparatus 1 can still transport the photoresist. Therefore, even if it is a photoresist of 咼 viscosity, the substrate processing apparatus 1 can be used as a treatment liquid. Execute 4 inches of the discharge 4, linear motor 5 〇, 5 work to make the bridge structure 4 back to the standby position, and end the job mode. The above is a description of the operation of the pre-coating mode of the substrate processing apparatus. <1, 2, 3 Operation mode operation> The operation of the maintenance mode of the next (fourth substrate processing device). Substrate processing Install f 1 to clean (4) 丨 #74, discharge piping π, reserve 85 and waste piping 87, etc.) and the photoresist pump, or replace the photoresist. When the substrate processing apparatus 1 selects the maintenance mode by the operator's input instruction, the waste liquid valve 86 is opened by the control system 6. Substrate processing unit! As shown in Figs. 3 and 4, a pipe 814 of the resistive pump 81 is disposed along the two-axis direction. Also configured as a photoresist pump 81... the liquid-blocking direction becomes the direction along the Z-axis, and the height position of the mouth is

O:\90\90600.DOC -32- 1253359 is at a lower position than the height of the discharge port 816. In the substrate processing apparatus 1 of the present embodiment, the waste liquid pipe 87 is connected to the waste liquid pipe 87 at the lower position of the suction port 815 disposed at the suction port 815 and the discharge port 816, and the waste liquid valve is controlled by the control system 6. 86 forms an open-like odor 'can easily extract the photoresist liquid in the photoresist pump 8 1 . Further, 'the inside of the pipe 8丨4 which becomes the photoresist flow path does not form complicated irregularities, and only the waste liquid valve 86 is opened, and the photoresist liquid in the photoresist pump 8 can be introduced into the waste liquid pipe. 87 and smoothly extracted. Therefore, maintenance such as washing can be easily performed. Further, with such an arrangement, the bubbles in the photoresist system 81 are efficiently discharged to the upper crucible', so that the bubble removing operation can be easily performed. Further, when the waste liquid valve 86 is opened, the substrate processing apparatus 1 can also open the open/close valve 76 in an open state, and can effectively recover the photoresist liquid in the slit nozzle. Further, the waste liquid valve 86 is opened. In the state, the control system 6 can also control the recovery mechanism not shown in the figure to form the vacuum suction waste liquid pipe 87. At this time, the photoresist can be extracted more easily. After a certain period of time, waste (waste) and washing are completed. At the time of the cleaning and the removal process, the substrate processing apparatus 1 ends the maintenance mode, and the maintenance operation is completed on the display unit 63. Thus, the operator can know that the substrate processing apparatus i is in a state where the coating process can be started. When the substrate portion to the a structure 80 of the first embodiment performs the discharge operation and the suction operation, the valve flow path (the inner wall of the tube ln) is not exposed as shown in FIG. In the external atmosphere, it is possible to prevent the generation of fine particles. O:\90\90600.doc -33 - 1253359 Further, since the liquid supply mechanism 80 system|| delivers the treatment liquid by the contraction line 814, the flow of the treatment liquid can be suppressed. pulsation The liquid can be supplied with high precision. It is particularly effective in the application of the slit coating machine in the substrate processing apparatus, etc., because of the accuracy of transporting the photoresist to the slit nozzles, which greatly affects the discharge accuracy. Since the wear member (such as a 〇-shaped ring, etc.) such as the sealing material 113 of the prior piston pump 110 is not used in the resistive pump 81, the frequency of replacement of the parts can be suppressed, and the generation of fine particles due to abrasion can be suppressed. Since the internal shape of the resistive pump 8 1 is formed into a cylindrical simple shape (line 814), the treatment liquid inside the photoresist pump 81 can be easily discarded. Since it is fortunate that the treatment liquid is easily washed and removed, It is easy to carry out maintenance work. Compared with the general bellows pump, it is suitable for the application of color resist because of the excellent replacement of the treatment liquid. In addition, by the suction port 815 and the discharge port 816, The height position of one side is low, and the air bubbles inside the photoresist pump 8 can be easily discharged from the upper portion, and the treatment liquid can be easily discarded from the lower portion. This maintenance work is also easy. In addition, by the control system 6 The drive motor 821 of the drive drive mechanism 82 is selected to supply liquid and the liquid is supplied by the replenishing device 71, and the liquid supply can be performed according to the use condition of the substrate processing apparatus 1. Further, the 'substrate processing apparatus 1 is selected via the photoresist pump 8 by selection. The crucible and the suction pipe 74 convey the photoresist liquid, or the photoresist liquid is supplied through the preliminary pipe 85, and the liquid can be supplied depending on the state of the treatment liquid to be used. <2> The second embodiment> The first embodiment The substrate processing apparatus 1 is configured to transport a photoresist liquid to a slit nozzle 41 by a photoresist pump O:\90\90600.DOC -34-1253359 81. Ten... When the per-discharge® is applied during the coating process, the previous process is replaced by replacing the pre-resistance pump 81 with a large discharge amount. However, such a pump is not easy to manufacture accurately, and there is a problem that the coating accuracy is lowered. In the substrate processing apparatus 1 according to the first embodiment of the present invention, the pump for transporting the photoresist is not limited to one, and may be several. Fig. 6 is a view showing the connection relationship between the liquid supply mechanism ' of the substrate processing apparatus 1 of the second embodiment constructed in accordance with this principle and the slit nozzle 41. In addition, the configuration of the preparatory pipe 85 and the like in Fig. 6 is substantially the same as that of the first embodiment, and the drawings are omitted. The substrate processing apparatus according to the present embodiment is different from the substrate processing apparatus 1 of the first embodiment in that the liquid supply mechanism SOa includes two resist pumps 8u and 81b and two drive mechanisms 82a and 82b. Fig. 7 is a view showing the resist pumps 81a, 8 lb and the drive mechanisms 82a, 82b. The photoresist pump 8 1 a and the photoresist pump 8 1 b have substantially the same configuration as the photoresist pump 8 i of the first embodiment. In addition, since the drive mechanism 82a and the drive mechanism 82b have substantially the same structure as the drive mechanism 82 of the first embodiment, the same reference numerals will be given to the same reference numerals and will not be described. Each of the drive motors 821 is a DD motor, and each is independently connected to the control system 6. In the substrate processing apparatus 1 of the second embodiment, the mounting member 824 of the drive mechanism 82a is fixed to the joint member 813 of the resist pump 81a, and the mounting member 824 of the drive mechanism 82b is fixed to the joint member 813 of the resist pump 81b. That is, the drive mechanism 82a generates the driving force of the resistive pump 81a, and the drive mechanism 82b generates the driving force of the resist pump 81b. O:\90\90600.DOC -35 - 1253359 Thus, since the two resist pumps 81a, 81b are driven by separate drive mechanisms 82a, 82b, the control system 6 can independently control the photoresist 81a and The photoresist pump 81b can elastically control the liquid supply of the photoresist liquid in accordance with the condition. The details will be described later. As shown in Fig. 6, the discharge pipe 79 of the liquid supply mechanism 8A is branched into the first valve 79a and the second pipe 79b' as the liquid supply pipe for introducing the photoresist in the slit nozzle 41. The first pipe 79a is connected to the discharge port of the light barrier 8U, and has a function of introducing a photoresist liquid discharged from the photoresist pump 81a. Further, the second pipe is connected to the discharge port 816 of the photoresist pump 81b, and is incorporated into the discharge of the photoresist. The length and thickness of the flow path of the first one and the second two are substantially the same. The first pipe % and the second pipe are connected to each other in the joint portion CP, and the respective light-blocking liquids are merged in the joint CP to be guided by the discharge pipe 79. The discharge pipe 79 is connected to the supply port 410 provided in the center portion of the slit nozzle 41 in the axial direction (longitudinal direction). Next, the operation of the substrate processing apparatus 1 of the second embodiment will be described. In the substrate processing apparatus i of the present embodiment, the operation of forming the photoresist film on the surface of the substrate 90 is performed by substantially the same operation as the substrate processing apparatus 第 of the first embodiment, and therefore, the description thereof will be omitted. First, processing is started by "transporting the substrate 90 to the substrate processing", the linear motors 50, 51 move the bridge structure 4 in the (+χ) direction, and 2 the gap is measured by the gap sensing H42. The lifting mechanism adjusts the posture of the slit nozzle 41 from the output according to the sense = 4 . ’

O:\90\90600.DOC -36- 1253359 Next, the bridge structure 4 is moved in the (one turn) direction by the linear motors 50, 51, the slit nozzle 41 is moved to the start discharge position, and the slit nozzle is started. 41 scan. '

Ik the slit nozzle 41 to start scanning, and in the substrate processing garment 1 of the second embodiment, the photoresist liquid is also discharged from the slit nozzle 4丨. Specifically, the control system 6 supplies a control signal to the on-off valve 76 and the two drive motors 821, and when the slit nozzle 41 scans, the opening and closing valve % is opened, and the respective drive motors 821 are rotationally driven in the positive direction. The joint member 813 of the photoresist pump 8ia, 8 lb is moved in the (Z) direction. By this action, the first bellows 811 of the resist pumps 81a, 81b are elongated, and the second bellows 812 is contracted, so that the photoresist liquid sucked into the line 814 is discharged from the respective ports 816. That is, the photoresist liquid is discharged from the discharge port 816 of the photoresist system (1) to the first pipe 79a, and the photoresist liquid is discharged from the discharge port 816 of the photoresist pump 8ib to the second pipe 7913. The photoresist liquid thus discharged is joined to each other at the joint portion Cp, and is supplied to the slit nozzle 41 by the discharge register 79 to introduce the supply a41Q'. That is, the discharge amount of the slit nozzle 41 of the substrate processing apparatus 1 is the total amount of the discharge amount of the resist pump 8U and the discharge amount of the resistive pump 81b. Therefore, when the large-sized substrate 9_ is exposed to the light-blocking liquid, even if the slit nozzle 41 has to discharge a large amount of the photoresist liquid, it is necessary to enlarge the pump of the liquid-repellent mechanism 80a, and the X-body is still soiled. It ensures the necessary discharge. Therefore, the substrate processing apparatus L can increase the size of the response base (4) by using a small-sized fruit (photoresist 81a, 81b) of high precision without lowering the discharge accuracy. At this time, the control system 6 controls the discharge flow rate of the photoresist pump... and the discharge flow rate of the photoresist pump m from the slit nozzle 4] 3 t mountain Cry for 41 discharge of the photoresist liquid to the formation

O:\90\90600.DOC -37- 1253359 The flow rate required for the film thickness of the film. The substrate processing apparatus j of the present embodiment controls the moving speed of each of the bonding members 8 1 3 of the resist pump 8 la and the photoresist pump 8 lb to be the discharge flow rate of the photoresist pump 8 1 a and the discharge of the photoresist pump 8 1 b. The flow rates are approximately equal, and the total flow rate is the discharge flow rate of the desired slit nozzle 41. The moving speed of each of the engaging members 813 is realized by controlling the rotational speeds of the respective driving motors 82 1 of the driving mechanism 82a and the driving mechanism 82b. Further, as shown in FIG. 7, the photoresist pump 81a and the photoresist pump 81b have substantially the same structure. Further, the drive mechanism 82a and the drive mechanism 82b also have substantially the same configuration as each other. Further, in the first pipe 79a and the second pipe 79b, the flow path length and thickness of the photoresist liquid are substantially the same. The liquid supply mechanism 80a of the substrate processing apparatus 1 of the second embodiment has such a configuration (so-called similar configuration), and when the control system 6 controls the two drive motors 821 to be synchronized with each other, the photoresist pump 8 can be easily controlled. The discharge flow rate of 1 a is equal to the discharge flow rate of the photoresist pump 8 1 b. Further, the total flow rate of the discharge amount of the resistive pump 81a and the discharge amount of the resistive pump 81b is the speed distribution of the drive motor 821 for the flow rate necessary for forming a film having a desired film thickness, and is experimentally and preliminary coated in advance. The processing is performed, and the synchronization control as described above is performed in accordance with the result. Further, the control of the drive motor 82 1 by the control system 6 is not limited to the above-described synchronous control, and asynchronous control can be performed. The control system 6 is synchronously controlled as described above due to the difference in the use environment and the deterioration state of the members of the eight holes, or the difference in the processing accuracy of the members, which are used in the photoresist pumps 81a, 8b, and 8b and the drive mechanism 82a. When each of the drive motors 82 is turned on, the discharge amount of the resist pump 81a may be different from the discharge amount of the resist pump 81b. However, since the substrate processing apparatus of the second embodiment has two drivers

O:\90\90600.DOC • 38- 1253359 mechanism ❿, 82b 'and constitutes an independently controllable photoresist pump 81a and photoresist pump 81b. In this case, the control system 6 can also eliminate the synchronous control. Control of equal deviations. In addition, the light barrier 8 i a and the light barrier 8 1 b may be driven at different times. When the discharge from the slit nozzle 41 is started, it is also controlled to first drive only the resist pump "a. When the photoresist pump 81a completes the discharge, the resist pump 81b continues to be discharged. That is, the slit is scanned at the slit nozzle 41. When the application area is applied, any control can be performed as long as the discharge flow rate of the photoresist liquid of the slit nozzle 41 can be tailored. Thus, the substrate processing apparatus of the second embodiment can independently control the respective drive motors. 82丨, so the liquid feeding 匕 can be flexibly controlled according to the situation. Therefore, the high-precision discharge of the slit nozzle 4 can be achieved. The bridge structure 4 moves in the (X) direction, and the slit nozzle 41 moves to When the discharge position is completed, the control system 6 forms the closed state of the opening and closing valve 76, and stops the rotation of each of the drive motors 821, and stops the discharge of the photoresist from the slit nozzles 4. Thereafter, the substrate of the first embodiment is performed. In the same operation and control of the processing apparatus, when the processing of the substrate 90 is completed, the substrate 9 is carried out from the substrate processing apparatus 1 to the outside of the apparatus. Thus, the substrate processing apparatus of the second embodiment is provided with More than two photoresist pumps 8 1 a, 8 1 b are formed to ensure the discharge of the photoresist liquid that is discharged from the slit nozzles 4. Therefore, a small pump with high precision can be used, compared with when using a large pump. The discharge precision of the slit nozzle 41 can be improved. Generally, the discharge flow rate can be manufactured when the discharge amount per stroke is 200 cc or less and the discharge flow rate is about 〇2 to 1 〇CC/sec. About ±5%,

O:\90\90600.DOC -39- 1253359 The necessary discharge accuracy can be obtained when a photoresist film is formed on the substrate 90. Further, the straw is independently driven by at least two or more driving mechanisms 82 &amp; 821, respectively, and the liquid flow rate can be flexibly controlled depending on the situation. Further, although the substrate processing apparatus 1 of the second embodiment includes two resist pumps 81a and 81b, the number of pumps for transporting the photoresist to the slit nozzle 41 is not limited thereto, and more pumps may be used. The same applies to the following embodiments. &lt; 3. Third Embodiment&gt; The substrate processing apparatus according to the second embodiment is configured to drive two resist pumps 81a and 81b, and is provided with two drive mechanisms 82a and 8b, and each drive mechanism is provided. 82a, 82b independently drive the respective photoresist pumps 81a, 81b. Therefore, in order to make the discharge flow rate of the resist pump 81a and the photoresist pump 8113 equal, the control system 6 synchronously controls the drive mechanisms 82a, 82b. However, the method of simultaneously driving the two photoresist pumps 8U, 81b is not limited to being controlled by the control system 6, as can be mechanically controlled. Fig. 8 is a schematic view showing the connection relationship between the liquid supply mechanism 80b and the slit nozzle 41 of the substrate processing apparatus 1 according to the third embodiment constructed in accordance with this principle. In the substrate processing apparatus 1 of the present embodiment, the same functions as those of the first embodiment and the first embodiment are denoted by the same reference numerals, and their description is omitted. Two mounting members 824a, 824b are fixed to the nut member 823a of the drive mechanism 82c of the third embodiment. The mounting member 824a is a member having the same function as the mounting member 842 of the second embodiment of the driving mechanism 8 2 a, and is fixed to the photoresist pump 81 of the nut member 823a. Further, the mounting member 〇: \9 〇 \9 〇 6 〇〇 d 〇 C - 40 - 1253359 is attached to the side of the resist member 81b of the nut member 823 &amp; and is attached to the joint member 813 of the resist pump 81b. Next, the operation of the substrate processing apparatus according to the third embodiment will be described. The operation of forming the photoresist film on the surface of the substrate 9 by the substrate processing apparatus i of the present embodiment is performed by substantially the same operation as the substrate processing apparatus 1 of the first embodiment, and therefore will not be described. First, the processing is started by the substrate 90 being transported to the substrate processing apparatus 1±, and the linear motors 50, 51 move the bridge structure 4 in the (+ magic direction) while the gap is detected by the Μ sensor 42, the lifting mechanism 43, 44 adjusts the posture of the slit nozzle 41 according to the output of the gap 42. Next, the bridge structure 4 is moved in the (--magic direction) by the linear motor 50, 5丨, and the slit nozzle 41 is moved to the start discharge position. The scanning of the slit 41 is started. The scanning of the slit nozzle 41 is started. In the substrate processing apparatus 1 of the third embodiment, the photoresist is also discharged from the slit nozzle 41. First, the control system 6 The opening and closing valve 76 is opened, and the drive motor 821 of the drive mechanism 82c is rotated to move the nut member 823a in the ζ) direction. Thereby, the joint member 813 of the m81a and the joint member 813 of the resist pump are integrated. Moving in the (-z) direction at the same speed. Since the photoresist pump 8U and the photoresist system 81b are configured by members having substantially the same configuration, when the respective joint members 813 are moved at equal speed, the second embodiment is Substrate Similarly, since the respective pump photoresist ⑴, equal to the amount of liquid discharge of the device resist Chuan Shu. 4 move in a bridge configuration (i [chi]) direction, to move the end of the slit nozzle Μ

When the position is e:\90\90600.DOC -41 - 1253359, the control system 6 forms the lock-up state of the opening and closing valve 76, and stops the rotation of the drive motor 821, and stops the discharge of the photoresist from the slit nozzle 41. Thereafter, the same operation and control as in the substrate processing apparatus of the first embodiment are performed, and when the processing of the substrate 90 is completed, the substrate 9 is carried out from the substrate processing apparatus 1 to the outside of the apparatus. As described above, in the substrate processing apparatus according to the third embodiment, substantially the same effects as those of the substrate processing apparatus i of the second embodiment can be obtained. Further, in the substrate processing apparatus i of the second embodiment, the drive mechanism 82c is driven by the nut members 823a having the plurality of mounting members 824a, 824b to connect the two photoresists (4) a, 81b without the complexity of the control system 6. Control, it is also possible to drive the resist pumps 81a, 81b so that the respective discharge flows are easily equal. &lt;4. Fourth Embodiment&gt; The above-described embodiment is described in which the photoresist is supplied from one place to the slit nozzle Ο, but the position at which the photoresist is supplied is not limited to one. Fig. 9 is a front elevational view of the main body 1 of the substrate processing apparatus 1 according to the fourth embodiment constructed in accordance with this principle. In the substrate processing apparatus 1 of the present embodiment, the same functions as those of the first and second embodiments are denoted by the same reference numerals, and the description thereof is omitted. In the main body 2 of the present invention, a bridge is provided in the same manner as in the above embodiment. The bridge structure 4 is composed of the elevating mechanisms 43, 44 and the nozzle support portion 40. In the sneeze support. The liquid supply mechanism 8〇c and the liquid supply mechanism 80d are separately disposed on both sides of the Y-axis direction of 40. That is, each liquid feeding mechanism 8〇c, _ is arranged in fine

O:\90\90600.DOC - 42- 1253359 Both ends of the slit nozzle 41 in the longitudinal direction are above the 卩. By forming such an arrangement, the substrate processing apparatus i of the present embodiment can shorten the photoresist flow path from the respective photoresists (4) a, m to the slits, and can improve the reactivity of the slit nozzles w. The /10 series shows a connection diagram between the slit nozzle 41 of the substrate processing m of the fourth embodiment (4) and the liquid transport mechanism 8Ge, 8Gd, and a schematic view thereof. The two supply ports (supply port and supply port 410b) for supplying green liquid in the slit nozzle 41 are arranged in the Y-axis direction. That is, the positions at which the supply port 410a and the supply n4U)b are disposed are different in the longitudinal direction of the slit. The liquid supply mechanism 80c has substantially the same structure as the liquid supply mechanism_, and the liquid supply mechanism includes a photoresist (four) a, a drive mechanism 仏, and a discharge pipe 79. And a 76a liquid supply mechanism 8〇d has a photoresist pump 81 driving mechanism, a discharge pipe 79d, and an opening and closing valve 761). In the present case, the discharge port 816 of the resistive pump 81a is connected to the discharge pipe 79c, and the discharge pipe 79e is attached to the supply n41Ga of the slit nozzle η via the opening and closing valve %. Further, the discharge port 816 of the resistive pump (4) is connected to the discharge occupant 79d, and the discharge pipe 79d is attached to the supply port side of the slit nozzle 41 via the opening and closing valve 。. That is, the photoresist (4) a and the green (4) b - f are connected to the supply port 41A and the supply port 4i, b. The control system 6 detects the partial thickness adjustment of the formed film in the Y-axis direction to the supply port and the supply port machine by comparing the film thickness values of the films obtained by the rotation of the two gap sensors 42 with each other. The liquid supply of the photoresist is removed, and the deviation is removed. The liquid supply flow rate of the photoresist liquid supplied to the supply port 41〇a and the supply port 41〇b is driven by the respective light barriers, and each of the drives is O:\90\90600.doc •43- 1253359 motor 821 Since the rotation speed is (4), the control system 6 of the substrate processing apparatus 1 of the present embodiment performs feedback control based on the output of the gap detector 42 for each of the drive motors (2). 1 Next, the operation of the substrate processing apparatus according to the fourth embodiment will be described. The substrate processing apparatus of the embodiment! A photoresist film is formed on the surface of the substrate 90, and the substrate processing apparatus according to the first embodiment is performed! The actions "substantially the same" are therefore omitted as appropriate. First, the substrate 90 is transported to the substrate processing apparatus "to start processing, and the linear motors 50, 51 move the bridge structure 4 in the (+} 〇 direction, while the gap sensation 42 performs gap measurement, and the hoisting mechanism 43, 44 The posture of the slit nozzle 41 is adjusted in accordance with the output of the gap sensor 42. Next, the bridge structure 4 is moved in the (-χ) direction by the linear motor aw to move the slit nozzle 41 to the start discharge position, and the start is performed. Scanning of the slit nozzle 41. When the slit nozzle 41 starts scanning, the substrate processing apparatus 1 of the fourth embodiment also discharges the photoresist from the slit nozzle 41. The first control system 6 is opened and closed. The valves 76a and 76b are respectively opened, and the drive motors 821 of the respective drive mechanisms 82a and 82b are rotated in the forward direction to move the respective nut members 823 in the (-Z) direction. This is the same as the second embodiment. The resist liquid is discharged from the resist pumps 8la, 81b. &gt; At this time, the substrate processing apparatus of the second and third embodiments}, the photoresist liquid discharged from the two two pumps 81a, 81b is transported to fine The slit nozzles 41 merge in the middle, and It is supplied from a supply port 41〇 to the slit nozzle Μ. As in the substrate processing apparatus of the first to third embodiments, O:\90\90600.doc -44- 1253359 photoresist liquid is supplied from one place to the slit In the slit coater of the nozzle 41, when the slit nozzle 41 is enlarged in size as the substrate 9 is enlarged, the distance from the supply port 41 () is the closest to the supply port 410, and the distance is supplied. The distance difference between the ports 41〇 is increased. Therefore, the supply amount of the photoresist liquid at these positions is deviated, and the discharge nozzle of the slit nozzle is not uniform in the direction of the x-axis. Further, the slit nozzle 41 is large and large. Since the processing accuracy of the slit nozzle 41 is lowered, the discharge flow rate is not uniform in the γ-axis direction. However, in the substrate processing apparatus according to the fourth embodiment, the photoresist is discharged from each of the photoresist pumps 8ia. The vertical flow path (discharge pipe 79c and = discharge pipe 79d) is supplied to different positions of the slit nozzle 41. Therefore, the substrate processing apparatus i of the present embodiment has the basis of the first to third embodiments. Comparing the device 1, the position closest to the supply port and the distance from the supply port can be shortened The distance difference between the m position and the supply port can suppress the deviation of the discharge flow rate of the slit nozzle 长度 in the longitudinal direction, thereby improving the discharge accuracy of the slit nozzle. The bridge structure 4 moves in the (1-X) direction. The slit nozzle 41 is moved to the end position 4'. The control system 6 opens and closes the knob 76a, and (10) forms a locked state. Second, the rotation of the mouth motor 82 1 is stopped, and the discharge of the photoresist from the slit nozzle 4 is stopped. ' /, the same action as the substrate processing apparatus 1 of the first embodiment of the first embodiment is used to measure the gap between the photoresist film formed on the surface of the substrate 9 by the gap sensor 42. The operation unit 60 is based on two The output of the gap sensor 42 is used to determine the thickness of the photoresist film at each position, and by comparing the values with each other, the deviation of the film thickness of the photoresist film in the γ-axis direction is measured. Thickness difference).

O:\90\90600.DOC -45- 1253359 When the control system 6 discharges the photoresist from the substrate 9 to be processed, the drive motor (2) is controlled according to the difference in film thickness obtained by the calculation 460. That is, the rotational speed of each of the drive motors 821 is such that the thickness of the formed photoresist film is uniform in the axial direction (the obtained film thickness difference is "〇"). &quot; Thus, the substrate processing apparatus can independently feedbackly control the respective driving motors Μ b according to the output of the gap unit 42 and the film thickness value of the photoresist film to be controlled, whereby even the processing precision of the slit nozzle 41 is large When the pressure is reduced, the liquid flow rate of the resist pumps 81a, 81b can be controlled to eliminate the deviation of the discharge flow rate in the direction of the x-axis, so that the discharge accuracy of the slit nozzle 41 can be improved. In the substrate processing apparatus according to the first embodiment, after the inspection of the photoresist film is completed, the stage 3 stops sucking the substrate 9A, and the operator or the transport mechanism takes out the substrate 9 from the holding surface 30 and transports it to the next one. Processing steps. As described above, in the substrate processing apparatus according to the fourth embodiment, even when the length of the substrate 90 is increased, the length of the substrate (the γ-axis direction) is a large slit nozzle 41 having a size of more than 30 The liquid mechanisms 8〇c, 8〇d are respectively disposed at the opposite ends of the slit nozzle 41, and the photoresist liquid is supplied from the two places to the slit nozzle 41, respectively, and the photoresist liquid of the slit nozzle 41 in the longitudinal direction can be promoted. The supply, and 'e uniformity. Therefore, the discharge accuracy of the slit nozzle * 1 can be improved. Further, the drive motors 821 of the respective photoresist pumps 81a, 81b are driven by the feedback control according to the output of the gap sensor 42, and the control according to the actual measurement value can be performed to further improve the discharge accuracy. Further, the substrate processing apparatus 1 of the present embodiment describes that the photoresist liquid is supplied from the two places to the slit nozzle 41, but it is also possible to supply the photoresist liquid from a plurality of positions. 0: \90\90600.DOC -46* 1253359 &lt;5. Modifications&gt; The embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments, and various modifications can be made. The substrate processing apparatus according to the above embodiment is a so-called slit coater that discharges a photoresist from a slit nozzle, but the present invention is not limited to the slit coater. Further, the pump driven by the drive mechanism 82 is not limited to the pump in the form of a photoresist pump 8 but can also be used to drive the piston of the piston pump. That is, any pump can be used as long as it is a pump that supplies liquid by driving the moving portion along a linear shaft. Further, the photoresist pumps 81, 81a, 81b may be provided below the slit nozzles 41. At this time, it is possible to more effectively recover and discard the photoresist from the photoresist pump 81 and the slit nozzle. In addition, as described above, in order to improve the discharge accuracy of the slit nozzle 41, it is preferable to shorten the self-light. (4) of each of the resisting pumps 81, 81a, 81b is discharged to σ8ΐ6 to the slit nozzle ^4.) The substrate processing of the first to third embodiments: setting 1 is wrong by the liquid feeding mechanism 8〇, 8〇a 8〇b is provided on the nozzle support portion 40 to shorten the distance. However, the liquid supply mechanism 80, 80a,_ can be attached to the vicinity of the central portion of the nozzle support portion 40 to further shorten the distance. As shown in the substrate processing apparatus of the fourth embodiment, the slitting spray has a plurality of supply ports, and when the side is in the side, in order to improve the discharge unevenness of the slit nozzle 41 = axis direction, it is explained that feedback control is used. The function is not limited to this case, that is, even as shown in the first to second forms, the slit nozzle 41 has only a single supply port "Ο ^ is a self-squeezing nozzle 41 The flow rate of the discharged photoresist is controlled

O:\90\90600.DOC -47- 1253359: The drive motor 821 can also be feedback-controlled according to the film f of the photoresist film obtained from the wheel sensor 42. That is, the velocity distribution of the drive motor 821 obtained by a preliminary experiment or the like can also be corrected by feedback control. According to the invention of the patent scope, the indirect liquid is sealed in the space between the container member and the pipe member by the s-way member disposed inside the container member, and a part of the flow path of the treatment liquid is not exposed to the air. The invention can suppress the generation of the microparticles, and can be easily cleaned and the like. The invention of the fourth item of the patent of the patent of the fourth month of the patent is provided by the control means: a fixed capacity f supply means, which controls the delivery of the liquid supply means The delivery of the specific treatment liquid, and the fixed flow supply means control the flow rate of the specific treatment liquid by the liquid supply means, and the treatment liquid can be discharged with high precision. The invention of the patent target 5th item is defined as The height position of any one of the suction port β 4 ^ on the both sides of the pipe member and the discharge port is lower than that which facilitates the liquid supply means to remove the air bubbles, and the liquid discharge is easy. The invention of claim 6 is by the invention. The buffer tank allows the liquid feeding means to attract the specific processing liquid at atmospheric pressure, thereby reducing the attraction force when the liquid feeding means attracts the processing liquid. , at the height of the discharge port of the slit nozzle, the slit nozzle is discharged. By setting the liquid level of the buffer tank to be low, the undesired treatment liquid can be suppressed from the invention of the eighth application patent scope, and the specific means is supplemented by the supplementary means. The pressure will be stored in the buffer tank, and the treatment liquid of the force and the sputum will be transported to the slit nozzle. Especially if you drive the drive, the treatment liquid can be transported without J.

O:\90\90600.DOC -48 - 1253359 The invention of claim 9 is further characterized by further measuring means for measuring the amount of the specific treatment liquid stored in the buffer tank, and maintaining the buffer tank appropriately The amount of liquid processed. According to the invention of claim 10, the preparatory flow is provided by the step-by-step method, and the specific treatment liquid is introduced into the slit nozzle by the liquid supply means: when the treatment liquid having a high viscosity is used, even if the application is high The pressure can be used to transport the treatment liquid without damaging the liquid supply means. The invention of claiming the scope of the application is provided by the step-by-step method: the liquid supply selection + the eight system is used to convey the treatment liquid of the known '疋 to the slit nozzle, and f is selected by the drive driving means to supply liquid, and Any means of augmenting the means for feeding liquid, which is selected to be transported by means of a liquid supply means, or which may be fed via a preparatory flow path, and may be delivered according to conditions. In the case of (4) _12th invention, the flow path selection means has a valve for opening the preparatory flow path, and the flow path can be easily selected. In the invention of claim 13, the liquid supply mechanism for conveying the treatment liquid in the slit nozzle has at least two liquid supply pumps, and the liquid pump can be used between the liquid supply and the liquid, thereby improving Excretion accuracy of the slit nozzle. According to the invention of claim 14, the liquid supply pipe is connected to the at least two treatment liquids one by one, the mouthpiece to the &gt;, the two liquid supply pumps, and the pair of slitting sprays are supplied from one place. When the liquid is _, and the brakes are smashed, the discharge uniformity of the slit nozzles can be promoted to be uniform. According to the invention of claim 15 of the patent application, by controlling the driving result of the film thickness detecting means, the thickness of the boat is uniform and can be controlled according to the measured value, so that the desired film can be formed.

O:\90\90600.DOC -49- 1253359 Figure 3 is a schematic view of the supply mechanism and the liquid supply mechanism. Figure 4 is a detailed view of the liquid supply mechanism. Figure 5 is a detailed view of the drive mechanism. Fig. 6 is a schematic view showing the connection relationship between the liquid supply mechanism and the slit nozzle of the second embodiment. Fig. 7 is a view showing a photoresist pump and a drive mechanism of the second embodiment. Fig. 8 is a schematic view showing the connection relationship between the liquid supply mechanism and the slit nozzle of the third embodiment. Fig. 9 is a front elevational view showing the main body of the substrate processing apparatus of the fourth embodiment. Fig. 10 is a schematic view showing the connection relationship between the liquid supply mechanism and the slit nozzle of the substrate processing apparatus of the fourth embodiment. Figure 11 is a diagram of a prior liquid delivery device. [Description of Symbols of Drawings] 1 Substrate processing apparatus 3 Stage 6 Control system 30 Holding surface 41 Slot nozzles 410, 410a, 410b Supply port 41a Discharge port 42 Gap sensor 50, 51 Linear motor 70 Supply mechanism 71 Supplement ' Apparatus O:\90\90600.DOC -51 - 1253359 72 73 74 75, 76, 76a, 76b, 83, 84 77 78 79, 79c, 79, 79d 79a 79b 80, 80a, 80b, 80c, 80d 81, 81a , 81b 810 811 812 813 814 815 816 82, 82a, 82b, 82c 85 86 87 88 89 Buffer tank sensor suction pipe opening and closing valve filter check valve discharge pipe first pipe second pipe liquid supply mechanism light resistance pump Cover first bellows second bellows joint member pipe. Suction port discharge drive mechanism preparatory pipe waste liquid valve waste liquid pipe exhaust valve exhaust pipe O:\90\90600.DOC -52- 1253359 90 substrate LQ indirect Liquid O:\90\90600.DOC -53 -

Claims (1)

Patent application for 1253 %®3i〇i977 Chinese application for the replacement of patent scope ('9'4 December) pick-up, application for patent garden: - (4) is a case where the substrate is cut into a specific processing liquid film, and includes a holding table for holding the substrate, and a slit nozzle for discharging the specific processing liquid The main surface port of the substrate is supplied with the specific processing liquid; and the liquid supply means is configured to transport the specific processing liquid to the slit nozzle; and the liquid feeding means has a container member, which is Changing the internal volume; 2 members, which form the flow path of the specific treatment liquid inside, and can change the internal volume; and the driving means, which change the meaning of the meaning - the more internal volume of the container member; The pipe member is disposed inside the member, and an indirect liquid is sealed in a space between the two members of the container. 2. A substrate processing apparatus according to the patent item, wherein the container member includes a μ- and a second bellows, and the first driving means that communicates with each other moves the first specific direction. The boundary of the bellows is adjacent to the side of the bellows. 3. For example, the substrate processing device of the application of the patented ribs, the middle of the month, the 'J-back spun nozzle is a treatment liquid; Special 90600-941209.doc I j , ;, r......(10)(10) one by one~. The speed at which the boundary of the vicinity of the boundary of the second bellows is controlled is 〃 the speed at which the moving speed of the slit nozzle is synchronized. 4. The substrate processing apparatus according to claim 1, wherein the control means includes: a capacity supply means for controlling the delivery of the hydrazine treatment liquid by the liquid supply means. And the flow rate supply means, wherein the flow rate of the specific treatment liquid of the pre-liquid means is (4). 5. The substrate processing apparatus according to claim 1, wherein the liquid transport means is provided with suction ports and discharge ports respectively located at both end sides of the pipe member; and is disposed between the suction port and the discharge port The A degree position of either party is lower than the other. The substrate processing apparatus according to claim 1, wherein the supply mechanism has a buffer tank for storing the specific treatment liquid, and the buffer tank causes the liquid supply means to be attracted to the atmosphere. Treatment solution. 7. The substrate processing according to claim 6, wherein the liquid level of the buffer tank is determined to be lower than a discharge opening of the slit nozzle. 8. The substrate processing apparatus according to claim 6, wherein the feeding means further comprises means for supplementing the specific processing liquid in the buffer tank; and the supplementary means is stored in the buffer tank at a specific pressure. In the 90600-941209.doc -2-: more: engraved j fine image: the treatment solution of the ribs is sent to the aforementioned slit nozzle. 9. The substrate processing apparatus according to item 6, wherein the supply robot and the measuring means measure the amount of the treatment liquid stored in the buffer tank. 10. The substrate processing apparatus according to item 8 of the patent application, wherein the inlet-nivine road is transported by the aforementioned supplementary means to the above-mentioned special two: into the ', without the aforementioned liquid feeding means, the specific one is The treatment liquid is introduced into the slit nozzle. ^ ^ Apply for the substrate processing device of the scope of the patent 1G, in which the step-by-step equipment ‘, J liquid selection! The means 'delivering the specific processing liquid to the above-mentioned: wide selection of any one of the liquid feeding means by the driving means to drive the liquid and the supplementary means; and the means for selecting the liquid supply means Transportation, or, work is carried out by a separate flow path. 12. If the substrate of the patent application scope &quot; item is shaken by the host θ丄, the flow path is selected as the hand slave/the valve that opens and closes the aforementioned preparatory flow path. 13. The substrate according to the ninth aspect of the patent application, wherein the liquid feeding means has: ^ a plurality of the container members; and one by one arranged in the plurality of container members. A plurality of the above-mentioned pipe structures 14 of the present invention, such as the substrate liquid feeding pipe of the thirteenth aspect of the patent application, which is further provided with a 90600-941209.doc 1253359 ? ^ - - * a flow path for forming the specific treatment liquid between the plurality of capacitor members and the slit nozzle; a plurality of processing liquid supply ports are provided in the slit nozzle, and the liquid supply piping is connected one-to-one far away A plurality of processing liquids are provided for the mouth and a plurality of container members. The substrate processing apparatus of claim 4, wherein the step-by-step thickness detecting means detects the film formed on the surface of the substrate, and the means is based on the detection result of the film thickness detecting means, and is obscured The thickness of the sentence is controlled in a manner that controls the aforementioned drive mechanism. The substrate processing apparatus of the Uth aspect of the invention, wherein the drive unit and the cutter independently change the internal volume of the W member. A substrate processing apparatus according to Item 13, wherein the driving machine 2 is connected to (four) a plurality of container members and the container member is a member.夂 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ For example, paragraph i of the scope of patent application has: &amp; processing breaks, which can be used to describe the liquid hand drive motor, which produces two ball screws, 1 Wessa's driving force for the treatment liquid; , the system and the aforementioned spheroidal screw:: turn 'lead member, basin conduction against the system&amp; guide the fan member driving direction; and 90600-941209.doc -4- 1255359 - just described the drive motor; At low speed rotation, there is a motor control means of less than 1%, which controls the speed accuracy of the above-mentioned drive motor at 50 rpm, and has an accuracy of decomposition capability of 2] 7 p / rev or more for control from the aforementioned control means; The ball screw and the nut member are formed of a member integrally manufactured. The substrate processing apparatus of claim 19, wherein the spherical screw has a lead length of 3 mm to 6 mm. , 90600-941209.doc