TW201718107A - Coating device to increase the responsiveness of extraction liquid when the formation of coated film ends for forming a coating film with uniform thickness - Google Patents
Coating device to increase the responsiveness of extraction liquid when the formation of coated film ends for forming a coating film with uniform thickness Download PDFInfo
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- TW201718107A TW201718107A TW105125649A TW105125649A TW201718107A TW 201718107 A TW201718107 A TW 201718107A TW 105125649 A TW105125649 A TW 105125649A TW 105125649 A TW105125649 A TW 105125649A TW 201718107 A TW201718107 A TW 201718107A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
- B05C11/101—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to weight of a container for liquid or other fluent material; responsive to level of liquid or other fluent material in a container
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
Abstract
Description
本發明係關於一種藉由自塗布噴嘴噴出塗布液而於基板上形成塗布膜之塗布裝置，尤其關於一種提高塗布膜形成結束時之脫液之應答性之塗布裝置。 The present invention relates to a coating apparatus for forming a coating film on a substrate by ejecting a coating liquid from a coating nozzle, and more particularly to a coating apparatus for improving responsiveness of deliquoring at the end of formation of a coating film.
作為於玻璃基板或膜等基板形成塗布膜之裝置，已知有具備噴出塗布液之塗布噴嘴之塗布裝置(例如參照專利文獻1)。該塗布裝置具有供給塗布液之塗布液供給部，藉由自塗布液供給部向塗布噴嘴供給塗布液，使塗布液自塗布噴嘴噴出。然後，藉由於使塗布液自塗布噴嘴噴出之狀態下使該塗布噴嘴與載物台部相對移動，於載置於載物台部上之基板上形成固定厚度之塗布膜。 As a device for forming a coating film on a substrate such as a glass substrate or a film, a coating device including a coating nozzle for discharging a coating liquid is known (for example, see Patent Document 1). This coating apparatus has a coating liquid supply unit that supplies a coating liquid, and supplies a coating liquid from the coating liquid supply unit to the coating nozzle to eject the coating liquid from the coating nozzle. Then, by moving the coating nozzle and the stage portion in a state where the coating liquid is ejected from the coating nozzle, a coating film having a fixed thickness is formed on the substrate placed on the stage portion.
為了製造高品質之製品(例如高品質之彩色濾光片)，塗布膜形成開始至塗布膜形成結束之總區域之膜厚之均勻性要求高精度。尤其是於塗布膜形成結束時，進行於噴出特定量之塗布液後停止供給塗布液之脫液。然而，即便進行脫液，亦存在連結塗布噴嘴與基板之塗布液(所謂之液珠)，因此難以使塗布膜之終端部之膜厚均勻。因此，藉由於連結於塗布噴嘴之配管設置回吸閥，並利用回吸閥抽吸塗布膜形成結束時之塗布液，藉此控制塗布液之供給量，從而均勻地形成膜厚終端部(參照下述專利文獻2)。 In order to produce a high-quality product (for example, a high-quality color filter), the uniformity of the film thickness in the total area from the start of coating film formation to the end of formation of the coating film requires high precision. In particular, when the formation of the coating film is completed, the liquid to be discharged from the coating liquid is stopped after a specific amount of the coating liquid is discharged. However, even if the liquid is removed, there is a coating liquid (so-called liquid bead) that connects the coating nozzle and the substrate. Therefore, it is difficult to make the film thickness of the end portion of the coating film uniform. Therefore, the backing valve is provided in the pipe connected to the coating nozzle, and the coating liquid at the end of the formation of the coating film is sucked by the suck-back valve, thereby controlling the supply amount of the coating liquid, thereby uniformly forming the film thickness end portion (refer to Patent Document 2) below.
[專利文獻1]日本專利特開2005-244155號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-244155
[專利文獻2]日本專利特開2014-180604號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2014-180604
近年來，進行有於一片基板形成複數張相當於顯示器大小之塗布膜之多倒角。該多倒角係藉由使基板以固定速度不停歇地相對連續移行，並重複進行來自塗布噴嘴之塗布液之噴出及停止、即所謂之間歇塗布而進行。然而，於上述塗布裝置中，存在因回吸閥之抽吸之應答性之問題而導致膜厚終端部之膜厚之均勻性受損之情形，若以間歇塗布之方式連續地進行膜厚終端部之處理，則均勻性受損之現象顯著。 In recent years, it has been performed to form a plurality of chamfers of a plurality of coating films corresponding to the size of a display on one substrate. The multi-chamfering is performed by continuously ejecting the substrate at a constant speed and continuously discharging and stopping the coating liquid from the coating nozzle, that is, so-called intermittent coating. However, in the above coating apparatus, there is a case where the uniformity of the film thickness at the end portion of the film thickness is impaired due to the problem of the responsiveness of the suction of the suction valve, and the film thickness terminal is continuously performed by intermittent coating. In the treatment of the Ministry, the phenomenon of uniformity is impaired.
因此，本發明之目的在於提供一種可藉由提高塗布膜形成結束時之脫液之應答性而形成厚度均勻之塗布膜之塗布裝置。 Accordingly, an object of the present invention is to provide a coating apparatus which can form a coating film having a uniform thickness by improving the responsiveness of deliquoring at the end of formation of a coating film.
為了解決上述問題，本發明之塗布裝置具備：塗布噴嘴，其噴出塗布液；載物台部，其載置基板；及塗布液供給部，其向上述塗布噴嘴供給塗布液；且藉由使自上述塗布液供給部供給之塗布液自上述塗布噴嘴噴出，並且使上述塗布噴嘴與上述載物台部相對移動而於基板上形成塗布膜，該塗布裝置之特徵在於，進而具備抽吸上述塗布噴嘴內之塗布液之塗布液抽吸部，上述塗布液抽吸部具有抽吸源、及配置於連結該抽吸源與上述塗布噴嘴之配管路徑且直徑大於上述配管之抽吸用槽，上述塗布液抽吸部之抽吸動作係於來自上述塗布噴嘴之塗布液之液面存在於上述抽吸用槽之狀態下藉由上述抽吸源使上述抽吸用槽內減壓而進行。 In order to solve the above problems, the coating apparatus of the present invention includes: a coating nozzle that ejects a coating liquid; a stage portion on which a substrate is placed; and a coating liquid supply unit that supplies a coating liquid to the coating nozzle; The coating liquid supplied from the coating liquid supply unit is ejected from the coating nozzle, and the coating nozzle and the stage portion are moved relative to each other to form a coating film on the substrate. The coating device further includes suctioning the coating nozzle. In the coating liquid suction unit of the coating liquid, the coating liquid suction unit includes a suction source, and a suction groove that is disposed in a pipe path connecting the suction source and the coating nozzle and has a larger diameter than the pipe. The suction operation of the liquid suction unit is performed by decompressing the inside of the suction tank by the suction source in a state where the liquid surface of the coating liquid from the coating nozzle is present in the suction tank.
根據本發明，由於可藉由塗布液抽吸部之抽吸源(例如真空泵)抽吸塗布噴嘴內之塗布液，故而與使用回吸閥之先前之裝置相比，容易 設定抽吸時序，且亦不存在抽吸容量之限制，故而可提高塗布膜形成結束時之抽吸之應答性。並且，塗布液抽吸部之抽吸動作係於來自上述塗布噴嘴之塗布液之液面存在於抽吸用槽之狀態下進行，藉此可產生穩定之抽吸力。即，於不存在抽吸用槽之狀態下，藉由抽吸源而抽吸之塗布液儲存於自塗布噴嘴連結至抽吸源之配管內。因自重而欲流向塗布噴嘴側之力作用於儲存於該配管內之塗布液。並且，藉由進行間歇塗布並連續地進行複數次抽吸動作，充滿配管內之塗布液之量逐漸增加，故而欲流向塗布噴嘴側之力逐漸增大，並且因塗布液之黏度而導致與配管表面之阻力增大，塗布液之抽吸量相對於抽吸源之抽吸力產生變化。即，若配管內之塗布液於高度方向上變化，則塗布液抽吸部之抽吸量逐漸降低，故而產生藉由間歇塗布而形成之塗布膜之膜厚終端部之均勻性隨著形成塗布膜而逐漸變差之傾向。因此，藉由於配管路徑設置形成為直徑大於配管之抽吸用槽並於塗布液之液面存在於抽吸用槽之狀態下進行抽吸動作，即便藉由間歇塗布進行複數次抽吸動作所抽吸之塗布液之量增加，與配管相比，亦可縮小液面之高度方向之位移量。因此，於間歇塗布動作中，藉由於液面存在於抽吸用槽內之狀態下進行抽吸動作，與儲存於配管之先前情況相比，可極大地抑制塗布液之抽吸力之變化，從而可使膜厚終端部之均勻性穩定。 According to the present invention, since the coating liquid in the coating nozzle can be sucked by the suction source (for example, a vacuum pump) of the coating liquid suction portion, it is easier than the prior device using the suction valve. Since the suction timing is set and there is no limitation in the suction capacity, the responsiveness of the suction at the end of the formation of the coating film can be improved. Further, the suction operation of the coating liquid suction unit is performed in a state where the liquid surface of the coating liquid from the coating nozzle is present in the suction tank, whereby a stable suction force can be generated. That is, in the state where the suction groove is not present, the coating liquid sucked by the suction source is stored in the pipe connected to the suction source from the coating nozzle. The force to be applied to the coating nozzle side due to its own weight acts on the coating liquid stored in the piping. Further, by intermittently applying and continuously performing a plurality of pumping operations, the amount of the coating liquid in the filled pipe is gradually increased, so that the force to be applied to the coating nozzle side is gradually increased, and the viscosity of the coating liquid is caused by the piping. The resistance of the surface is increased, and the amount of suction of the coating liquid changes with respect to the suction force of the suction source. In other words, when the coating liquid in the pipe is changed in the height direction, the suction amount of the coating liquid suction portion is gradually lowered, so that the uniformity of the film thickness end portion of the coating film formed by the intermittent coating is formed along with the coating. The tendency of the film to gradually deteriorate. Therefore, the suction operation is performed in a state where the diameter of the pipe is larger than the suction groove of the pipe and the liquid level of the coating liquid is present in the suction groove, even if the suction operation is performed by intermittent application. The amount of the coating liquid to be suctioned is increased, and the amount of displacement in the height direction of the liquid surface can be reduced as compared with the piping. Therefore, in the intermittent coating operation, the suction operation is performed in a state where the liquid surface exists in the suction groove, and the change in the suction force of the coating liquid can be greatly suppressed as compared with the case where it was stored in the piping. Thereby, the uniformity of the film thickness terminal portion can be stabilized.
又，上述塗布液抽吸部亦可設為如下構成，即：具有用以回收塗布液之回收槽，於上述抽吸用槽設置有偵測塗布液之液面之上限及下限之液面感測器，藉由進行上述塗布液抽吸部之抽吸動作，若上述液面感測器偵測到塗布液之液面達到上限，便將上述抽吸用槽內之塗布液送液至上述回收槽，若上述液面感測器偵測到塗布液之液面達到下限，便停止對回收槽之送液。 Further, the coating liquid suction unit may have a configuration in which a recovery tank for recovering the coating liquid is provided, and the suction tank is provided with a liquid level feeling for detecting the upper limit and the lower limit of the liquid surface of the coating liquid. The measuring device is configured to perform the pumping operation of the coating liquid suction portion, and if the liquid level sensor detects that the liquid level of the coating liquid reaches the upper limit, the coating liquid in the suction tank is sent to the above In the recovery tank, if the liquid level sensor detects that the liquid level of the coating liquid reaches the lower limit, the liquid supply to the recovery tank is stopped.
根據該構成，由於具備與抽吸用槽分開之回收槽，故而可使塗布液之液面始終停留於抽吸用槽內，從而可長期地抑制塗布液之抽吸 力之變化。 According to this configuration, since the recovery tank is provided separately from the suction tank, the liquid level of the coating liquid can always stay in the suction tank, and the suction of the coating liquid can be suppressed for a long period of time. Change in power.
根據本發明，藉由提高塗布膜形成結束時之脫液之應答性，可形成厚度均勻之塗布膜。 According to the present invention, a coating film having a uniform thickness can be formed by increasing the responsiveness of the liquid removal at the end of the formation of the coating film.
1‧‧‧塗布裝置 1‧‧‧ Coating device
2‧‧‧塗布液供給部 2‧‧‧ Coating Liquid Supply Department
3‧‧‧載物台部 3‧‧‧The Stage Department
4‧‧‧配管 4‧‧‧Pipe
6‧‧‧液面感測器 6‧‧‧liquid level sensor
7‧‧‧塗布液抽吸部 7‧‧‧ Coating liquid suction unit
10‧‧‧塗布單元 10‧‧‧ Coating unit
11‧‧‧腳部 11‧‧‧ feet
12‧‧‧塗布噴嘴 12‧‧‧ Coating nozzle
12a‧‧‧狹縫噴嘴 12a‧‧‧Slit nozzle
20‧‧‧塗布液泵 20‧‧‧ Coating liquid pump
21‧‧‧塗布液槽 21‧‧‧ Coating tank
21a‧‧‧底面部 21a‧‧‧ bottom part
22‧‧‧送液加壓裝置 22‧‧‧ Liquid feeding device
41‧‧‧配管 41‧‧‧Pipe
51‧‧‧抽吸閥 51‧‧‧ suction valve
52‧‧‧噴出閥 52‧‧‧Spray valve
53‧‧‧退避閥 53‧‧‧Retraction valve
61‧‧‧上限感測器 61‧‧‧Upper limit sensor
62‧‧‧下限感測器 62‧‧‧lower limit sensor
71‧‧‧抽吸源 71‧‧‧Sucking source
72‧‧‧抽吸用槽 72‧‧‧Slots for suction
72a‧‧‧上表面 72a‧‧‧Upper surface
72b‧‧‧底面 72b‧‧‧ bottom
73‧‧‧回收槽 73‧‧‧Recycling tank
W‧‧‧基板 W‧‧‧Substrate
圖1係概略性地表示本發明之塗布裝置之配管系統圖。 Fig. 1 is a view schematically showing a piping system of a coating apparatus of the present invention.
圖2係本發明之塗布裝置之概略立體圖。 Fig. 2 is a schematic perspective view of a coating apparatus of the present invention.
圖3係表示塗布裝置之塗布單元之腳部附近之圖。 Fig. 3 is a view showing the vicinity of the leg portion of the coating unit of the coating device.
圖4係表示不存在抽吸用槽之情形時之塗布液儲存於配管內之狀態的圖，(a)係表示抽吸塗布液之前之狀態之圖，(b)係表示抽吸塗布液後塗布液儲存於配管內之狀態之圖。 Fig. 4 is a view showing a state in which the coating liquid is stored in the pipe in the case where the suction groove is not present, (a) is a view showing a state before the application of the coating liquid, and (b) is a state after the application of the coating liquid. A diagram of a state in which the coating liquid is stored in a pipe.
圖5係表示塗布液儲存於抽吸用槽之狀態之圖，(a)係表示抽吸塗布液之前之狀態之圖，(b)係表示抽吸塗布液後塗布液儲存於抽吸用槽內之狀態之圖。 Fig. 5 is a view showing a state in which a coating liquid is stored in a suction tank, wherein (a) is a view showing a state before the application of the coating liquid, and (b) is a state in which the coating liquid is stored in the suction tank after the application of the coating liquid. A diagram of the state within.
以下，基於圖式對本發明之實施形態進行說明。 Hereinafter, embodiments of the present invention will be described based on the drawings.
使用圖式對本發明之實施形態進行說明。 Embodiments of the present invention will be described using the drawings.
圖1係概略性地表示本發明之塗布裝置之配管系統圖，圖2係塗布裝置整體之概略立體圖，圖3係表示塗布裝置之塗布單元之腳部附近之圖。 Fig. 1 is a schematic view showing a piping system of a coating apparatus according to the present invention, Fig. 2 is a schematic perspective view of the entire coating apparatus, and Fig. 3 is a view showing a vicinity of a leg portion of a coating unit of the coating apparatus.
如圖1所示，塗布裝置1具有：載物台部3，其載置基板W；塗布單元10，其將塗布液噴出至基板W上；及塗布液供給部2，其向該塗布噴嘴12供給塗布液。並且，藉由將塗布液自塗布液供給部2供給至塗布單元10而使塗布液自塗布單元10噴出，藉由於使塗布液自塗布單元10噴出之狀態下使該塗布單元10與載物台部3相對移動，而於載置於載物台部3上之基板W上形成固定厚度之塗布膜。 As shown in FIG. 1, the coating apparatus 1 has a stage portion 3 on which a substrate W is placed, a coating unit 10 that ejects a coating liquid onto the substrate W, and a coating liquid supply unit 2 to which the coating nozzle 12 is applied. The coating liquid is supplied. In addition, the coating liquid is supplied from the coating liquid supply unit 2 to the coating unit 10 to eject the coating liquid from the coating unit 10, and the coating unit 10 and the stage are caused to be discharged from the coating unit 10 by the coating liquid. The portion 3 is relatively moved, and a coating film having a fixed thickness is formed on the substrate W placed on the stage portion 3.
載物台部3係載置所搬入之基板W者。該載物台部3具有平坦地形成之基板保持面，且可於該基板保持面上以維持水平姿勢之狀態保持基板W。即，於載物台部3設置有未圖示之基板保持機構，且藉由該基板保持機構保持基板W。具體而言，藉由於載物台部3之表面形成複數個抽吸孔，並使該抽吸孔產生抽吸力，可使基板W吸附並保持於載物台部3之表面(P11100)。 The stage unit 3 is mounted with the substrate W loaded therein. The stage portion 3 has a substrate holding surface that is formed flat, and the substrate W can be held on the substrate holding surface in a state of maintaining a horizontal posture. That is, the substrate holding mechanism (not shown) is provided in the stage 3, and the substrate W is held by the substrate holding mechanism. Specifically, by forming a plurality of suction holes on the surface of the stage portion 3 and causing a suction force to be generated in the suction holes, the substrate W can be adsorbed and held on the surface of the stage portion 3 (P11100).
塗布單元10將塗布液噴出至基板W上而形成塗布膜。如圖2、圖3所示，該塗布單元10具有可沿X軸方向移動之腳部11及沿Y軸方向延伸之塗布噴嘴12，塗布噴嘴12係可相對於保持於載物台部3之基板W靠近/遠離地支持。該塗布噴嘴12噴出塗布液而於基板W上形成塗布膜。本實施形態之塗布噴嘴12係具有沿一方向(Y軸方向)延伸之形狀之柱狀構件，且係以與塗布單元10之腳部11之移行方向大致正交之方式設置。並且，於該塗布噴嘴12形成有沿長邊方向(Y軸方向)延伸之狹縫噴嘴12a，供給至塗布噴嘴12之塗布液自狹縫噴嘴12a遍及長邊方向均勻地噴出。 The coating unit 10 ejects the coating liquid onto the substrate W to form a coating film. As shown in FIGS. 2 and 3, the coating unit 10 has a leg portion 11 movable in the X-axis direction and a coating nozzle 12 extending in the Y-axis direction, and the coating nozzle 12 is detachable from the stage portion 3 The substrate W is supported close to/away from the ground. The coating nozzle 12 ejects the coating liquid to form a coating film on the substrate W. The coating nozzle 12 of the present embodiment has a columnar member having a shape extending in one direction (Y-axis direction), and is provided so as to be substantially orthogonal to the traveling direction of the leg portion 11 of the coating unit 10. Further, the coating nozzle 12 is formed with a slit nozzle 12a extending in the longitudinal direction (Y-axis direction), and the coating liquid supplied to the coating nozzle 12 is uniformly discharged from the slit nozzle 12a in the longitudinal direction.
具體而言，於塗布噴嘴12內形成有儲存塗布液之歧管，自塗布液供給部2供給之塗布液可暫時儲存。即，塗布噴嘴12係藉由配管4與塗布液供給部2連接，自下述塗布液供給部2送液之塗布液被供給至歧管內。並且，藉由進而使塗布液供給部2之塗布液泵20作動而對歧管內進行加壓，從而使塗布液通過狹縫噴嘴12a噴出。因此，於使塗布液自該狹縫噴嘴12a噴出之狀態下使塗布單元10沿X軸方向移行，藉此遍及狹縫噴嘴12a之長邊方向而於基板W上形成固定厚度之塗布膜。再者，於本實施形態中，對塗布噴嘴12相對於載物台部3移動之例進行說明，但亦可以載物台部3相對於塗布噴嘴12移動之方式構成。 Specifically, a manifold for storing the coating liquid is formed in the coating nozzle 12, and the coating liquid supplied from the coating liquid supply unit 2 can be temporarily stored. In other words, the coating nozzle 12 is connected to the coating liquid supply unit 2 via the pipe 4, and the coating liquid supplied from the coating liquid supply unit 2 described below is supplied into the manifold. Then, the inside of the manifold is pressurized by the application liquid pump 20 of the coating liquid supply unit 2, and the coating liquid is ejected through the slit nozzle 12a. Therefore, the coating unit 10 is moved in the X-axis direction while the coating liquid is ejected from the slit nozzle 12a, whereby a coating film having a constant thickness is formed on the substrate W over the longitudinal direction of the slit nozzle 12a. In the present embodiment, an example in which the coating nozzle 12 is moved relative to the stage portion 3 will be described. However, the stage portion 3 may be configured to move relative to the coating nozzle 12.
塗布液供給部2將塗布液供給至塗布單元10，且具有塗布液槽21 及塗布液泵20。該等塗布液槽21與塗布液泵20分別係藉由配管4而連結，儲存於塗布液槽21之塗布液可被送液至塗布液泵20。 The coating liquid supply unit 2 supplies the coating liquid to the coating unit 10 and has a coating liquid tank 21 And a coating liquid pump 20. The coating liquid tank 21 and the coating liquid pump 20 are connected by a pipe 4, respectively, and the coating liquid stored in the coating liquid tank 21 can be sent to the coating liquid pump 20.
塗布液槽21儲存作為形成於基板W上之塗布膜之材料之化學藥液或抗蝕液等液狀物(亦可簡稱為塗布液)。於該塗布液槽21設置有送液加壓裝置22，藉由使該送液加壓裝置22作動，可將塗布液槽21內之塗布液送液至下游側。即，於塗布液槽21之底面部21a連接有配管4，藉由利用送液加壓裝置22對塗布液槽21內進行加壓，可通過配管4將塗布液送液至位於下游側之塗布液泵20。於本實施形態中，送液加壓裝置22係將潔淨乾燥空氣(CDA)供給至塗布液槽21內，藉由將CDA供給至塗布液槽21內，可使塗布液槽21內加壓而將塗布液送液。 The coating liquid tank 21 stores a liquid material (may also be simply referred to as a coating liquid) such as a chemical liquid or a resist liquid which is a material of the coating film formed on the substrate W. The liquid supply pressurizing device 22 is provided in the coating liquid tank 21, and by applying the liquid feeding pressurizing device 22, the coating liquid in the coating liquid tank 21 can be supplied to the downstream side. In other words, the pipe 4 is connected to the bottom surface portion 21a of the coating liquid tank 21, and the inside of the coating liquid tank 21 is pressurized by the liquid feeding and pressurizing device 22, whereby the coating liquid can be supplied to the coating on the downstream side through the pipe 4. Liquid pump 20. In the present embodiment, the liquid supply pressurizing device 22 supplies clean air (CDA) to the coating liquid tank 21, and by supplying CDA into the coating liquid tank 21, the coating liquid tank 21 can be pressurized. The coating solution was supplied to the solution.
又，塗布液泵20將自塗布液槽21供給之塗布液送液至塗布噴嘴12。該塗布液泵20連接於配管4，而與塗布液槽21及塗布噴嘴12連通地連接。於本實施形態中，可使用注射泵作為塗布液泵20，並藉由抽吸動作收容1片基板W所必需之量之塗布液，藉由噴出動作將塗布液送液至塗布噴嘴12。 Moreover, the coating liquid pump 20 supplies the coating liquid supplied from the coating liquid tank 21 to the coating nozzle 12. The coating liquid pump 20 is connected to the pipe 4 and is connected to the coating liquid tank 21 and the coating nozzle 12 in communication. In the present embodiment, a syringe pump can be used as the coating liquid pump 20, and a coating liquid of a quantity necessary for one sheet of the substrate W can be accommodated by a suction operation, and the coating liquid can be supplied to the coating nozzle 12 by a discharge operation.
又，塗布液槽21、塗布液泵20、塗布噴嘴12係使複數個配管4連結而連接。並且，於配管4之路徑設置有閥，於圖1之例中，於塗布液槽21與塗布液泵20之間設置有抽吸閥51，於塗布液泵20與塗布噴嘴12之間設置有噴出閥52。該等抽吸閥51及噴出閥52例如使用隔膜閥。藉由使該抽吸閥51及噴出閥52進行開閉動作，可切換配管4中所形成之流路。例如藉由打開抽吸閥51並關閉噴出閥52，由於塗布液槽21與塗布液泵20連通地連接，故而可將塗布液自塗布液槽21供給至塗布液泵20。又，藉由關閉抽吸閥51並打開噴出閥52，由於塗布液泵20與塗布噴嘴12連通地連接，故而可藉由使塗布液泵20作動而將塗布液供給至塗布噴嘴12，並將塗布液自塗布噴嘴12噴出至基板W上。 Further, the coating liquid tank 21, the coating liquid pump 20, and the coating nozzle 12 are connected to each other by connecting a plurality of pipes 4. Further, a valve is provided in the path of the pipe 4, and in the example of Fig. 1, a suction valve 51 is provided between the coating liquid tank 21 and the coating liquid pump 20, and between the coating liquid pump 20 and the coating nozzle 12 is provided. The valve 52 is ejected. For the suction valve 51 and the discharge valve 52, for example, a diaphragm valve is used. By opening and closing the suction valve 51 and the discharge valve 52, the flow path formed in the pipe 4 can be switched. For example, by opening the suction valve 51 and closing the discharge valve 52, the coating liquid tank 21 is connected in communication with the coating liquid pump 20, so that the coating liquid can be supplied from the coating liquid tank 21 to the coating liquid pump 20. Further, by closing the suction valve 51 and opening the discharge valve 52, the coating liquid pump 20 is connected in communication with the coating nozzle 12, so that the coating liquid can be supplied to the coating nozzle 12 by actuating the coating liquid pump 20, and The coating liquid is ejected from the coating nozzle 12 onto the substrate W.
又，本發明之塗布裝置1具備抽吸塗布噴嘴12內之塗布液之塗布 液抽吸部7。即，於塗布膜形成結束時之脫液時，可藉由塗布液抽吸部7抽吸連結基板W與塗布噴嘴12之塗布液(液珠)，從而維持塗布膜之終端部之膜厚之均勻性。 Moreover, the coating apparatus 1 of the present invention is provided with coating of a coating liquid in the suction coating nozzle 12. Liquid suction unit 7. In other words, when the liquid is removed at the end of the formation of the coating film, the coating liquid (the liquid bead) of the connection substrate W and the coating nozzle 12 can be sucked by the coating liquid suction unit 7, thereby maintaining the film thickness of the end portion of the coating film. Uniformity.
塗布液抽吸部7具有抽吸源71、及設置於與塗布噴嘴12連通之配管4之抽吸用槽72。抽吸源71係可使動力源作動而持續地產生抽吸力之裝置，例如使用真空泵。並且，藉由使真空泵作動而使抽吸用槽72內減壓，並通過配管4抽吸塗布噴嘴12內之塗布液。藉此，連結基板W與塗布噴嘴12之液珠被抽吸而收容至塗布噴嘴12之歧管內，故而可瞬間進行塗布膜之終端部形成結束時之脫液，從而可提高脫液之應答性。 The coating liquid suction unit 7 includes a suction source 71 and a suction groove 72 provided in a pipe 4 that communicates with the coating nozzle 12 . The suction source 71 is a device that can actuate the power source to continuously generate suction force, for example, using a vacuum pump. Then, the inside of the suction tank 72 is decompressed by the operation of the vacuum pump, and the coating liquid in the coating nozzle 12 is sucked by the pipe 4. Thereby, the liquid droplets of the connection substrate W and the coating nozzle 12 are sucked and housed in the manifold of the coating nozzle 12, so that the liquid removal at the end of the formation of the end portion of the coating film can be instantaneously performed, and the response of the liquid removal can be improved. Sex.
抽吸用槽72抽吸並儲存塗布噴嘴12內之塗布液。抽吸用槽72形成為具有大於配管4之直徑之圓筒形狀，且設置於塗布噴嘴12與抽吸源71之間之配管路徑。具體而言，抽吸用槽72於上表面72a通過配管4與抽吸源71連接，於底面72b通過配管41與塗布噴嘴12連接。即，若使抽吸源71作動，則抽吸用槽72內被減壓，藉此塗布噴嘴12之歧管內之塗布液被抽吸，該經抽吸之塗布液被收容至抽吸用槽72內。 The suction tank 72 suctions and stores the coating liquid in the coating nozzle 12. The suction groove 72 is formed in a cylindrical shape having a larger diameter than the pipe 4 and is provided in a piping path between the coating nozzle 12 and the suction source 71. Specifically, the suction groove 72 is connected to the suction source 71 via the pipe 4 on the upper surface 72a, and is connected to the coating nozzle 12 via the pipe 41 on the bottom surface 72b. In other words, when the suction source 71 is actuated, the suction groove 72 is depressurized, whereby the coating liquid in the manifold of the application nozzle 12 is sucked, and the suctioned coating liquid is stored for suction. Inside the slot 72.
該抽吸用槽72係於與塗布噴嘴12連結之配管41經塗布液充滿且塗布液之液面存在於抽吸用槽72內之狀態下使用。具體而言，於抽吸用槽72設置有用以偵測液面之上限與下限之液面感測器6，並於塗布液之液面存在於上限及下限之液面感測器6(上限感測器61及下限感測器62)之間之狀態下使用。藉此，可抑制塗布液之抽吸力之變化。即，如圖4所示，若於不存在抽吸用槽72之狀態下進行抽吸動作，則經抽吸之塗布液儲存於配管4內，故而若進行間歇塗布並連續地進行複數次抽吸動作，則塗布液之液面於抽吸源71側大幅位移(於圖4中液面上升α)，佔據配管4之塗布液之量增加。並且，若佔據配管4之塗布液之量增加，則因自重等而欲流向塗布噴嘴12側之力(於圖4中為朝下 之黑箭頭)增大，並且因塗布液之黏度而與配管4表面之阻力增大，從而塗布液之抽吸量相對於抽吸源71之抽吸力產生變化。另一方面，藉由如圖5所示之本發明般設置直徑大於配管4之抽吸用槽72，相對於塗布液之抽吸量之高度方向之變化(於圖5中液面上升α)縮小，故而可極大地抑制塗布液之抽吸力之變化，從而可使膜厚終端部之均勻性穩定。 The suction groove 72 is used in a state where the pipe 41 connected to the coating nozzle 12 is filled with the coating liquid and the liquid surface of the coating liquid is present in the suction groove 72. Specifically, the liquid level sensor 6 for detecting the upper and lower limits of the liquid surface is provided in the suction groove 72, and the liquid level sensor 6 is present at the upper and lower limits of the liquid level of the coating liquid (upper limit) It is used between the sensor 61 and the lower limit sensor 62). Thereby, the change in the suction force of the coating liquid can be suppressed. In other words, as shown in FIG. 4, when the suction operation is performed in a state where the suction groove 72 is not present, the pumped coating liquid is stored in the pipe 4, so that intermittent application is performed continuously and plural times are continuously performed. In the suction operation, the liquid level of the coating liquid is largely displaced on the side of the suction source 71 (the liquid level rises by α in Fig. 4), and the amount of the coating liquid occupying the pipe 4 is increased. In addition, when the amount of the coating liquid occupying the pipe 4 is increased, the force to flow to the side of the coating nozzle 12 due to its own weight or the like (downward in FIG. 4) The black arrow) is increased, and the resistance of the surface of the pipe 4 is increased by the viscosity of the coating liquid, so that the suction amount of the coating liquid changes with respect to the suction force of the suction source 71. On the other hand, by providing the suction groove 72 having a diameter larger than that of the pipe 4 as shown in Fig. 5, the change in the height direction with respect to the suction amount of the coating liquid (the liquid level rise α in Fig. 5) Since the shrinkage is reduced, the change in the suction force of the coating liquid can be greatly suppressed, and the uniformity of the film thickness terminal portion can be stabilized.
又，塗布液抽吸部7具有與抽吸用槽72分開且用以回收無用之塗布液之回收槽73。該回收槽73係利用配管4與抽吸用槽72連結，於抽吸用槽72內之塗布液超過固定量之情形時儲存塗布液，藉此使塗布液之液面始終存在於抽吸用槽72之上限及下限內。具體而言，若藉由進行利用間歇塗布而進行之塗布動作而抽吸用槽72內之塗布液增加，則上限感測器61反應並打開退避閥53。並且，利用送液加壓裝置72對抽吸用槽72進行加壓，藉此將抽吸用槽72內之塗布液送液至回收槽73。並且，若下限感測器62反應，則退避閥53關閉，藉此於抽吸用槽72之液面降低至下限感測器62之位置之狀態下停止送液。如此，抽吸用槽72內之塗布液之液面可始終位於上限感測器61與下限感測器62之間，故而可長期抑制塗布液之抽吸力之變化。 Further, the coating liquid suction unit 7 has a recovery tank 73 which is separated from the suction tank 72 and which is used to recover useless coating liquid. The recovery tank 73 is connected to the suction tank 72 by the pipe 4, and when the coating liquid in the suction tank 72 exceeds a fixed amount, the coating liquid is stored, whereby the liquid surface of the coating liquid is always present for suction. Within the upper and lower limits of the tank 72. Specifically, when the coating liquid in the suction tank 72 is increased by the coating operation by the intermittent coating, the upper limit sensor 61 reacts and opens the evacuation valve 53. Then, the suction tank 72 is pressurized by the liquid supply pressurizing device 72, whereby the coating liquid in the suction tank 72 is sent to the recovery tank 73. When the lower limit sensor 62 reacts, the evacuation valve 53 is closed, and the liquid supply is stopped in a state where the liquid level of the suction groove 72 is lowered to the position of the lower limit sensor 62. As a result, the liquid level of the coating liquid in the suction groove 72 can always be between the upper limit sensor 61 and the lower limit sensor 62, so that the change in the suction force of the coating liquid can be suppressed for a long period of time.
又，關於上述實施形態之塗布裝置，對間歇塗布中之脫液步驟之動作進行說明。 Moreover, the operation of the liquid removal step in the intermittent application will be described with respect to the coating apparatus of the above embodiment.
於藉由自塗布液槽21送液而塗布液充滿塗布液泵20、塗布噴嘴12、及連結該等之配管4之狀態下進行對基板W之塗布動作。此時，於塗布液抽吸部7中，連結抽吸用槽72與塗布噴嘴12之配管4被塗布液充滿，且塗布液之液面係以位於抽吸用槽72之上限感測器61與下限感測器62之間之方式被調整。 The coating operation on the substrate W is performed in a state where the coating liquid is filled from the coating liquid tank 21 and the coating liquid is filled in the coating liquid pump 20, the coating nozzle 12, and the piping 4 is connected. At this time, in the coating liquid suction unit 7, the pipe 4 to which the suction groove 72 and the coating nozzle 12 are connected is filled with the coating liquid, and the liquid surface of the coating liquid is placed on the upper limit sensor 61 of the suction groove 72. The manner between the lower limit sensor 62 and the lower limit sensor 62 is adjusted.
繼而，於基板W上之特定位置形成塗布膜。具體而言，於塗布開始位置使塗布液泵20作動，藉此使塗布液自塗布噴嘴12之狹縫噴出。 即，於狹縫與基板W之間形成液珠。並且，一面使塗布液泵20作動以供給固定量之塗布液，一面對塗布噴嘴12進行掃描，藉此於基板W上形成厚度均勻之塗布膜。 Then, a coating film is formed at a specific position on the substrate W. Specifically, the coating liquid pump 20 is actuated at the application start position, whereby the coating liquid is ejected from the slit of the coating nozzle 12. That is, a liquid bead is formed between the slit and the substrate W. Then, the coating liquid pump 20 is operated to supply a fixed amount of the coating liquid, and the coating nozzle 12 is scanned to form a coating film having a uniform thickness on the substrate W.
繼而，進行脫液步驟。即，若塗布噴嘴12到達至塗布結束位置，則使塗布液泵20停止而使向塗布噴嘴12之塗布液之送液停止，同時使塗布液抽吸部7之抽吸源71作動而抽吸塗布噴嘴12內之塗布液。藉此，藉由塗布噴嘴12之狹縫所產生之抽吸力而液珠瞬間切斷，從而可抑制多餘之塗布液流向塗布膜。即，由於如設計般之塗布液被供給至塗布膜之終端部，故而可保持膜厚之均勻性。 Then, a deliquoring step is performed. In other words, when the coating nozzle 12 reaches the application end position, the coating liquid pump 20 is stopped, the liquid supply to the coating liquid of the coating nozzle 12 is stopped, and the suction source 71 of the coating liquid suction unit 7 is actuated to be sucked. The coating liquid in the nozzle 12 is applied. Thereby, the liquid droplets are instantaneously cut by the suction force generated by the slit of the coating nozzle 12, and the excess coating liquid can be suppressed from flowing to the coating film. That is, since the coating liquid is supplied to the end portion of the coating film as designed, the uniformity of the film thickness can be maintained.
並且，於在未進行塗布動作之情況下通過固定區域後，進行下一個塗布膜之形成。即，藉由重複進行上述塗布動作及脫液動作，而於下一個區域形成塗布膜。如此，藉由進行塗布動作及脫液動作，抽吸用槽72內之塗布液雖逐漸增加，但由於抽吸用槽72形成為直徑大於配管4，故而塗布液之液面之高度位置幾乎不會變化，可極大地抑制塗布液之抽吸力之變化，從而可使膜厚終端部之均勻性穩定。 Then, after passing through the fixing region without performing the coating operation, the formation of the next coating film is performed. That is, by repeating the above-described coating operation and de-liquidizing operation, a coating film is formed in the next region. As described above, the coating liquid in the suction tank 72 is gradually increased by the coating operation and the liquid removal operation. However, since the suction groove 72 is formed to have a larger diameter than the pipe 4, the liquid level of the coating liquid is hardly located. If it changes, the change in the suction force of the coating liquid can be greatly suppressed, and the uniformity of the film thickness terminal portion can be stabilized.
另一方面，若對複數片基板W進行間歇塗布，則儲存於抽吸用槽72之塗布液增加，藉此上限感測器61偵測到塗布液之液面。若經上限感測器61偵測到，則由警告警報器發出警告而將抽吸用槽72之塗布液送液至回收槽73。即，使塗布動作暫時停止，並通過配管4將塗布液自抽吸用槽72送液至回收槽73。即，於下限感測器62反應之前將塗布液自抽吸用槽72送液至回收槽73。如此，若抽吸用槽72之液面到達至下限感測器62之位置，則再次進行上述塗布動作及脫液步驟。 On the other hand, when the plurality of substrates W are intermittently applied, the coating liquid stored in the suction grooves 72 is increased, whereby the upper limit sensor 61 detects the liquid level of the coating liquid. When it is detected by the upper limit sensor 61, the warning alarm is issued and the coating liquid of the suction tank 72 is sent to the recovery tank 73. In other words, the coating operation is temporarily stopped, and the coating liquid is supplied from the suction tank 72 to the recovery tank 73 through the pipe 4. That is, the coating liquid is supplied from the suction tank 72 to the recovery tank 73 before the reaction of the lower limit sensor 62. As described above, when the liquid level of the suction groove 72 reaches the position of the lower limit sensor 62, the coating operation and the liquid removal step are performed again.
如此，於本發明之塗布裝置中，由於塗布液抽吸部7使用可持續產生抽吸力之真空泵，故而與使用回吸閥之先前之裝置相比，容易設定抽吸時序，且亦不存在抽吸容量之限制，故而可提高塗布膜形成結束時之抽吸之應答性。並且，藉由於配管路徑設置形成為直徑大於配 管4之抽吸用槽72並於塗布液之液面存在於抽吸用槽72之狀態下進行抽吸動作，即便藉由間歇塗布進行複數次抽吸動作所抽吸之塗布液之量增加，與配管4相比，亦可縮小液面之高度方向之位移量。因此，於間歇塗布動作中，藉由於液面存在於抽吸用槽72內之狀態下進行抽吸動作，與儲存於配管4之先前相比，可極大地抑制塗布液之抽吸力之變化，從而可使膜厚終端部之均勻性穩定。 As described above, in the coating apparatus of the present invention, since the coating liquid suction portion 7 uses a vacuum pump that continuously generates a suction force, it is easy to set the suction timing as compared with the prior apparatus using the suction valve, and there is no such Since the suction capacity is limited, the responsiveness of suction at the end of formation of the coating film can be improved. And, because the piping path is set to be larger than the diameter The suction groove 72 of the tube 4 is sucked while the liquid surface of the coating liquid is present in the suction groove 72, and the amount of the coating liquid sucked by the plurality of suction operations by intermittent coating is increased. Compared with the pipe 4, the displacement amount in the height direction of the liquid surface can also be reduced. Therefore, in the intermittent application operation, the suction operation is performed in a state where the liquid surface is present in the suction groove 72, and the change in the suction force of the coating liquid can be greatly suppressed as compared with the case before being stored in the pipe 4. Therefore, the uniformity of the film thickness terminal portion can be stabilized.
再者，於上述實施形態中，對設置有液面感測器6之例進行了說明，但亦可為不設置液面感測器6，經過特定時間時更換為新的抽吸用槽72之構成。 Further, in the above embodiment, the liquid level sensor 6 is provided. However, the liquid level sensor 6 may not be provided, and the liquid suction sensor 6 may be replaced with a new suction groove 72 after a certain period of time. The composition.
1‧‧‧塗布裝置 1‧‧‧ Coating device
2‧‧‧塗布液供給部 2‧‧‧ Coating Liquid Supply Department
3‧‧‧載物台部 3‧‧‧The Stage Department
4‧‧‧配管 4‧‧‧Pipe
7‧‧‧塗布液抽吸部 7‧‧‧ Coating liquid suction unit
10‧‧‧塗布單元 10‧‧‧ Coating unit
12‧‧‧塗布噴嘴 12‧‧‧ Coating nozzle
20‧‧‧塗布液泵 20‧‧‧ Coating liquid pump
21‧‧‧塗布液槽 21‧‧‧ Coating tank
21a‧‧‧底面部 21a‧‧‧ bottom part
22‧‧‧送液加壓裝置 22‧‧‧ Liquid feeding device
41‧‧‧配管 41‧‧‧Pipe
51‧‧‧抽吸閥 51‧‧‧ suction valve
52‧‧‧噴出閥 52‧‧‧Spray valve
53‧‧‧退避閥 53‧‧‧Retraction valve
71‧‧‧抽吸源 71‧‧‧Sucking source
72‧‧‧抽吸用槽 72‧‧‧Slots for suction
72a‧‧‧上表面 72a‧‧‧Upper surface
72b‧‧‧底面 72b‧‧‧ bottom
73‧‧‧回收槽 73‧‧‧Recycling tank
W‧‧‧基板 W‧‧‧Substrate
Claims (2)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| JP2015175902A JP2017051885A (en) | 2015-09-07 | 2015-09-07 | Coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201718107A true TW201718107A (en) | 2017-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW105125649A TW201718107A (en) | 2015-09-07 | 2016-08-11 | Coating device to increase the responsiveness of extraction liquid when the formation of coated film ends for forming a coating film with uniform thickness |
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| JP (1) | JP2017051885A (en) |
| KR (1) | KR20170029380A (en) |
| CN (1) | CN106493041A (en) |
| TW (1) | TW201718107A (en) |
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| JPH1176894A (en) * | 1997-09-11 | 1999-03-23 | Dainippon Screen Mfg Co Ltd | Apparatus and method for coating |
| JP2001179156A (en) * | 1999-12-22 | 2001-07-03 | Hirano Tecseed Co Ltd | Discharge type coating device |
| JP3871328B2 (en) * | 2002-03-29 | 2007-01-24 | Ｈｏｙａ株式会社 | COATING APPARATUS, LIQUID LEVEL MANAGEMENT METHOD AND MANAGEMENT APPARATUS, RESIST FILM-SUBSTRATE MANUFACTURING METHOD AND PATTERN FORMING METHOD, AND PHOTOMASK MANUFACTURING METHOD |
| TWI253359B (en) * | 2003-03-14 | 2006-04-21 | Dainippon Screen Mfg | Substrate processing device and liquid feeding device |
| JP4305918B2 (en) | 2004-01-30 | 2009-07-29 | 東京エレクトロン株式会社 | Floating substrate transfer processing equipment |
| JP2008161741A (en) * | 2006-12-27 | 2008-07-17 | Chugai Ro Co Ltd | Coating apparatus and coating method |
| CN202224307U (en) * | 2011-08-30 | 2012-05-23 | 景晖精密企业有限公司 | Intermittent ink supply system of slit type coating head |
| JP5885755B2 (en) * | 2011-12-01 | 2016-03-15 | タツモ株式会社 | Coating apparatus and coating method |
| KR102223165B1 (en) * | 2013-03-14 | 2021-03-03 | 무사시 엔지니어링 가부시키가이샤 | Liquid material discharge device, coating device thereof, and coating method |
| JP2014180604A (en) | 2013-03-18 | 2014-09-29 | Toray Ind Inc | Intermittent coating apparatus and intermittent coating method and method for manufacturing displaying member |
| JP6224967B2 (en) * | 2013-09-17 | 2017-11-01 | 東レエンジニアリング株式会社 | Coating apparatus and coating method |
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| KR20170029380A (en) | 2017-03-15 |
| CN106493041A (en) | 2017-03-15 |
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