KR20020075884A - 도금 전처리제 및 그것을 사용한 금속도금 방법 - Google Patents
도금 전처리제 및 그것을 사용한 금속도금 방법 Download PDFInfo
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- KR20020075884A KR20020075884A KR1020027008734A KR20027008734A KR20020075884A KR 20020075884 A KR20020075884 A KR 20020075884A KR 1020027008734 A KR1020027008734 A KR 1020027008734A KR 20027008734 A KR20027008734 A KR 20027008734A KR 20020075884 A KR20020075884 A KR 20020075884A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/166—Process features with two steps starting with addition of reducing agent followed by metal deposition
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
Abstract
Description
Claims (8)
- 금속포착성 관능기를 분자중에 갖는 실란커플링제에 금속을 포착시킨 후, 환원제를 첨가하여 조제된 전처리제로 피도금물을 처리한 후, 무전해도금하는 것을 포함하여 구성됨을 특징으로 하는 금속도금 방법.
- 제 1 항에 있어서, 금속포착성 관능기가 아민인 것을 특징으로 하는 금속도금 방법.
- 제 1 항에 있어서, 금속포착성 관능기가 이미다졸인 것을 특징으로 하는 금속도금 방법.
- 제 1 항에 있어서, 금속이 팔라듐 화합물인 것을 특징으로 하는 금속도금 방법.
- 금속포착성 관능기를 분자중에 하나 이상 갖는 실란커플링제가 아졸화합물과 에폭시실란계 화합물과의 반응에 의해 얻어지는 실란커플링제인 것을 특징으로 하는 금속도금 방법.
- 제 1 항에 있어서, 환원제가 디메틸아민보란인 것을 특징으로 하는 금속도금방법.
- 제 1 항에 있어서, 금속도금이 구리 또는 니켈인 금속도금 방법.
- 금속포착성 관능기를 분자중에 갖는 실란커플링제에 금속을 포착시킨 후, 환원제를 첨가하여 조제된 것을 특징으로 하는 금속도금 전처리제.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2000-00124176 | 2000-04-25 | ||
JP2000124176 | 2000-04-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020075884A true KR20020075884A (ko) | 2002-10-07 |
KR100495164B1 KR100495164B1 (ko) | 2005-06-14 |
Family
ID=18634348
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2002-7008734A KR100495164B1 (ko) | 2000-04-25 | 2001-01-05 | 도금 전처리제 및 그것을 사용한 금속도금 방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6780467B2 (ko) |
EP (1) | EP1279750B1 (ko) |
KR (1) | KR100495164B1 (ko) |
CN (1) | CN1261618C (ko) |
TW (1) | TWI241357B (ko) |
WO (1) | WO2001081652A1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7179741B2 (en) | 2002-04-23 | 2007-02-20 | Nikko Materials Co., Ltd. | Electroless plating method and semiconductor wafer on which metal plating layer is formed |
KR100970067B1 (ko) * | 2005-09-15 | 2010-07-16 | 닛코킨조쿠 가부시키가이샤 | 스루홀을 가진 프린트 배선 기판에의 무전해 도금용 촉매,및 그 촉매를 이용하여 처리된 스루홀을 가진 프린트 배선기판 |
KR100976313B1 (ko) * | 2005-03-10 | 2010-08-16 | 닛코킨조쿠 가부시키가이샤 | 무전해도금을 실시한 전자 부품기재, 및 전자 부품기재의 제조 방법 |
Families Citing this family (43)
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US7045461B2 (en) * | 2000-01-07 | 2006-05-16 | Nikkon Materials Co., Ltd. | Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these |
JP4598033B2 (ja) * | 2002-08-27 | 2010-12-15 | Jx日鉱日石金属株式会社 | 鍍銅Al2O3複合粉末焼結体及び同焼結体の製造方法 |
EP1538237B1 (en) * | 2002-09-10 | 2009-09-30 | Nippon Mining & Metals Co., Ltd. | Method for metal plating and pre-treating agent |
JP2004124130A (ja) * | 2002-09-30 | 2004-04-22 | Fujimi Inc | 溶射用粉末及びその製造方法並びに該溶射用粉末を用いた溶射方法 |
KR100516161B1 (ko) * | 2003-05-01 | 2005-09-23 | 엘에스전선 주식회사 | 실란 화합물, 그 제조방법 및 이를 사용한 유기 다이 붙임접착제와 무기물 사이의 결합방법 |
JP4270517B2 (ja) | 2003-06-09 | 2009-06-03 | 日鉱金属株式会社 | 無電解めっき方法及び金属めっき物 |
US20040248403A1 (en) * | 2003-06-09 | 2004-12-09 | Dubin Valery M. | Method for forming electroless metal low resistivity interconnects |
JP4863715B2 (ja) * | 2003-11-05 | 2012-01-25 | Jx日鉱日石金属株式会社 | インクジェット用インク組成物 |
JP4711415B2 (ja) * | 2004-01-29 | 2011-06-29 | Jx日鉱日石金属株式会社 | 無電解めっき前処理剤、それを用いる無電解めっき方法、及び無電解めっき物 |
US6983892B2 (en) | 2004-02-05 | 2006-01-10 | Applied Materials, Inc. | Gas distribution showerhead for semiconductor processing |
US20060210837A1 (en) * | 2004-04-16 | 2006-09-21 | Fuji Electric Device | Method of plating on a glass base plate, a method of manufacturing a disk substrate for a perpendicular magnetic recording medium, a disk substrate for a perpendicular magnetic recording medium, and a perpendicular magnetic recording medium |
JP4539282B2 (ja) * | 2004-04-16 | 2010-09-08 | 富士電機デバイステクノロジー株式会社 | 垂直磁気記録媒体用ディスク基板及びそれを用いた垂直磁気記録媒体 |
JP4475026B2 (ja) * | 2004-06-11 | 2010-06-09 | 富士電機デバイステクノロジー株式会社 | 無電解めっき方法、磁気記録媒体および磁気記録装置 |
JP4479528B2 (ja) * | 2004-07-27 | 2010-06-09 | 富士電機デバイステクノロジー株式会社 | ガラス基体へのめっき方法、そのめっき方法を用いる磁気記録媒体用ディスク基板の製造方法及び垂直磁気記録媒体の製造方法 |
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JP4479493B2 (ja) * | 2004-12-14 | 2010-06-09 | 富士電機デバイステクノロジー株式会社 | ガラス基板へのめっき方法及びそれを用いた磁気記録媒体の製造方法 |
WO2006095590A1 (ja) * | 2005-03-10 | 2006-09-14 | Nippon Mining & Metals Co., Ltd. | 樹脂用フィラー、それを配合した樹脂基材、及び電子部品基材 |
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US20080003366A1 (en) * | 2006-06-30 | 2008-01-03 | Dubin Valery M | Method of forming a conducting layer on a conducting and non-conducting substrate |
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US8618677B2 (en) | 2012-04-06 | 2013-12-31 | Advanced Semiconductor Engineering, Inc. | Wirebonded semiconductor package |
CN103249255B (zh) * | 2013-04-17 | 2016-01-20 | 复旦大学 | 一种直接在树脂基板上制备导电线路的方法 |
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2001
- 2001-01-05 US US10/169,894 patent/US6780467B2/en not_active Expired - Lifetime
- 2001-01-05 EP EP01900625.3A patent/EP1279750B1/en not_active Expired - Lifetime
- 2001-01-05 KR KR10-2002-7008734A patent/KR100495164B1/ko active IP Right Grant
- 2001-01-05 WO PCT/JP2001/000022 patent/WO2001081652A1/ja active IP Right Grant
- 2001-01-05 CN CNB018057462A patent/CN1261618C/zh not_active Expired - Lifetime
- 2001-04-13 TW TW090108875A patent/TWI241357B/zh not_active IP Right Cessation
Cited By (5)
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US7179741B2 (en) | 2002-04-23 | 2007-02-20 | Nikko Materials Co., Ltd. | Electroless plating method and semiconductor wafer on which metal plating layer is formed |
KR100976313B1 (ko) * | 2005-03-10 | 2010-08-16 | 닛코킨조쿠 가부시키가이샤 | 무전해도금을 실시한 전자 부품기재, 및 전자 부품기재의 제조 방법 |
US8043705B2 (en) | 2005-03-10 | 2011-10-25 | Nippon Mining & Metals Co., Ltd. | Resin substrate material, electronic component substrate material manufactured by electroless plating on the same, and method for manufacturing electronic component substrate material |
KR101106845B1 (ko) * | 2005-03-10 | 2012-01-19 | 닛코킨조쿠 가부시키가이샤 | 수지기재 |
KR100970067B1 (ko) * | 2005-09-15 | 2010-07-16 | 닛코킨조쿠 가부시키가이샤 | 스루홀을 가진 프린트 배선 기판에의 무전해 도금용 촉매,및 그 촉매를 이용하여 처리된 스루홀을 가진 프린트 배선기판 |
Also Published As
Publication number | Publication date |
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KR100495164B1 (ko) | 2005-06-14 |
US20020192379A1 (en) | 2002-12-19 |
EP1279750B1 (en) | 2016-05-04 |
CN1261618C (zh) | 2006-06-28 |
EP1279750A1 (en) | 2003-01-29 |
CN1406288A (zh) | 2003-03-26 |
WO2001081652A1 (fr) | 2001-11-01 |
US6780467B2 (en) | 2004-08-24 |
TWI241357B (en) | 2005-10-11 |
EP1279750A4 (en) | 2008-07-16 |
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