JPS6468478A - Metal plating method using silver hydrosol - Google Patents

Metal plating method using silver hydrosol

Info

Publication number
JPS6468478A
JPS6468478A JP22370887A JP22370887A JPS6468478A JP S6468478 A JPS6468478 A JP S6468478A JP 22370887 A JP22370887 A JP 22370887A JP 22370887 A JP22370887 A JP 22370887A JP S6468478 A JPS6468478 A JP S6468478A
Authority
JP
Japan
Prior art keywords
silver
plated
colloid
plating
hydrosol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22370887A
Other languages
Japanese (ja)
Other versions
JPH0553873B2 (en
Inventor
Yukimichi Nakao
Kyoji Kaeriyama
Aizo Yamauchi
Tomoyuki Imai
Nanao Horiishi
Hiroshi Igarashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Toda Kogyo Corp
Original Assignee
Agency of Industrial Science and Technology
Toda Kogyo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology, Toda Kogyo Corp filed Critical Agency of Industrial Science and Technology
Priority to JP22370887A priority Critical patent/JPS6468478A/en
Publication of JPS6468478A publication Critical patent/JPS6468478A/en
Publication of JPH0553873B2 publication Critical patent/JPH0553873B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE:To uniformly form a plating film having high adhesive power by bringing a silver hydrosol into contact with a material to be plated to apply silver colloid thereto and subjecting a metal to chemical plating with this colloid as a catalyst at the time of forming a metal plating on the surface of an insulating material. CONSTITUTION:The silver hydrosol is formed by adding 1 or >=2 kinds among a cationic surfactant, anionic surfactant, nonionic surfactant or water soluble high polymers such as polyvinyl alcohol to an aq. soln. dissolved with a water soluble silver compd. such as silver nitrate and adding a reducing agent such as sodium borohydride, then stirring the mixture to effect reaction. The material to be plated consisting of insulators such as ceramics and fiber compsn. is immersed therein to apply the silver colloid on the surface thereof. This material is immersed into the chemical plating liquid of Cu, Ag, Co, etc., so that the secure plating film of Cu, Ag, Co, etc., is chemically plated at a low cost on the surface of the material to be plated to a uniform thickness with the silver colloid as a catalyst.
JP22370887A 1987-09-07 1987-09-07 Metal plating method using silver hydrosol Granted JPS6468478A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22370887A JPS6468478A (en) 1987-09-07 1987-09-07 Metal plating method using silver hydrosol

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22370887A JPS6468478A (en) 1987-09-07 1987-09-07 Metal plating method using silver hydrosol

Publications (2)

Publication Number Publication Date
JPS6468478A true JPS6468478A (en) 1989-03-14
JPH0553873B2 JPH0553873B2 (en) 1993-08-11

Family

ID=16802417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22370887A Granted JPS6468478A (en) 1987-09-07 1987-09-07 Metal plating method using silver hydrosol

Country Status (1)

Country Link
JP (1) JPS6468478A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03104873A (en) * 1989-09-18 1991-05-01 Shizuoka Prefecture Electroless plating method for electric insulator
JPH03219085A (en) * 1989-05-04 1991-09-26 Ad Tech Holdings Ltd Deposition of silver layer on nonconductive substrate
WO2001081652A1 (en) * 2000-04-25 2001-11-01 Nikko Materials Co., Ltd. Pretreating agent for metal plating
US7767009B2 (en) 2005-09-14 2010-08-03 OMG Electronic Chemicals, Inc. Solution and process for improving the solderability of a metal surface
WO2014203843A1 (en) 2013-06-21 2014-12-24 Dic株式会社 Catalyst for electroless plating, metallic coating film produced using same, and method for producing said metallic coating film
JP2015021147A (en) * 2013-07-17 2015-02-02 名古屋メッキ工業株式会社 Electroless metal plating method for organic fiber material and electroless metal plating fiber
KR20150058097A (en) 2012-09-20 2015-05-28 디아이씨 가부시끼가이샤 Electrically conductive material and method for producing same
CN109440453A (en) * 2018-10-22 2019-03-08 复旦大学 A kind of preparation method of Cu-Ni-Gd-B-P electronic fabric

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59120249A (en) * 1982-12-27 1984-07-11 Agency Of Ind Science & Technol Preparation of noble metal catalyst
JPS6263676A (en) * 1985-09-14 1987-03-20 Agency Of Ind Science & Technol Method for plating polyethylene terephthalate film with ferromagnetic metal

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59120249A (en) * 1982-12-27 1984-07-11 Agency Of Ind Science & Technol Preparation of noble metal catalyst
JPS6263676A (en) * 1985-09-14 1987-03-20 Agency Of Ind Science & Technol Method for plating polyethylene terephthalate film with ferromagnetic metal

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03219085A (en) * 1989-05-04 1991-09-26 Ad Tech Holdings Ltd Deposition of silver layer on nonconductive substrate
JPH03104873A (en) * 1989-09-18 1991-05-01 Shizuoka Prefecture Electroless plating method for electric insulator
WO2001081652A1 (en) * 2000-04-25 2001-11-01 Nikko Materials Co., Ltd. Pretreating agent for metal plating
US6780467B2 (en) 2000-04-25 2004-08-24 Nikko Materials Co., Ltd. Plating pretreatment agent and metal plating method using the same
US7767009B2 (en) 2005-09-14 2010-08-03 OMG Electronic Chemicals, Inc. Solution and process for improving the solderability of a metal surface
US8110252B2 (en) 2005-09-14 2012-02-07 Omg Electronic Chemicals, Llc Solution and process for improving the solderability of a metal surface
KR20150058097A (en) 2012-09-20 2015-05-28 디아이씨 가부시끼가이샤 Electrically conductive material and method for producing same
WO2014203843A1 (en) 2013-06-21 2014-12-24 Dic株式会社 Catalyst for electroless plating, metallic coating film produced using same, and method for producing said metallic coating film
KR20160045907A (en) 2013-06-21 2016-04-27 디아이씨 가부시끼가이샤 Catalyst for electroless plating, metallic coating film produced using same, and method for producing said metallic coating film
JP2015021147A (en) * 2013-07-17 2015-02-02 名古屋メッキ工業株式会社 Electroless metal plating method for organic fiber material and electroless metal plating fiber
CN109440453A (en) * 2018-10-22 2019-03-08 复旦大学 A kind of preparation method of Cu-Ni-Gd-B-P electronic fabric

Also Published As

Publication number Publication date
JPH0553873B2 (en) 1993-08-11

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Legal Events

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