CN109440453A - A kind of preparation method of Cu-Ni-Gd-B-P electronic fabric - Google Patents
A kind of preparation method of Cu-Ni-Gd-B-P electronic fabric Download PDFInfo
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- CN109440453A CN109440453A CN201811226924.8A CN201811226924A CN109440453A CN 109440453 A CN109440453 A CN 109440453A CN 201811226924 A CN201811226924 A CN 201811226924A CN 109440453 A CN109440453 A CN 109440453A
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- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/83—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metals; with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles
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- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M13/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with non-macromolecular organic compounds; Such treatment combined with mechanical treatment
- D06M13/50—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with non-macromolecular organic compounds; Such treatment combined with mechanical treatment with organometallic compounds; with organic compounds containing boron, silicon, selenium or tellurium atoms
- D06M13/51—Compounds with at least one carbon-metal or carbon-boron, carbon-silicon, carbon-selenium, or carbon-tellurium bond
- D06M13/513—Compounds with at least one carbon-metal or carbon-boron, carbon-silicon, carbon-selenium, or carbon-tellurium bond with at least one carbon-silicon bond
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M2101/00—Chemical constitution of the fibres, threads, yarns, fabrics or fibrous goods made from such materials, to be treated
- D06M2101/02—Natural fibres, other than mineral fibres
- D06M2101/04—Vegetal fibres
- D06M2101/06—Vegetal fibres cellulosic
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- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention belongs to field of electronic materials, are related to a kind of preparation method of Cu-Ni-Gd-B-P electronic fabric.Preparation method proposed by the present invention is to select sodolin as substrate, and depositing one layer of Cu-Ni-Gd-B-P alloy layer technique on its surface using the technique of chemical plating includes surface alkali process, and surface is modified, adsorption of metal ions, in-situ reducing, metal co-deposition etc..Anti-corrosion electric conducting fabric prepared by the present invention has the advantage that (1) flax substrate, sweat-absorbing breathable, health environment-friendly.(2) adhesive force between fabric substrate and metal coating can be improved by alkali process and silane coupler modified in sodolin.(3) the entire technological process of production is easy, is suitble to produce in enormous quantities, is able to satisfy the market demand.
Description
Technical field
The invention belongs to technical field of electronic materials, and in particular to a kind of preparation side of Cu-Ni-Gd-B-P electronic fabric
Method.
Background technique
With the continuous development of the communications industry, miscellaneous electronic equipment answering in the fields such as traffic, medical treatment, scientific research
With more and more extensive.However, while enjoying these electronic equipments is that daily life brings great convenience, great Jia Ye
It is faced with the risk by electromagnetic radiation pollution.It is reported that Long Term Contact electromagnetic radiation can cause vision impairment, dysaudia and
The illnesss such as arrhythmia cordis.Therefore, it prepares wearable electromagnetic shielding material and receives the extensive attention of all circles.In general, shielding material
Material can be divided into two types: wave reflection, which dominates material and inhales wave, dominates material.Metal is that material is dominated in typical wave reflection, extensively
Applied in electromagnetic shielding field.But, Metal Substrate shielding material (including metal laminate plate, wire mesh, metal foam and gold
Belong to foil etc.) have the shortcomings that hard, weight is excessive, corrosion-vulnerable.In recent years, the research of Portable flexible Electromagnetically shielding fabrics by
Concern.In fabric surface deposited metal coating, the flexibility of source textile can be possessed, it is considered to be prepare the one of Electromagnetically shielding fabrics
Kind feasible scheme.Chemical plating is because the advantages that its is easy to operate, low in cost, is as fabric face metallized common method.Change
It learns plating and generally includes three surface modification, catalytic activation and metal deposit steps.Studies have found that being added in chemical plating fluid micro-
Rare earth is measured, deposition rate can be accelerated, refining grain size enhances corrosion resistance.Because rare earth has special 4f sub-layer rail
Road electronics can accelerate electron transfer rate, and furthermore rare earth atom radius is larger, it is intended to be deposited on crystal boundary and fault location, drop
Low surface tension and interfacial energy to improve deposition rate, and then obtain the metal coating of dense uniform, effectively prevent corroding
The destruction of substance.
Generally, it is considered that rare earth element, which is added, can be improved the form compact and stable property of metal layer, to improve metallic cover type electricity
The corrosion resistance of sub- fabric, but in this application, rare earth Gd is added, leads to the corrosion resistance of Cu-Ni-Gd-P electronic fabric
Lower than Cu-Ni-P electronic fabric, and light element B is added, the corrosion resistance for obtaining Cu-Ni-Gd-B-P electronic fabric is better than Cu-
Ni-P, i.e., in terms of electronic fabric corrosion resistance index, Cu-Ni-Gd-B-P > Cu-Ni-P > Cu-Ni-Gd-P, this is
The phenomenon that other documents are not reported.
Summary of the invention
The purpose of the present invention is to provide a kind of preparation methods of Cu-Ni-Gd-B-P electronic fabric.
The present invention proposes the preparation method of Cu-Ni-Gd-B-P electronic fabric, selects sodolin as substrate, utilizes change
The technique for learning plating deposits one layer of Cu-Ni-Gd-B-P alloy layer on its surface.Concrete technology flow process: including surface alkali process, table
Face modification, adsorption of metal ions, in-situ reducing and metal co-deposition etc..
The preparation method of Cu-Ni-Gd-B-P electronic fabric proposed by the present invention, the specific steps are as follows:
(1) surface alkali process: sodolin is placed in aqueous slkali and is handled 10-30 minutes；
(2) surface is modified: the sodolin after step (1) alkali process being immersed in silane coupler solution 5-10 minutes, is put
Enter baking oven drying, repeats the step 2-3 times；
(3) adsorption of metal ions: the sodolin after step (2) modification is placed in metal ion solution and impregnates 10-30
Minute, take out drying；
(4) sodolin that step (3) process adsorbing metal ions in-situ reducing: is put into reducing agent solution 10-30 points
Clock takes out, and cleans；
(5) metal co-deposition: the sodolin after step (4) reduction is placed in alloy electroplating bath, in 50-90 DEG C of chemical plating
It 0.5-2 hours, takes out and cleans, Cu-Ni-Gd-B-P electronic fabric is made in drying.
It is 1cm by area in the present invention2Cu-Ni-Gd-B-P electronic fabric be placed in 50ml concentration be 310g/L, pH=
12, free chlorine is to impregnate 48 hours in the sodium chloride solution of 40ppm in 25 DEG C, is surveyed with energy dispersion type Xray fluorescence spectrometer
Try sodium chloride solution in concentration of heavy metal ion, measure copper ion≤0.20ppm, nickel ion≤0.15ppm, gadolinium ion≤
0.10ppm。
In the present invention, the solvent of aqueous slkali described in step (1) is deionized water, and solute is sodium hydroxide or hydroxide
Potassium, solute concentration 5wt%-10wt%.
In the present invention, the solvent of silane coupler solution described in step (2) is dehydrated alcohol, and solute is 3- aminopropyl
Trimethoxy silane, solute concentration 1wt%-2wt%.
In the present invention, the solvent of metal ion solution described in step (3) is deionized water, and the solute of solution is cobaltous sulfate
Or nickel sulfate, the molar concentration of metal ion are 0.5-2 mol/L.
In the present invention, the solute of reducing agent solution described in step (4) is potassium borohydride or sodium borohydride, solvent be go from
Sub- water, the molar concentration of reducing agent are 0.5-1 mol/L.
In the present invention, the formula of alloy electroplating bath described in step (5) is that solvent is deionized water, and various solutes are in solution
The concentration of copper sulphate is 2-5 g/L, and the concentration of nickel sulfate is 10-30 g/L, the concentration 10-30 g/L of sodium hypophosphite, lemon
The concentration of sour sodium is 40-100 g/L, and the concentration of gadolinium chloride is 0.3-0.5 g/L, and the concentration of boric acid is 0.3-0.5 g/L, hydrogen-oxygen
The concentration for changing sodium is 4-6 g/L.
In the present invention, if not boronic acid containing in the formula of alloy electroplating bath in step (5), the present invention also provides following technical sides
Case is as a comparison:
By step (4) reduction after sodolin be placed in alloy electroplating bath, 50-90 DEG C chemical plating 0.5-2 hour, taking-up
It cleans, Cu-Ni-Gd-P electronic fabric is made in drying.It is 1cm by area2Cu-Ni-Gd-P electronic fabric be placed in 50ml concentration
It is to be impregnated 48 hours in 25 DEG C, in the sodium chloride solution of 40ppm with energy dispersion type X-ray for 310g/L, pH=12, free chlorine
Fluorescence Spectrometer tests the concentration of heavy metal ion in sodium chloride solution, measures that copper ion concentration is 26ppm, nickel ion is concentration
48ppm, gadolinium ion concentration are 5.3ppm.
In the present invention, if not boronic acid containing and gadolinium chloride in the formula of alloy electroplating bath in step (5), the present invention also provides such as
Lower technical solution is as a comparison:
By step (4) reduction after sodolin be placed in alloy electroplating bath, 50-90 DEG C chemical plating 0.5-2 hour, taking-up
It cleans, Cu-Ni-P electronic fabric is made in drying.It is 1cm by area2Cu-Ni-P electronic fabric be placed in 50ml concentration and be
In 310g/L, pH=12, the sodium chloride solution that free chlorine is 40ppm, impregnated 48 hours in 25 DEG C, it is glimmering with energy dispersion type X-ray
Photothermal spectroscopic analyzer tests the concentration of heavy metal ion in sodium chloride solution, measures that copper ion concentration is 12ppm, nickel ion concentration is
29ppm, gadolinium ion concentration are 3.3ppm.
It can be seen from above-mentioned correlation technique scheme compared with Cu-Ni-P electronic fabric, contain in electroless alloy layer
Rare-earth element gadolinium, then the metal ion flood rate of electronic fabric rises, i.e., rare earth element declines the corrosion resistance of alloy-layer；
But gadolinium and boron element are added in alloy-layer, then the metal ion flood rate of electronic fabric is remarkably decreased, i.e. boron element and rare earth
Element collective effect, so that the corrosion resistance of alloy-layer is promoted.I.e. technical solution of the present invention produces unexpected significant
Technical effect has creativeness.
Cu-Ni-Gd-B-P prepared by the present invention cladding fabric has the advantage that (1) selects sodolin as substrate,
It is its absorbing sweat, good permeability, harmless.(2) alkali process not only facilitates silane coupler modified, moreover it is possible to improve fabric substrate
Adhesive force between metal coating.(3) precious metal activation is replaced with base metal, not only shortens the process time, but also reduce
Process costs.Electronic fabric prepared by the present invention can be successfully applied to flexible wearable electronic product, wide market.
Specific embodiment
The invention is further illustrated by the following examples.
Embodiment 1
Sodolin is placed in aqueous slkali and is handled 10 minutes；Sodolin after alkali process is immersed in silane coupler solution
In 5 minutes, be put into baking oven drying, repeat the step 2 time；Sodolin after step modification is placed in metal ion solution
It is middle to impregnate 10 minutes, take out drying；The sodolin of processed adsorbing metal ions is put into reducing agent solution 10 minutes, is taken
Out, it cleans；Sodolin after reduction is placed in alloy electroplating bath, 50 DEG C chemical plating 0.5 hour, take out clean, dry
It is dry, Cu-Ni-Gd-B-P electronic fabric is made.Wherein, the solvent of aqueous slkali is deionized water, and solute is sodium hydroxide, and solute is dense
Degree is 5wt%；The solvent of silane coupler solution is dehydrated alcohol, and solute is 3- TSL 8330, solute concentration
For 1wt%；The solvent of metal ion solution is deionized water, and the solute of solution is cobaltous sulfate, and the molar concentration of metal ion is
0.5mol/L；The solute of reducing agent solution is potassium borohydride, and solvent is deionized water, and the molar concentration of reducing agent is 0.5
mol/L；The formula of alloy electroplating bath is that solvent is deionized water, and it is 2g/L, sulfuric acid that various solutes, which are the concentration of copper sulphate, in solution
The concentration of nickel is 10g/L, and the concentration of the concentration 10g/L of sodium hypophosphite, sodium citrate are 40g/L, and the concentration of gadolinium chloride is
0.3g/L, the concentration of boric acid are 0.3g/L, and the concentration of sodium hydroxide is 4g/L.
It is 1cm by area2Cu-Ni-Gd-B-P electronic fabric be placed in that 50ml concentration is 310g/L, pH=12, free chlorine is
In the sodium chloride solution of 40ppm, impregnated 48 hours in 25 DEG C, it is molten with energy dispersion type Xray fluorescence spectrometer test sodium chloride
Concentration of heavy metal ion in liquid, measuring copper ion concentration 0.20ppm, nickel ion concentration 0.15ppm, gadolinium ion concentration is
0.10ppm。
Embodiment 2
Sodolin is placed in aqueous slkali and is handled 30 minutes；Sodolin after alkali process is immersed in silane coupler solution
In 10 minutes, be put into baking oven drying, repeat the step 3 time；Sodolin after modification is placed in metal ion solution
It impregnates 30 minutes, takes out drying；The sodolin of processed adsorbing metal ions is put into reducing agent solution 30 minutes, is taken
Out, it cleans；Sodolin after reduction is placed in alloy electroplating bath, 90 DEG C chemical plating 2 hours, take out clean, dry, system
Obtain Cu-Ni-Gd-B-P electronic fabric.Wherein, the solvent of aqueous slkali is deionized water, and solute is potassium hydroxide, and solute concentration is
10wt%；The solvent of silane coupler solution is dehydrated alcohol, and solute is 3- TSL 8330, and solute concentration is
2wt%；The solvent of metal ion solution is deionized water, and the solute of solution is or nickel sulfate, the molar concentration of metal ion are 2
mol/L；The solute of reducing agent solution is sodium borohydride, and solvent is deionized water, and the molar concentration of reducing agent is 1 mol/L；It closes
The formula of golden plating solution is that solvent is deionized water, and it is 5 g/L, the concentration of nickel sulfate that various solutes, which are the concentration of copper sulphate, in solution
For 30 g/L, 30 g/L of concentration of sodium hypophosphite, the concentration of sodium citrate is 100 g/L, and the concentration of gadolinium chloride is 0.5 g/
L, the concentration of boric acid are 0.5 g/L, and the concentration of sodium hydroxide is 6 g/L.
It is 1cm by area2Cu-Ni-Gd-B-P electronic fabric be placed in that 50ml concentration is 310g/L, pH=12, free chlorine is
In the sodium chloride solution of 40ppm, impregnated 48 hours in 25 DEG C, it is molten with energy dispersion type Xray fluorescence spectrometer test sodium chloride
Concentration of heavy metal ion in liquid, measures that copper ion concentration is 0.18ppm, nickel ion concentration 0.13ppm, gadolinium ion concentration are
0.08ppm。
Embodiment 3
Sodolin is placed in aqueous slkali and is handled 30 minutes；Sodolin after alkali process is immersed in silane coupler solution
In 10 minutes, be put into baking oven drying, repeat the step 3 time；It is molten that sodolin after step modification is placed in metal ion
It is impregnated 10 minutes in liquid, takes out drying；The sodolin of processed adsorbing metal ions is put into reducing agent solution 30 minutes,
It takes out, cleans；Sodolin after reduction is placed in alloy electroplating bath, 90 DEG C chemical plating 2 hours, take out clean, dry
It is dry, Cu-Ni-Gd-B-P electronic fabric is made.Wherein, the solvent of aqueous slkali is deionized water, and solute is sodium hydroxide, and solute is dense
Degree is 5wt%；The solvent of silane coupler solution is dehydrated alcohol, and solute is 3- TSL 8330, solute concentration
For 1.5wt%；The solvent of metal ion solution is deionized water, and the solute of solution is cobaltous sulfate, and the molar concentration of metal ion is
1.5mol/L；The solute of reducing agent solution is potassium borohydride, and solvent is deionized water, and the molar concentration of reducing agent is 0.75
mol/L；The formula of alloy electroplating bath is that solvent is deionized water, and it is 3g/L, sulfuric acid that various solutes, which are the concentration of copper sulphate, in solution
The concentration of nickel is 12g/L, and the concentration of the concentration 12g/L of sodium hypophosphite, sodium citrate are 45g/L, and the concentration of gadolinium chloride is
0.4g/L, the concentration of boric acid are 0.4g/L, and the concentration of sodium hydroxide is 5g/L.
It is 1cm by area2Cu-Ni-Gd-B-P electronic fabric be placed in that 50ml concentration is 310g/L, pH=12, free chlorine is
In the sodium chloride solution of 40ppm, impregnated 48 hours in 25 DEG C, it is molten with energy dispersion type Xray fluorescence spectrometer test sodium chloride
Concentration of heavy metal ion in liquid, measuring copper ion concentration 0.14ppm, nickel ion concentration 0.11ppm, gadolinium ion concentration is
0.09ppm。
Embodiment 4
Sodolin is placed in aqueous slkali and is handled 20 minutes；Sodolin after alkali process is immersed in silane coupler solution
In 8 minutes, be put into baking oven drying, repeat the step 3 time；Sodolin after modification is placed in metal ion solution and is soaked
Bubble 20 minutes takes out drying；The sodolin of processed adsorbing metal ions is put into reducing agent solution 20 minutes, is taken out,
It cleans；Sodolin after reduction is placed in alloy electroplating bath, 80 DEG C chemical plating 2 hours, take out clean, dry, be made
Cu-Ni-Gd-B-P electronic fabric.Wherein, the solvent of aqueous slkali is deionized water, and solute is potassium hydroxide, and solute concentration is
8wt%；The solvent of silane coupler solution is dehydrated alcohol, and solute is 3- TSL 8330, and solute concentration is
2wt%；The solvent of metal ion solution is deionized water, and the solute of solution is or nickel sulfate, the molar concentration of metal ion are 1
mol/L；The solute of reducing agent solution is sodium borohydride, and solvent is deionized water, and the molar concentration of reducing agent is 1 mol/L；It closes
The formula of golden plating solution is that solvent is deionized water, and it is 4 g/L, the concentration of nickel sulfate that various solutes, which are the concentration of copper sulphate, in solution
For 25 g/L, 25 g/L of concentration of sodium hypophosphite, the concentration of sodium citrate is 90 g/L, and the concentration of gadolinium chloride is 0.5 g/L,
The concentration of boric acid is 0.4 g/L, and the concentration of sodium hydroxide is 5 g/L.
It is 1cm by area2Cu-Ni-Gd-B-P electronic fabric be placed in that 50ml concentration is 310g/L, pH=12, free chlorine is
In the sodium chloride solution of 40ppm, impregnated 48 hours in 25 DEG C, it is molten with energy dispersion type Xray fluorescence spectrometer test sodium chloride
Concentration of heavy metal ion in liquid, measures that copper ion concentration is 0.19ppm, nickel ion concentration 0.12ppm, gadolinium ion concentration are
0.07ppm。
Embodiment 5
Sodolin is placed in aqueous slkali and is handled 26 minutes；Sodolin after alkali process is immersed in silane coupler solution
In 8 minutes, be put into baking oven drying, repeat the step 2 time；Sodolin after modification is placed in metal ion solution and is soaked
Bubble 22 minutes takes out drying；The sodolin of processed adsorbing metal ions is put into reducing agent solution 25 minutes, is taken out,
It cleans；Sodolin after reduction is placed in alloy electroplating bath, 70 DEG C chemical plating 1.5 hours, take out clean, dry, system
Obtain Cu-Ni-Gd-B-P electronic fabric.Wherein, the solvent of aqueous slkali is deionized water, and solute is potassium hydroxide, and solute concentration is
8wt%；The solvent of silane coupler solution is dehydrated alcohol, and solute is 3- TSL 8330, and solute concentration is
1.8wt%；The solvent of metal ion solution is deionized water, and the solute of solution is or nickel sulfate, the molar concentration of metal ion are
1.8 mol/L；The solute of reducing agent solution is sodium borohydride, and solvent is deionized water, and the molar concentration of reducing agent is 0.9
mol/L；The formula of alloy electroplating bath is that solvent is deionized water, and it is 4.8 g/L, sulphur that various solutes, which are the concentration of copper sulphate, in solution
The concentration of sour nickel is 280 g/L, 26 g/L of concentration of sodium hypophosphite, and the concentration of sodium citrate is 95 g/L, gadolinium chloride it is dense
Degree is 0.4 g/L, and the concentration of boric acid is 0.5 g/L, and the concentration of sodium hydroxide is 5 g/L.
It is 1cm by area2Cu-Ni-Gd-B-P electronic fabric be placed in that 50ml concentration is 310g/L, pH=12, free chlorine is
In the sodium chloride solution of 40ppm, impregnated 48 hours in 25 DEG C, it is molten with energy dispersion type Xray fluorescence spectrometer test sodium chloride
Concentration of heavy metal ion in liquid, measures that copper ion concentration is 0.17ppm, nickel ion concentration 0.15ppm, gadolinium ion concentration are
0.09ppm。
Claims (7)
1. a kind of preparation method of Cu-Ni-Gd-B-P electronic fabric, it is characterised in that specific step is as follows:
(1) surface alkali process: sodolin is placed in aqueous slkali and is handled 10-30 minutes；
(2) surface is modified: the sodolin after step (1) alkali process being immersed in silane coupler solution 5-10 minutes, is put
Enter baking oven drying, repeats the step 2-3 times；
(3) adsorption of metal ions: the sodolin after step (2) modification is placed in metal ion solution and impregnates 10-30
Minute, take out drying；
(4) sodolin that step (3) process adsorbing metal ions in-situ reducing: is put into reducing agent solution 10-30 points
Clock takes out, and cleans；
(5) metal co-deposition: the sodolin after step (4) reduction is placed in alloy electroplating bath, in 50-90 DEG C of chemical plating
It 0.5-2 hours, takes out and cleans, Cu-Ni-Gd-B-P electronic fabric is made in drying.
2. preparation method according to claim 1, it is characterised in that: the solvent of aqueous slkali described in step (1) be go from
Sub- water, solute are sodium hydroxide or potassium hydroxide, solute concentration 5wt%-10wt%.
3. preparation method according to claim 1, it is characterised in that: silane coupler solution described in step (2) it is molten
Agent is dehydrated alcohol, and solute is 3- TSL 8330, solute concentration 1wt%-2wt%.
4. preparation method according to claim 1, it is characterised in that: the solvent of metal ion solution described in step (3)
For deionized water, the solute of solution is cobaltous sulfate or nickel sulfate, and the molar concentration of metal ion is 0.5-2 mol/L.
5. preparation method according to claim 1, it is characterised in that: the solute of reducing agent solution described in step (4) is
Potassium borohydride or sodium borohydride, solvent are deionized water, and the molar concentration of reducing agent is 0.5-1 mol/L.
6. preparation method according to claim 1, it is characterised in that: the formula of alloy electroplating bath described in step (5) is molten
Agent is deionized water, and it is 2-5 g/L that various solutes, which are the concentration of copper sulphate, in solution, and the concentration of nickel sulfate is 10-30 g/L, secondary
The concentration 10-30 g/L of sodium phosphite, the concentration of sodium citrate are 40-100 g/L, and the concentration of gadolinium chloride is 0.3-0.5 g/L,
The concentration of boric acid is 0.3-0.5 g/L, and the concentration of sodium hydroxide is 4-6 g/L.
7. preparation method according to claim 1, it is characterised in that: the Cu-Ni-Gd-B-P electronic fabric it is corrosion-resistant
Property are as follows: by area be 1cm2Cu-Ni-Gd-B-P electronic fabric be placed in that 50ml concentration is 310g/L, pH=12, free chlorine is
In the sodium chloride solution of 40ppm, impregnated 48 hours in 25 DEG C, it is molten with energy dispersion type Xray fluorescence spectrometer test sodium chloride
Concentration of heavy metal ion in liquid, measure copper ion concentration≤0.20ppm, nickel ion concentration≤0.15ppm, gadolinium ion concentration≤
0.10ppm。
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112331378A (en) * | 2020-11-19 | 2021-02-05 | 中国工程物理研究院应用电子学研究所 | Flexible wearable conductive material with Joule heating performance and preparation method thereof |
| CN112647067A (en) * | 2020-12-24 | 2021-04-13 | 西安稀有金属材料研究院有限公司 | Gadolinium-plated tungsten/gadolinium-plated boron carbide powder and preparation method and application thereof |
| CN113881097A (en) * | 2021-09-08 | 2022-01-04 | 复旦大学 | Ultrahigh-performance terahertz absorption sponge and preparation method thereof |
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