CN106049035A - Establishment method of conductive circuit on surface of flexible fabric - Google Patents
Establishment method of conductive circuit on surface of flexible fabric Download PDFInfo
- Publication number
- CN106049035A CN106049035A CN201610395387.4A CN201610395387A CN106049035A CN 106049035 A CN106049035 A CN 106049035A CN 201610395387 A CN201610395387 A CN 201610395387A CN 106049035 A CN106049035 A CN 106049035A
- Authority
- CN
- China
- Prior art keywords
- fabric
- wax
- flexible
- flexible fabric
- concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/83—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metals; with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M13/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with non-macromolecular organic compounds; Such treatment combined with mechanical treatment
- D06M13/50—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with non-macromolecular organic compounds; Such treatment combined with mechanical treatment with organometallic compounds; with organic compounds containing boron, silicon, selenium or tellurium atoms
- D06M13/51—Compounds with at least one carbon-metal or carbon-boron, carbon-silicon, carbon-selenium, or carbon-tellurium bond
- D06M13/513—Compounds with at least one carbon-metal or carbon-boron, carbon-silicon, carbon-selenium, or carbon-tellurium bond with at least one carbon-silicon bond
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M23/00—Treatment of fibres, threads, yarns, fabrics or fibrous goods made from such materials, characterised by the process
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M2101/00—Chemical constitution of the fibres, threads, yarns, fabrics or fibrous goods made from such materials, to be treated
- D06M2101/02—Natural fibres, other than mineral fibres
- D06M2101/04—Vegetal fibres
- D06M2101/06—Vegetal fibres cellulosic
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M2400/00—Specific information on the treatment or the process itself not provided in D06M23/00-D06M23/18
- D06M2400/02—Treating compositions in the form of solgel or aerogel
Landscapes
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention belongs to the technical field of flexible electronic materials and particularly relates to an establishment method of a conductive circuit on the surface of flexible fabric. According to the preparation method, the flexible fabric is taken as a base body, a needle-type waxing technique is combined with a chemical plating technique, and a metal circuit pattern is established on the surface of the flexible fabric. The specific process comprises steps as follows: cleaning of the fabric, self-assembly modification of a silane coupling agent, needle-type waxing, gold nano-gel activation, chemical copper plating, wax removal and the like. The establishment method of the conductive circuit on the surface of the flexible fabric has the following advantages: (1) wax on wax paper is transferred to the surface of the fabric in a solid form, accordingly, the precision of the formed wax pattern is high, and the precision of the correspondingly obtained circuit is controllable; (2) the obtained copper conductive circuit is continuous, compact, high in electric conductivity and controllable in precision. According to the establishment method of the conductive circuit on the surface of the flexible fabric, the needle-type waxing technique is combined with the chemical plating technique, and a novel preparation method of the flexible circuit is developed.
Description
Technical field
The invention belongs to flexible electronics technical field, be specifically related to the structure of a kind of flexible fabric surface conductance circuit
Method.
Background technology
Flexible wearable electronics (wearable electronics) is worn on human body so that equipment is miniaturized, and realizes people
The real-time monitoring of body physiologic information, has highly important application, such as electronic skin, wearable heart at medical treatment, health field
Defibrillator, the flexible circuit being placed in contact lens, wearable electrocardio respiration pickup etc..Flexible electronic and conditional electronic it
Between the most basic difference be design circuit substrate on, i.e. with flexible base board replace rigid substrates.Owing to textile has soft
Toughness and can the characteristic of random bending fold etc., when studying flexible wearable circuit, flexible fabric becomes first-selection substrate material
Material.Compliant conductive fabric disclosure satisfy that people's requirement for portability, flexibility and the comfortableness of wearable circuit.
Present stage, the construction method of flexible fabric surface conductance figure mainly has two categories below: 1, utilize textile weaving
Conductive yam is enrolled in the organizational structure of fabric by technique (knitting, woven, embroidery).2, printing technology (inkjet printing, silk screen are utilized
Printing) print conductive inks water or slurry on fabric, then carry out high temperature sintering.The weaving method such as knitting or woven can be by pre-
The conductive yam shuffling made inweaves in fabric structure, but is limited by the weave patterns (warp-wise or broadwise) of fabric, conductive yam
The direction enrolled can only be perpendicular or parallel to the selvedge of fabric, thus limits freely designing of conductive pattern on fabric.Thorn
Although embroidering and have good design freedom when conductive yam connects up, but it being higher to prefabricated conductive yam flexibility requirements, and
When preparation high accuracy circuit, with high costs.Inkjet printing or screen printing technique all compare dependence conductive ink or conductive paste
The development of material and sintering process.Common fabric is mostly porous material, meeting when fluid (ink or slurry) infiltrates on its surface
Produce " wicking " phenomenon, reduce the precision of gained conducting wire.So typically by increasing ink or slurry in actual production
Viscosity weaken this phenomenon, but excessive viscosity blocks jet orifice or silk screen hole sometimes.In addition, sintering process
The base material that the hot conditions used can make some high temperature degradable thermally decomposes, thus flexible electronic field is main now
The base material used is still resistant to elevated temperatures polyimides (PI) material.A lot of typographies contain fine metal particles by preparation
Conductive ink or slurry reduce the sintering temperature of prefabricated metal circuit diagram, to widen be suitable for Body regions.
The present invention is directed to existing Technology controllable precision be poor when fabric face builds conducting wire, process costs height,
The problems such as the applicable narrow range of base material, it is provided that a kind of operation that reduces, reduction cost, carry high efficiency flexible fabric surface conductance line
The construction method on road.Ultimate principle is first by fabric face chemical modification, improves the hydrophilic of fabric, and grafting simultaneously can be coordinated
The organo-functional group of adsorption activation metallic.Recycling pin type waxing technology forms hydrophobic region (wax pattern district) on fabric
With hydrophilic region (blank modified zone).Then being put into by fabric in activation colloid solution, hydrophilic region adsorption activation particle is formed
Catalysis active site, and grow in next step electroless plating reaction and the metal thin film patterns of wax pattern complementary.The present invention utilizes
Waxing technology, at fabric face Preformed circuits figure, forms the metallic circuit figure of complementation the most again.Owing to wax is directly with solid
The form of body transfers to fabric face from commercial paraffin paper, will not produce " wicking " phenomenon, the most prefabricated circuit diagram on fabric
The precision of circuit can effectively control.The present invention uses the method for electroless copper to make to complete circuitous pattern simultaneously, it is not necessary to sintering
Step, thus it is applicable to all kinds of textile substrate.
Summary of the invention
It is an object of the invention to provide a kind of for solving the deficiencies in the prior art and reduce operation, reduce cost, improve effect
The construction method of the flexible fabric surface conductance circuit of rate.
To achieve these goals, the construction method of flexible fabric surface conductance circuit proposed by the invention, including such as
Lower step:
(1) clean textile: fabric is cleaned, dries；
(2) silane coupler is self-assembled modified: is soaked in by cleaned fabric in silane coupler solution 5 ~ 10 minutes, takes
Go out, in 100 ~ 120 DEG C of drying, soak and drying cycle 3 ~ 5 times；
(3) impact printer is utilized to wax pattern on the fabric that step (2) processed；
(4) Nano sol activation: be placed in by the fabric that step (3) processed in Nano sol solution 3 ~ 5 hours, takes out, cleans；
(5) electroless copper: be immersed in copper chemical plating fluid by the fabric that step (4) processed, in 30 ~ 60 DEG C of chemical platings 1～3
Hour, take out and clean；
(6) wax removing: be placed in organic wax removing solvent by the fabric after electroless copper, treats that the wax on fabric is completely dissolved in organic removing
After wax solvent, take out and dry, prepare flexible fabric conductive pattern.
In the present invention, the fabric that described fabric preferentially selects composition to be cellulose, particularly as follows: cotton, Caulis et Folium Lini, CUP or
In tencel any one.Can be native cellulose fibre (cotton, Caulis et Folium Lini etc.) or regenerated celulose fibre (CUP, tencel, not
Dai Er etc.)；This kind of flexible fabric is high hydroxyl content fabric, thus the good hydrophilic property of fabric own, and fabric wide material sources, cost
Cheap.
In the present invention, the solute of described silane coupler solution is 3-TSL 8330, and solvent is third
Ketone, the mass percentage concentration of silane coupler solution is 0.1% ~ 1%.
In the present invention, described impact printer is the office printer that common invoice prints, and consumptive material is commercial wax
Paper, printing flow process is: fabric to be printed is placed in the paper feed port bottom paraffin paper and being jointly placed on printer, couples printer
After, the wax on paraffin paper, by computer-controlled print system, is transferred directly to knit by wiring diagram in solid form that design
On thing, form the wax pattern corresponding with wiring diagram.
In the present invention, the formula of the gold nano sol solution described in step (4) be solvent be deionized water, each in solution
It is 1 ~ 2 g/L that kind solute concentration is respectively as follows: the concentration of gold chloride；The concentration of trisodium citrate is 5 ~ 10 g/L；Sodium chloride
Concentration is 10 ~ 20 g/L；The concentration of sodium borohydride is 2 ~ 4 g/L.
In the present invention, the formula of the copper chemical plating fluid described in step (5) be solvent be deionized water, various molten in solution
Matter is respectively as follows: concentration of copper sulfate 5 ~ 10 g/L, Soluble tartar. na concn 20 ~ 30 g/L, naoh concentration 5 ~ 10 g/L, carbonic acid
Na concn 1 ~ 2 g/L, concentration of formaldehyde 5 ~ 10 g/L.
In the present invention, the dehydrated alcohol that organic wax removing solvent is mass fraction 99.7% described in step (6).
The construction method of the flexible fabric surface conductance circuit that the present invention proposes has the advantage that fabric selected by (1)
Composition is cellulose, wide material sources, belongs to Renewable resource, environmental protection；(2) utilize chemical modification by fabric face amination,
On the one hand the hydrophilic of fabric can be promoted；On the other hand and there is self-assembling reaction between catalyst particle, very big enhance
The adsorptivity of catalyst particle and homogeneity, thus promote the adhesiveness between conducting wire and the fabric finally obtained, increase institute
Obtain the reliability of flexible circuit；(3) wax on paraffin paper is to transfer to fabric face in solid form, the wax pattern essence therefore formed
Degree height, the conducting wire precision that correspondence obtains is controlled.The construction method of the flexible fabric surface conductance circuit that the present invention proposes, will
Pin type waxing technology is combined with electroless plating technology, has started a kind of brand-new method preparing flexible circuit.Prepared by the present invention
Flexible circuit can be used for the new high-tech product such as medical treatment, health field, wide market.
The beneficial effects of the present invention is: the fabric composition selected by (1) is cellulose, abundant raw material source, reduce work
Skill cost；(2) silane coupler may act as the molecule bridge between matrix and metal circuitry of weaving, and improves the reliable of product
Property；(3) copper conductive traces obtained is continuously, fine and close, electrical conductivity is high, and precision is controlled；(4) technical process easy maintenance, to instrument
The dependency degree of equipment is low carries out continuous prodution, can meet the market demand.
Accompanying drawing explanation
Fig. 1 is the method flow diagram of flexible fabric surface construction conducting wire proposed by the invention；
Fig. 2 is the sample object figure in the embodiment of the present invention 1 after copper facing；
Fig. 3 is the Sample Scan Electronic Speculum figure in the embodiment of the present invention 1 after copper facing；
Fig. 4, Fig. 5 are the sample optical microscope photograph in the embodiment of the present invention 2 after copper facing.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, right
The present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, not
For limiting the present invention.
Embodiment 1
S11: select CUP fabric (45 × 45 count/cm2, 8 mg/cm2) it is base material, accurately it is cut into 60 mm
X 60 mm, the most respectively with deionized water, ethanol rinse the most totally, dries.
S12: cleaned fabric is placed in the 3-TSL 8330 acetone soln that concentration is 0 .1%, leaching
Steep 5 points
Clock, takes out, and then 100 DEG C of drying, soaks and drying cycle 3 times.
S13: paraffin paper is placed on printing fabric top, is placed on the paper feed mechanism reflecting beautiful FP-630K impact printer jointly
In.After coupling printer, by computer, the wiring diagram file designed is exported to printer printing.
S14: preparation gold nano sol solution: by 1g gold chloride, 5g trisodium citrate, 10g sodium chloride, 2g hydroboration
Sodium is dissolved in 500mL deionized water, dissolves complete, adds deionized water, is 1L to liquor capacity.Knitting of wax pattern will be printed on
Thing is placed in gold nano sol solution, places 3 hours, takes out, and cleans, obtains the fabric of surface Selective activation.
S15: preparation copper chemical plating fluid: by 5g blue vitriol, 20g sodium potassium tartrate tetrahydrate, 5g sodium hydroxide, 1g sodium carbonate, 5g first
Aldehyde is dissolved in 500mL deionized water, dissolves complete, adds deionized water, is 1L to liquor capacity, obtains chemical copper plating solution.
The just fabric after step S14 activates is immersed in described copper chemical plating fluid, is warming up to 60 DEG C, electroless copper 1
Hour.
S16: be placed in dehydrated alcohol by the fabric after electroless copper, after the wax on fabric is completely dissolved in ethanol, takes out
Dry,
Obtain designed flexible circuit, as shown in Fig. 2 in kind.Scanning electronic microscope examination, gained copper coating uniform ground,
As shown in Fig. 3.
It is 7.42 μ Ω cm that four probe method records the resistivity of copper conductive traces.Copper wire and the adhesive force of fabric substrate
It is assessed as 1 grade by the regulation of GB GB/T9286-1998.
Embodiment 2
S21: select modal fabric (18 × 45 count/cm2, 17.5 mg/cm2) it is base material, accurately it is cut into 60 mm
X 60 mm, the most respectively with deionized water, ethanol rinse the most totally, dries.
S22: cleaned fabric is placed in the 3-TSL 8330 acetone soln that concentration is 0.5%, soaks
8 points
Clock, takes out, and then 120 DEG C of drying, soaks and drying cycle 3 times.
S23: paraffin paper is placed on printing fabric top, is placed on the paper feed port reflecting beautiful FP-630K impact printer jointly.Connection
After connecing printer, by computer, the wiring diagram file designed is exported to printer printing.
S24: preparation gold nano sol solution: by 2g gold chloride, 10g trisodium citrate, 20g sodium chloride, 4g boron hydrogen
Change sodium to be dissolved in 500mL deionized water, dissolve complete, add deionized water, be 1L to liquor capacity.Wax pattern will be printed on
Fabric is placed in gold nano sol solution, places 3.5 hours, takes out, and cleans, obtains the fabric of surface Selective activation.
S25: preparation copper chemical plating fluid: by 10g blue vitriol, 30g sodium potassium tartrate tetrahydrate, 10g sodium hydroxide, 2g sodium carbonate, 10g
Formaldehyde is dissolved in 500mL deionized water, dissolves complete, adds deionized water, is 1L to liquor capacity, obtains chemical copper plating solution.
The just fabric after step S24 activates is immersed in described copper chemical plating fluid, is warming up to 40 DEG C, electroless copper
1.5 hour.
S26: be placed in dehydrated alcohol by the fabric after electroless copper, after the wax on fabric is completely dissolved in ethanol, takes out
Dry,
Obtain designed flexible circuit.The surface topography of copper cash and border observation by light microscope, as shown in Figure 3, Figure 4；
It is 6.43 μ Ω cm that four probe method records the resistivity of copper conductive traces.The adhesive force of copper wire and fabric substrate is by state
The regulation of mark GB/T9286-1998 is assessed as 1 grade.
Embodiment 3
S31: select bafta (108 × 58 count/cm2, 28 mg/cm2) it is base material, accurately it is cut into 60 mm x 60
Mm, the most respectively with deionized water, ethanol rinse the most totally, dries.
S32: cleaned fabric is placed in the 3-TSL 8330 acetone soln that concentration is 0.7%, soaks
7 points
Clock, takes out, and then 120 DEG C of drying, soaks and drying cycle 4 times.
S33: paraffin paper is placed on printing fabric top, is placed on the paper feed port reflecting beautiful FP-630K impact printer jointly.Connection
After connecing printer, by computer, the wiring diagram file designed is exported to printer printing.
S34: preparation gold nano sol solution: by 1.5g gold chloride, 8g trisodium citrate, 15g sodium chloride, 3g boron hydrogen
Change sodium to be dissolved in 500mL deionized water, dissolve complete, add deionized water, be 1L to liquor capacity.Wax pattern will be printed on
Fabric is placed in gold nano sol solution, places 3.5 hours, takes out, and cleans, obtains the fabric of surface Selective activation.
S35: preparation copper chemical plating fluid: by 8g blue vitriol, 25g sodium potassium tartrate tetrahydrate, 7g sodium hydroxide, 2g sodium carbonate, 7g first
Aldehyde is dissolved in 500mL deionized water, dissolves complete, adds deionized water, is 1L to liquor capacity, obtains chemical copper plating solution.
The just fabric after step S34 activates is immersed in described copper chemical plating fluid, is warming up to 45 DEG C, electroless copper 2
Hour.
S36: be placed in dehydrated alcohol by the fabric after electroless copper, after the wax on fabric is completely dissolved in ethanol, takes out
Dry,
Obtain designed flexible circuit.
It is 6.33 μ Ω cm that four probe method records the resistivity of copper conductive traces.Copper wire and the adhesive force of fabric substrate
It is assessed as 1 grade by the regulation of GB GB/T9286-1998.
Embodiment 4
S41: select sodolin (20 × 25 count/cm2, 18 mg/cm2) it is base material, accurately it is cut into 60 mm x
60 mm, the most respectively with deionized water, ethanol rinse the most totally, dry.
S42: cleaned fabric is placed in the 3-TSL 8330 acetone soln that concentration is 0.3%, soaks
5 points
Clock, takes out, and then 115 DEG C of drying, soaks and drying cycle 5 times.
S43: paraffin paper is placed on printing fabric top, is placed on the paper feed port reflecting beautiful FP-630K impact printer jointly.Connection
After connecing printer, by computer, the wiring diagram file designed is exported to printer printing.
S44: preparation gold nano sol solution: by 1.8g gold chloride, 6g trisodium citrate, 14g sodium chloride, 2.5g boron
Sodium hydride is dissolved in 500mL deionized water, dissolves complete, adds deionized water, is 1L to liquor capacity.Wax pattern will be printed on
Fabric be placed in gold nano sol solution, place 4 hours, take out, clean, obtain the fabric of surface Selective activation.
S45: preparation copper chemical plating fluid: by 6g blue vitriol, 22g sodium potassium tartrate tetrahydrate, 7g sodium hydroxide, 1g sodium carbonate, 6g first
Aldehyde is dissolved in 500mL deionized water, dissolves complete, adds deionized water, is 1L to liquor capacity, obtains chemical copper plating solution.
The just fabric after step S44 activates is immersed in described copper chemical plating fluid, is warming up to 30 DEG C, electroless copper 3
Hour.
S46: be placed in dehydrated alcohol by the fabric after electroless copper, after the wax on fabric is completely dissolved in ethanol, takes out
Dry,
Obtain designed flexible circuit.
It is 7.12 μ Ω cm that four probe method records the resistivity of copper conductive traces.Copper wire and the adhesive force of fabric substrate
It is assessed as 1 grade by the regulation of GB GB/T9286-1998.
Embodiment 5
S51: select Tencel fabric (60TS/40C 30*30/128*78 count/cm2, 165 mg/cm2) it is base material, accurately
Be cut into 60 mm x 60 mm, clean with deionized water, ethanol rinse the most respectively, dry.
S52: cleaned fabric is placed in the 3-TSL 8330 acetone soln that concentration is 0.8%, soaks
5 points
Clock, takes out, and then 110 DEG C of drying, soaks and drying cycle 5 times.
S53: paraffin paper is placed on printing fabric top, is placed on the paper feed port reflecting beautiful FP-630K impact printer jointly.Connection
After connecing printer, by computer, the wiring diagram file designed is exported to printer printing.
S54: preparation gold nano sol solution: by 2g gold chloride, 5g trisodium citrate, 10g sodium chloride, 3g hydroboration
Sodium is dissolved in 500mL deionized water, dissolves complete, adds deionized water, is 1L to liquor capacity.Knitting of wax pattern will be printed on
Thing is placed in gold nano sol solution, places 5 hours, takes out, and cleans, obtains the fabric of surface Selective activation.
S55: preparation copper chemical plating fluid: by 9g blue vitriol, 28g sodium potassium tartrate tetrahydrate, 6g sodium hydroxide, 2g sodium carbonate, 5g first
Aldehyde is dissolved in 500mL deionized water, dissolves complete, adds deionized water, is 1L to liquor capacity, obtains chemical copper plating solution.
The just fabric after step S54 activates is immersed in described copper chemical plating fluid, is warming up to 50 DEG C, electroless copper 2
Hour.
S56: be placed in dehydrated alcohol by the fabric after electroless copper, after the wax on fabric is completely dissolved in ethanol, takes out
Dry,
Obtain designed flexible circuit.
It is 6.58 μ Ω cm that four probe method records the resistivity of copper conductive traces.Copper wire and the adhesive force of fabric substrate
It is assessed as 1 grade by the regulation of GB GB/T9286-1998.
Claims (7)
1. the construction method of a flexible fabric surface conductance circuit, it is characterised in that specifically comprise the following steps that
(1) clean textile: fabric is cleaned, dries；
(2) silane coupler is self-assembled modified: is soaked in by cleaned fabric in silane coupler solution 5 ~ 10 minutes, takes
Go out, in 100 ~ 120 DEG C of drying, soak and drying cycle 3 ~ 5 times；
(3) impact printer is utilized to wax pattern on the fabric that step (2) processed；
(4) Nano sol activation: be placed in by the fabric that step (3) processed in Nano sol solution 3 ~ 5 hours, takes out, cleans；
(5) electroless copper: be immersed in copper chemical plating fluid by the fabric that step (4) processed, in 30 ~ 60 DEG C of chemical platings 1～3
Hour, take out and clean；
(6) wax removing: be placed in organic wax removing solvent by the fabric after electroless copper, treats that the wax on fabric is completely dissolved in organic removing
After wax solvent, take out and dry, prepare flexible fabric conductive pattern.
The construction method of flexible fabric surface conductance circuit the most according to claim 1, it is characterised in that described fabric is excellent
First select composition be the fabric of cellulose, particularly as follows: in cotton, Caulis et Folium Lini, CUP or tencel any one.
The construction method of flexible fabric surface conductance circuit the most according to claim 1, it is characterised in that described silane
The solute of coupling agent solution is 3-TSL 8330, and solvent is acetone, the percent mass of silane coupler solution
Concentration is 0.1% ~ 1%.
The construction method of flexible fabric surface conductance circuit the most according to claim 1, it is characterised in that described pin type
Printer is the office printer that common invoice prints, and consumptive material is commercial paraffin paper, prints flow process and is: by arrangement to be printed
And being jointly placed on the paper feed port of printer bottom paraffin paper, after coupling printer, the wiring diagram designed passes through computer control
The print system of system, is transferred directly to the wax on paraffin paper in solid form on fabric, forms the wax figure corresponding with wiring diagram
Case.
The construction method of flexible fabric surface conductance circuit the most according to claim 1, it is characterised in that institute in step (4)
The formula of the gold nano sol solution stated be solvent be deionized water, in solution, various solute concentrations are respectively as follows: the dense of gold chloride
Degree is 1 ~ 2 g/L；The concentration of trisodium citrate is 5 ~ 10 g/L；The concentration of sodium chloride is 10 ~ 20 g/L；Sodium borohydride
Concentration is 2 ~ 4 g/L.
The construction method of flexible fabric surface conductance circuit the most according to claim 1, it is characterised in that institute in step (5)
The formula of the copper chemical plating fluid stated be solvent be deionized water, in solution, various solutes are respectively as follows: concentration of copper sulfate 5 ~ 10 g/L,
Soluble tartar. na concn 20 ~ 30 g/L, naoh concentration 5 ~ 10 g/L, concentration of sodium carbonate 1 ~ 2 g/L, concentration of formaldehyde 5 ~ 10
g/L。
The construction method of flexible fabric surface conductance circuit the most according to claim 1, it is characterised in that institute in step (6)
The dehydrated alcohol that organic wax removing solvent is mass fraction 99.7% stated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610395387.4A CN106049035B (en) | 2016-09-06 | 2016-09-06 | A kind of construction method of flexible fabric surface conductance circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610395387.4A CN106049035B (en) | 2016-09-06 | 2016-09-06 | A kind of construction method of flexible fabric surface conductance circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106049035A true CN106049035A (en) | 2016-10-26 |
| CN106049035B CN106049035B (en) | 2018-07-10 |
Family
ID=57169645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610395387.4A Expired - Fee Related CN106049035B (en) | 2016-09-06 | 2016-09-06 | A kind of construction method of flexible fabric surface conductance circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106049035B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109440453A (en) * | 2018-10-22 | 2019-03-08 | 复旦大学 | A kind of preparation method of Cu-Ni-Gd-B-P electronic fabric |
| CN111419217A (en) * | 2020-03-31 | 2020-07-17 | 西安工程大学 | Preparation method and application of electrode based on flexible conductive fabric |
| CN112331378A (en) * | 2020-11-19 | 2021-02-05 | 中国工程物理研究院应用电子学研究所 | Flexible wearable conductive material with Joule heating performance and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61227175A (en) * | 1985-03-30 | 1986-10-09 | Agency Of Ind Science & Technol | Metal plating method using palladium organosol |
| CN101911846A (en) * | 2007-11-01 | 2010-12-08 | 上村工业株式会社 | Method for forming circuit |
| CN103547056A (en) * | 2012-07-12 | 2014-01-29 | 绿点高新科技股份有限公司 | Conducting circuit device and manufacturing method thereof |
| CN104582298A (en) * | 2014-12-25 | 2015-04-29 | 复旦大学 | Method for manufacturing conductive circuit on paper substrate |
| CN105040210A (en) * | 2015-06-30 | 2015-11-11 | 复旦大学 | Preparation method of soybean-fiber composite fuse |
| CN105338733A (en) * | 2015-09-30 | 2016-02-17 | 安徽省大富光电科技有限公司 | Graphic conductive material and electronic equipment |
-
2016
- 2016-09-06 CN CN201610395387.4A patent/CN106049035B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61227175A (en) * | 1985-03-30 | 1986-10-09 | Agency Of Ind Science & Technol | Metal plating method using palladium organosol |
| CN101911846A (en) * | 2007-11-01 | 2010-12-08 | 上村工业株式会社 | Method for forming circuit |
| CN103547056A (en) * | 2012-07-12 | 2014-01-29 | 绿点高新科技股份有限公司 | Conducting circuit device and manufacturing method thereof |
| CN104582298A (en) * | 2014-12-25 | 2015-04-29 | 复旦大学 | Method for manufacturing conductive circuit on paper substrate |
| CN105040210A (en) * | 2015-06-30 | 2015-11-11 | 复旦大学 | Preparation method of soybean-fiber composite fuse |
| CN105338733A (en) * | 2015-09-30 | 2016-02-17 | 安徽省大富光电科技有限公司 | Graphic conductive material and electronic equipment |
Non-Patent Citations (1)
| Title |
|---|
| YINXIANG LU ET AL.: "Electromagnetic interference shielding, mechanical properties and water absorption of copper/bamboo fabric (Cu/BF) composites", 《COMPOSITES SCIENCE AND TECHNOLOGY》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109440453A (en) * | 2018-10-22 | 2019-03-08 | 复旦大学 | A kind of preparation method of Cu-Ni-Gd-B-P electronic fabric |
| CN111419217A (en) * | 2020-03-31 | 2020-07-17 | 西安工程大学 | Preparation method and application of electrode based on flexible conductive fabric |
| CN112331378A (en) * | 2020-11-19 | 2021-02-05 | 中国工程物理研究院应用电子学研究所 | Flexible wearable conductive material with Joule heating performance and preparation method thereof |
| CN112331378B (en) * | 2020-11-19 | 2022-03-01 | 中国工程物理研究院应用电子学研究所 | Flexible wearable conductive material with Joule heating performance and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106049035B (en) | 2018-07-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Wang et al. | Chemical formation of soft metal electrodes for flexible and wearable electronics | |
| Shahariar et al. | Inkjet printing of reactive silver ink on textiles | |
| CN110537394B (en) | Printed circuit nanoweb manufacturing method and printed circuit nanoweb | |
| CN106049035A (en) | Establishment method of conductive circuit on surface of flexible fabric | |
| CN102995395B (en) | Conductive textile and its making method | |
| CN109575364A (en) | A kind of transparent and ink strongly adherent printing-type flexible electronic base material and its preparation and application | |
| CN111432560B (en) | Manufacturing method of ultra-low resistance flexible conductive circuit | |
| Yin et al. | Electronic fibers/textiles for health‐monitoring: fabrication and application | |
| CN103249255A (en) | Method for directly preparing conducting circuit on resin baseplate | |
| CN106987830B (en) | Aluminium base printed wiring board chemistry NiPdAu technique | |
| CN103619128B (en) | Preparing method of flexible circuit board based on ink-jet printing technique | |
| CN106852004B (en) | A kind of flexible circuit quick molding method | |
| CN104582298A (en) | Method for manufacturing conductive circuit on paper substrate | |
| Zhao et al. | Fabrication of dual-side metal patterns onto textile substrates for wearable electronics by combining wax-dot printing with electroless plating | |
| JP2005256222A (en) | Method for coating carbon nanotube onto natural fiber | |
| CN111419217A (en) | Preparation method and application of electrode based on flexible conductive fabric | |
| CN109811382A (en) | A kind of application of graphene oxide conductive paste in black holesization is directly electroplated | |
| Hossain et al. | Durability of smart electronic textiles | |
| Rosa-Ortiz et al. | Copper electrodeposition by hydrogen evolution assisted electroplating (HEA) for wearable electronics | |
| CN102787308A (en) | Method for carrying out nickel plating coating on MWNT (multi-walled carbon nanotube) | |
| TW201732103A (en) | Conductive textile and manufacturing method thereof | |
| CN101597440B (en) | Printing ink, method using printing ink to manufacture electric conduction line and circuit board therewith | |
| US20050244577A1 (en) | Process for fabricating a carbon nanofiber/Cu composite powder by electroless Cu plating | |
| CN115315084A (en) | Fabric printed circuit and process for manufacturing the same | |
| Yin et al. | Functionalization of fiber materials for washable smart wearable textiles |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180710 Termination date: 20210906 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |