CN106049035B - A kind of construction method of flexible fabric surface conductance circuit - Google Patents
A kind of construction method of flexible fabric surface conductance circuit Download PDFInfo
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- CN106049035B CN106049035B CN201610395387.4A CN201610395387A CN106049035B CN 106049035 B CN106049035 B CN 106049035B CN 201610395387 A CN201610395387 A CN 201610395387A CN 106049035 B CN106049035 B CN 106049035B
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- fabric
- construction method
- fabric surface
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- flexible fabric
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Classifications
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- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/83—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metals; with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M13/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with non-macromolecular organic compounds; Such treatment combined with mechanical treatment
- D06M13/50—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with non-macromolecular organic compounds; Such treatment combined with mechanical treatment with organometallic compounds; with organic compounds containing boron, silicon, selenium or tellurium atoms
- D06M13/51—Compounds with at least one carbon-metal or carbon-boron, carbon-silicon, carbon-selenium, or carbon-tellurium bond
- D06M13/513—Compounds with at least one carbon-metal or carbon-boron, carbon-silicon, carbon-selenium, or carbon-tellurium bond with at least one carbon-silicon bond
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M23/00—Treatment of fibres, threads, yarns, fabrics or fibrous goods made from such materials, characterised by the process
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M2101/00—Chemical constitution of the fibres, threads, yarns, fabrics or fibrous goods made from such materials, to be treated
- D06M2101/02—Natural fibres, other than mineral fibres
- D06M2101/04—Vegetal fibres
- D06M2101/06—Vegetal fibres cellulosic
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M2400/00—Specific information on the treatment or the process itself not provided in D06M23/00-D06M23/18
- D06M2400/02—Treating compositions in the form of solgel or aerogel
Abstract
The invention belongs to flexible electronics technical fields, and in particular to a kind of construction method of flexible fabric surface conductance circuit.Preparation method proposed by the present invention is using flexible fabric as matrix, is combined using pin type waxing technology with electroless plating technology, in its surface construction metallic circuit figure.Concrete technology includes self-assembled modified clean textile, silane coupling agent, pin type waxing, the activation of gold nano colloidal sol with, electroless copper and paraffin removal etc..The construction method of flexible fabric surface conductance circuit proposed by the invention has the following advantages：（1）Wax on paraffin paper is to be transferred to fabric surface in solid form, therefore the wax pattern accuracy formed is high, and corresponding obtained circuit precision is controllable；（2）Obtained copper conductive traces are continuously, fine and close, conductivity is high, and precision is controllable.The construction method of flexible fabric surface conductance circuit proposed by the present invention is combined pin type waxing technology with electroless plating technology, has started a kind of completely new method for preparing flexible circuit.
Description
Technical field
The invention belongs to flexible electronics technical fields, and in particular to a kind of structure of flexible fabric surface conductance circuit
Method.
Background technology
Flexible wearable electronics（wearable electronics）It is worn on human body, and realize to people so that equipment is miniaturized
The real-time monitoring of body physiologic information has highly important application, such as electronic skin, wearable heart in medical treatment, health field
Defibrillator, the flexible circuit being placed in contact lenses, wearable electrocardio respiration transducer etc..Flexible electronic and conditional electronic it
Between most basic difference be on the substrate of design circuit, i.e., rigid substrates are replaced with flexible base board.Since textile is with soft
Toughness and the characteristic for being capable of random bending fold etc., when study flexible wearable circuit, flexible fabric is as first choice substrate material
Material.Compliant conductive fabric disclosure satisfy that requirement of the people for the portability of wearable circuit, flexibility and comfort.
At this stage, the construction method of flexible fabric surface conductance figure mainly has two categories below：1st, textile weaving is utilized
Technique（Knitting, woven, embroidery）Conductive yam is incorporated into the institutional framework of fabric.2nd, printing technology is utilized（Inkjet printing, silk screen
Printing）Then print conductive inks water or slurry on the fabric carry out high temperature sintering.Knitting or woven grade weaving methods can incite somebody to action pre-
The conductive yam shuffling made is woven into fabric structure, but is limited by the weave patterns of fabric（Warp-wise or broadwise）, conductive yam
The direction being incorporated into can only limit freely designing for conductive pattern on fabric in this way perpendicular or parallel to the selvedge of fabric.Thorn
Although embroidery has good design freedom when conductive yam connects up, it is higher to prefabricated conductive yam flexibility requirements, and
It is with high costs when preparing high-precision circuit.Inkjet printing or screen printing technique, which all compare, relies on conductive ink or conductive paste
The development of material and sintering process.Common fabric is mostly porous material, fluid（Ink or slurry）The meeting when its surface infiltrates
" wicking " phenomenon is generated, reduces the precision of gained conducting wire.So in actual production generally by increasing ink or slurry
Viscosity weaken this phenomenon, but excessive viscosity blocks jet orifice or silk screen hole sometimes.In addition to this, sintering process
The base material that the hot conditions used can make some high temperature degradable thermally decomposes, thus flexible electronic field is main now
The base material used is still heat safe polyimides（PI）Material.Many printing technologies contain fine metal particles by preparing
Conductive ink or slurry reduce the sintering temperature of prefabricated metal circuit diagram, to widen be applicable in Body regions.
For prior art technology, the controllable precision when fabric surface builds conducting wire is poor, process costs are high by the present invention,
The problems such as base material applicable narrow range, a kind of reduction process is provided, reduces cost, carries efficient flexible fabric surface conductance line
The construction method on road.Basic principle is that fabric surface chemical modification first is improved the hydrophily of fabric, while grafting can be coordinated
The organo-functional group of adsorption activation metallic.Pin type waxing technology is recycled to form hydrophobic region on the fabric（Wax pattern area）
And hydrophilic region（Blank modified zone）.Then fabric is put into activation colloidal solution, hydrophilic region adsorption activation particle is formed
Catalytic activity point, and grow in next step electroless plating reaction the metal thin film patterns with wax pattern complementary.The present invention utilizes
Waxing technology finally re-forms complementary metallic circuit figure in fabric surface Preformed circuits figure.Since wax is directly with solid
The form of body is transferred to fabric surface from commercial paraffin paper, will not generate " wicking " phenomenon, therefore prefabricated circuit diagram on the fabric
The precision of circuit can be controlled effectively.The present invention is made of the method for electroless copper to complete circuitous pattern simultaneously, without sintering
Step, thus suitable for all kinds of textile substrates.
Invention content
The purpose of the present invention is providing a kind of reduction process to solve the deficiencies in the prior art, cost is reduced, improves effect
The construction method of the flexible fabric surface conductance circuit of rate.
To achieve these goals, the construction method of flexible fabric surface conductance circuit proposed by the invention, including such as
Lower step：
（1）Clean textile：Fabric is cleaned, is dried；
（2）Silane coupling agent is self-assembled modified：The fabric cleaned is soaked in silane coupler solution 5 ~ 10 minutes,
It takes out, in 100 ~ 120 DEG C of drying, impregnates and drying cycle 3 ~ 5 times；
（3）In step（2）It is waxed pattern using stylus printer on processed fabric；
（4）Nano sol activates：By step（3）Processed fabric is placed in Nano sol solution 3 ~ 5 hours, take out,
It cleans；
（5）Electroless copper：By step（4）Processed fabric is immersed in copper chemical plating fluid, in 30 ~ 60 DEG C of chemical platings 1
It~3 hours, takes out and cleans；
（6）Paraffin removal：Fabric after electroless copper is placed in organic paraffin removal solvent, treats that the wax on fabric has been completely dissolved in
After machine paraffin removal solvent, drying is taken out, flexible fabric conductive pattern is made.
In the present invention, the fabric preferentially selects the fabric that ingredient is cellulose, specially：Cotton, flax, copper ammonia fiber or
It is any in tencel.It can be native cellulose fibre（Cotton, flax etc.）Or regenerated celulose fibre（Copper ammonia fiber, tencel, not
Dai Er etc.）；This kind of flexible fabric is high hydroxyl content fabric, thus fabric good hydrophilic property itself, and fabric derives from a wealth of sources, cost
It is cheap.
In the present invention, the solute of the silane coupler solution is 3- TSL 8330s, solvent third
Ketone, the mass percentage concentration of silane coupler solution is 0.1% ~ 1%.
In the present invention, the stylus printer is the office printer of common invoice printing, and consumptive material is commercial wax
Paper, printing flow are：Fabric to be printed is placed in paraffin paper bottom and is placed on the paper feed port of printer jointly, couples printer
Afterwards, the wax on paraffin paper is transferred directly to and knits by the print system that designed wiring diagram is controlled by computer in solid form
On object, formed and the corresponding wax pattern of wiring diagram.
In the present invention, step（4）Described in the formula of gold nano sol solution be solvent for deionized water, it is each in solution
Planting solute concentration is respectively：A concentration of 1 ~ 2 g/L of gold chloride；A concentration of 5 ~ 10 g/L of trisodium citrate；Sodium chloride
A concentration of 10 ~ 20 g/L；A concentration of 2 ~ 4 g/L of sodium borohydride.
In the present invention, step（5）Described in the formula of copper chemical plating fluid be solvent for deionized water, it is various molten in solution
Matter is respectively：5 ~ 10 g/L of concentration of copper sulfate, 20 ~ 30 g/L of potassium tartrate na concn, 5 ~ 10 g/L of naoh concentration, carbonic acid
1 ~ 2 g/L of na concn, 5 ~ 10 g/L of concentration of formaldehyde.
In the present invention, step（6）Described in organic paraffin removal solvent be quality Fen Shuo≤99.7% absolute ethyl alcohol.
The construction method of flexible fabric surface conductance circuit proposed by the present invention has the following advantages：（1）Selected fabric
Composition is cellulose, is derived from a wealth of sources, and belongs to renewable resource, environmentally protective；（2）Using chemical modification by fabric surface amination,
On the one hand the hydrophily of fabric can be promoted；On the other hand occur self-assembling reaction between catalyst particle, it is very big to enhance
The adsorptivity and homogeneity of catalyst particle so as to promote the adhesiveness between the conducting wire finally obtained and fabric, increase institute
Obtain the reliability of flexible circuit；（3）Wax on paraffin paper is to be transferred to fabric surface in solid form, therefore the wax pattern essence formed
Degree is high, and corresponding obtained conducting wire precision is controllable.The construction method of flexible fabric surface conductance circuit proposed by the present invention, will
Pin type waxing technology is combined with electroless plating technology, has started a kind of completely new method for preparing flexible circuit.Prepared by the present invention
Flexible circuit can be used for the new high-tech products such as medical treatment, health field, wide market.
The beneficial effects of the present invention are：（1）Selected fabric composition is cellulose, and raw material sources enrich, and reduces work
Skill cost；（2）Silane coupling agent may act as the molecule bridge between weaving matrix and metal circuitry, improve the reliable of product
Property；（3）Obtained copper conductive traces are continuously, fine and close, conductivity is high, and precision is controllable；（4）Technical process easy maintenance, to instrument
The dependency degree of equipment is low to carry out continuous production, can meet the market demand.
Description of the drawings
Fig. 1 is the method flow diagram of flexible fabric surface construction conducting wire proposed by the invention；
Fig. 2 is the sample object figure after copper facing in the embodiment of the present invention 1；
Fig. 3 is the Sample Scan electron microscope after copper facing in the embodiment of the present invention 1；
Fig. 4, Fig. 5 are the sample optical microscope photograph after copper facing in the embodiment of the present invention 2.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, it is right
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only to explain the present invention, not
For limiting the present invention.
Embodiment 1
S11：Select copper ammonia fiber fabric（45×45 count/cm2, 8 mg/cm2）For base material, it is accurately cut into 60
60 mm of mm x, then clean with deionized water, ethanol rinse respectively, drying.
S12：The fabric cleaned is placed in the 3- TSL 8330 acetone solns of a concentration of 0 .1%, is soaked
5 points of bubble
Clock takes out, and then in 100 DEG C of drying, impregnates and drying cycle 3 times.
S13：Paraffin paper is placed at the top of printing fabric, is placed on the paper feeding mechanism for reflecting beautiful FP-630K stylus printers jointly
In.After coupling printer, designed wiring map file is exported by computer and is printed to printer.
S14：Prepare gold nano sol solution：By 1g gold chlorides, 5g trisodium citrates, 10g sodium chloride, 2g hydroborations
Sodium is dissolved in 500mL deionized waters, and dissolving finishes, and adds deionized water, until liquor capacity is 1L.Knitting for wax pattern will be printed on
Object is placed in gold nano sol solution, is placed 3 hours, is taken out, and is cleaned, and obtains the fabric of surface Selective activation.
S15：Prepare copper chemical plating fluid：By 5g sulfuric acid ketone, 20g sodium potassium tartrate tetrahydrates, 5g sodium hydroxides, 1g sodium carbonate, 5g first
Aldehyde is dissolved in 500mL deionized waters, and dissolving finishes, and adds deionized water, until liquor capacity is 1L, obtains chemical copper plating solution.
Fabric after step S14 activation will be immersed in the copper chemical plating fluid, be warming up to 60 DEG C, electroless copper 1
Hour.
S16：Fabric after electroless copper is placed in absolute ethyl alcohol, after the wax on fabric is completely dissolved in ethyl alcohol, is taken out
Drying,
Up to designed flexible circuit, as shown in material object Fig. 2.Scanning electronic microscope examination, gained copper coating are uniform
It is smooth, as shown in Fig. 3.
The resistivity that four probe method measures copper conductive traces is 7.42 μ Ω cm.The adhesive force of copper wire and fabric substrate
1 grade is assessed as by the regulation of national standard GB/T9286-1998.
Embodiment 2
S21：Select modal fabric（18×45 count/cm2, 17.5 mg/cm2）For base material, it is accurately cut into 60
60 mm of mm x, then clean with deionized water, ethanol rinse respectively, drying.
S22：The fabric cleaned is placed in a concentration of 0.5% 3- TSL 8330 acetone solns, is impregnated
8 points
Clock takes out, and then in 120 DEG C of drying, impregnates and drying cycle 3 times.
S23：Paraffin paper is placed at the top of printing fabric, is placed on the paper feed port for reflecting beautiful FP-630K stylus printers jointly.Connection
After connecing printer, designed wiring map file is exported by computer and is printed to printer.
S24：Prepare gold nano sol solution：By 2g gold chlorides, 10g trisodium citrates, 20g sodium chloride, 4g boron hydrogen
Change sodium to be dissolved in 500mL deionized waters, dissolving finishes, and adds deionized water, until liquor capacity is 1L.Wax pattern will be printed on
Fabric is placed in gold nano sol solution, is placed 3.5 hours, is taken out, and is cleaned, and obtains the fabric of surface Selective activation.
S25：Prepare copper chemical plating fluid：By 10g sulfuric acid ketone, 30g sodium potassium tartrate tetrahydrates, 10g sodium hydroxides, 2g sodium carbonate, 10g
Formaldehyde is dissolved in 500mL deionized waters, and dissolving finishes, and adds deionized water, until liquor capacity is 1L, obtains chemical copper plating solution.
Fabric after step S24 activation will be immersed in the copper chemical plating fluid, be warming up to 40 DEG C, electroless copper
1.5 hour.
S26：Fabric after electroless copper is placed in absolute ethyl alcohol, after the wax on fabric is completely dissolved in ethyl alcohol, is taken out
Drying,
Up to designed flexible circuit.The surface topography of copper wire and boundary are observed with light microscope, such as Fig. 3, Fig. 4 institute
Show；
The resistivity that four probe method measures copper conductive traces is 6.43 μ Ω cm.The adhesive force of copper wire and fabric substrate
1 grade is assessed as by the regulation of national standard GB/T9286-1998.
Embodiment 3
S31：Select cotton fabric（108×58 count/cm2, 28 mg/cm2）For base material, it is accurately cut into 60 mm x
60 mm, then clean with deionized water, ethanol rinse respectively, drying.
S32：The fabric cleaned is placed in a concentration of 0.7% 3- TSL 8330 acetone solns, is impregnated
7 points
Clock takes out, and then in 120 DEG C of drying, impregnates and drying cycle 4 times.
S33：Paraffin paper is placed at the top of printing fabric, is placed on the paper feed port for reflecting beautiful FP-630K stylus printers jointly.Connection
After connecing printer, designed wiring map file is exported by computer and is printed to printer.
S34：Prepare gold nano sol solution：By 1.5g gold chlorides, 8g trisodium citrates, 15g sodium chloride, 3g boron hydrogen
Change sodium to be dissolved in 500mL deionized waters, dissolving finishes, and adds deionized water, until liquor capacity is 1L.Wax pattern will be printed on
Fabric is placed in gold nano sol solution, is placed 3.5 hours, is taken out, and is cleaned, and obtains the fabric of surface Selective activation.
S35：Prepare copper chemical plating fluid：By 8g sulfuric acid ketone, 25g sodium potassium tartrate tetrahydrates, 7g sodium hydroxides, 2g sodium carbonate, 7g first
Aldehyde is dissolved in 500mL deionized waters, and dissolving finishes, and adds deionized water, until liquor capacity is 1L, obtains chemical copper plating solution.
Fabric after step S34 activation will be immersed in the copper chemical plating fluid, be warming up to 45 DEG C, electroless copper 2
Hour.
S36：Fabric after electroless copper is placed in absolute ethyl alcohol, after the wax on fabric is completely dissolved in ethyl alcohol, is taken out
Drying,
Up to designed flexible circuit.
The resistivity that four probe method measures copper conductive traces is 6.33 μ Ω cm.The adhesive force of copper wire and fabric substrate
1 grade is assessed as by the regulation of national standard GB/T9286-1998.
Embodiment 4
S41：Select sodolin（20×25 count/cm2, 18 mg/cm2）For base material, it is accurately cut into 60 mm
60 mm of x, then clean with deionized water, ethanol rinse respectively, drying.
S42：The fabric cleaned is placed in a concentration of 0.3% 3- TSL 8330 acetone solns, is impregnated
5 points
Clock takes out, and then in 115 DEG C of drying, impregnates and drying cycle 5 times.
S43：Paraffin paper is placed at the top of printing fabric, is placed on the paper feed port for reflecting beautiful FP-630K stylus printers jointly.Connection
After connecing printer, designed wiring map file is exported by computer and is printed to printer.
S44：Prepare gold nano sol solution：By 1.8g gold chlorides, 6g trisodium citrates, 14g sodium chloride, 2.5g boron
Sodium hydride is dissolved in 500mL deionized waters, and dissolving finishes, and adds deionized water, until liquor capacity is 1L.Wax pattern will be printed on
Fabric be placed in gold nano sol solution, place 4 hours, take out, clean, obtain the fabric of surface Selective activation.
S45：Prepare copper chemical plating fluid：By 6g sulfuric acid ketone, 22g sodium potassium tartrate tetrahydrates, 7g sodium hydroxides, 1g sodium carbonate, 6g first
Aldehyde is dissolved in 500mL deionized waters, and dissolving finishes, and adds deionized water, until liquor capacity is 1L, obtains chemical copper plating solution.
Fabric after step S44 activation will be immersed in the copper chemical plating fluid, be warming up to 30 DEG C, electroless copper 3
Hour.
S46：Fabric after electroless copper is placed in absolute ethyl alcohol, after the wax on fabric is completely dissolved in ethyl alcohol, is taken out
Drying,
Up to designed flexible circuit.
The resistivity that four probe method measures copper conductive traces is 7.12 μ Ω cm.The adhesive force of copper wire and fabric substrate
1 grade is assessed as by the regulation of national standard GB/T9286-1998.
Embodiment 5
S51：Select Tencel fabric（60TS/40C 30*30/128*78 count/cm2, 165 mg/cm2）For base material, essence
60 mm x, 60 mm really are cut into, then clean with deionized water, ethanol rinse respectively, drying.
S52：The fabric cleaned is placed in a concentration of 0.8% 3- TSL 8330 acetone solns, is impregnated
5 points
Clock takes out, and then in 110 DEG C of drying, impregnates and drying cycle 5 times.
S53：Paraffin paper is placed at the top of printing fabric, is placed on the paper feed port for reflecting beautiful FP-630K stylus printers jointly.Connection
After connecing printer, designed wiring map file is exported by computer and is printed to printer.
S54：Prepare gold nano sol solution：By 2g gold chlorides, 5g trisodium citrates, 10g sodium chloride, 3g hydroborations
Sodium is dissolved in 500mL deionized waters, and dissolving finishes, and adds deionized water, until liquor capacity is 1L.Knitting for wax pattern will be printed on
Object is placed in gold nano sol solution, is placed 5 hours, is taken out, and is cleaned, and obtains the fabric of surface Selective activation.
S55：Prepare copper chemical plating fluid：By 9g sulfuric acid ketone, 28g sodium potassium tartrate tetrahydrates, 6g sodium hydroxides, 2g sodium carbonate, 5g first
Aldehyde is dissolved in 500mL deionized waters, and dissolving finishes, and adds deionized water, until liquor capacity is 1L, obtains chemical copper plating solution.
Fabric after step S54 activation will be immersed in the copper chemical plating fluid, be warming up to 50 DEG C, electroless copper 2
Hour.
S56：Fabric after electroless copper is placed in absolute ethyl alcohol, after the wax on fabric is completely dissolved in ethyl alcohol, is taken out
Drying,
Up to designed flexible circuit.
The resistivity that four probe method measures copper conductive traces is 6.58 μ Ω cm.The adhesive force of copper wire and fabric substrate
1 grade is assessed as by the regulation of national standard GB/T9286-1998.
Claims (8)
1. a kind of construction method of flexible fabric surface conductance circuit, it is characterised in that be as follows：
（1）Clean textile：Fabric is cleaned, is dried；
（2）Silane coupling agent is self-assembled modified：The fabric cleaned is soaked in silane coupler solution 5 ~ 10 minutes, is taken
Go out, in 100 ~ 120 DEG C of drying, impregnate and drying cycle 3 ~ 5 times；
（3）In step（2）It is waxed pattern using stylus printer on processed fabric；
（4）Nano sol activates：By step（3）Processed fabric is placed in Nano sol solution 3 ~ 5 hours, is taken out, is cleaned；
（5）Electroless copper：By step（4）Processed fabric is immersed in copper chemical plating fluid, in 30 ~ 60 DEG C of chemical platings 1~3
Hour, it takes out and cleans；
（6）Paraffin removal：Fabric after electroless copper is placed in organic paraffin removal solvent, treats that the wax on fabric is completely dissolved in organic remove
After wax solvent, drying is taken out, flexible fabric conductive pattern is made.
2. the construction method of flexible fabric surface conductance circuit according to claim 1, it is characterised in that the fabric choosing
With the fabric that ingredient is cellulose.
3. the construction method of flexible fabric surface conductance circuit according to claim 2, it is characterised in that the cellulose
Fabric be any in cotton, flax, copper ammonia fiber or tencel.
4. the construction method of flexible fabric surface conductance circuit according to claim 1, it is characterised in that the silane
The solute of coupling agent solution is 3- TSL 8330s, and solvent is acetone, the quality percentage of silane coupler solution
A concentration of 0.1% ~ 1%.
5. the construction method of flexible fabric surface conductance circuit according to claim 1, it is characterised in that the pin type
Printer is the office printer of common invoice printing, and consumptive material is commercial paraffin paper, and printing flow is：By arrangement to be printed
The paper feed port of printer is placed in paraffin paper bottom and jointly, after coupling printer, designed wiring diagram passes through computer control
Wax on paraffin paper is transferred directly on fabric by the print system of system in solid form, is formed and the corresponding wax figure of wiring diagram
Case.
6. the construction method of flexible fabric surface conductance circuit according to claim 1, it is characterised in that step（4）Middle institute
The formula of Nano sol solution stated is solvent for deionized water, and various solute concentrations are respectively in solution：The concentration of gold chloride
For 1 ~ 2 g/L；A concentration of 5 ~ 10 g/L of trisodium citrate；A concentration of 10 ~ 20 g/L of sodium chloride；The concentration of sodium borohydride
For 2 ~ 4 g/L.
7. the construction method of flexible fabric surface conductance circuit according to claim 1, it is characterised in that step（5）Middle institute
The formula of copper chemical plating fluid stated is solvent for deionized water, and various solutes are respectively in solution：5 ~ 10 g/L of concentration of copper sulfate,
20 ~ 30 g/L of potassium tartrate na concn, 5 ~ 10 g/L of naoh concentration, 1 ~ 2 g/L of concentration of sodium carbonate, concentration of formaldehyde 5 ~ 10
g/L。
8. the construction method of flexible fabric surface conductance circuit according to claim 1, it is characterised in that step（6）Middle institute
The organic paraffin removal solvent stated is the absolute ethyl alcohol of quality Fen Shuo≤99.7%.
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| CN109440453A (en) * | 2018-10-22 | 2019-03-08 | 复旦大学 | A kind of preparation method of Cu-Ni-Gd-B-P electronic fabric |
| CN111419217B (en) * | 2020-03-31 | 2023-06-20 | 西安工程大学 | Preparation method and application of electrode based on flexible conductive fabric |
| CN112331378B (en) * | 2020-11-19 | 2022-03-01 | 中国工程物理研究院应用电子学研究所 | Flexible wearable conductive material with Joule heating performance and preparation method thereof |
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| CN105338733A (en) * | 2015-09-30 | 2016-02-17 | 安徽省大富光电科技有限公司 | Graphic conductive material and electronic equipment |
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