CN110983763A - Chemical copper plating process suitable for clothing cotton fabric - Google Patents
Chemical copper plating process suitable for clothing cotton fabric Download PDFInfo
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- CN110983763A CN110983763A CN201911309301.1A CN201911309301A CN110983763A CN 110983763 A CN110983763 A CN 110983763A CN 201911309301 A CN201911309301 A CN 201911309301A CN 110983763 A CN110983763 A CN 110983763A
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- cotton fabric
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- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/83—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metals; with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
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- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M15/00—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment
- D06M15/19—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment with synthetic macromolecular compounds
- D06M15/21—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- D06M15/356—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of other unsaturated compounds containing nitrogen, sulfur, silicon or phosphorus atoms
- D06M15/3562—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of other unsaturated compounds containing nitrogen, sulfur, silicon or phosphorus atoms containing nitrogen
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- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M2101/00—Chemical constitution of the fibres, threads, yarns, fabrics or fibrous goods made from such materials, to be treated
- D06M2101/02—Natural fibres, other than mineral fibres
- D06M2101/04—Vegetal fibres
- D06M2101/06—Vegetal fibres cellulosic
Abstract
The invention discloses a chemical copper plating process suitable for clothing cotton fabric, which comprises the following steps: (1) preparing a copper plating solution system; (2) padding cotton fabric with a poly dimethyl diallyl ammonium chloride aqueous solution; (3) adding a layer of sodium borohydride solution on the cotton fabric treated in the step (2), and drying the cotton fabric; (4) preparing a nano silver particle/ethylene glycol mixed solution, taking the mixed solution, and adding silver nano particles to the cotton fabric treated in the step (3) by using an ink-jet printer; (5) and (3) completely immersing the cotton fabric treated in the step (4) into the copper plating solution system in the step (1) for chemical plating deposition. The invention adopts a chemical copper plating solution system, the chemical copper plating solution contains copper salt, a reducing agent, a complexing agent and a catalyst, and the adopted catalyst is nano silver particles, so that the production cost can be effectively reduced, and the cotton fabric can reach the optimal chemical copper plating condition with high conductivity.
Description
Technical Field
The invention belongs to the technical field of intelligent clothing finishing, and particularly relates to a chemical copper plating process suitable for clothing cotton fabrics.
Background
The use of metallized textiles for electromagnetic shielding and static dissipation has been successful, but the rapid development of wearable technology opens up a range of other exciting potential applications, such as pressure sensing, heat generating textiles, the integration of electronics into yarns and as wearable antennas, whether discussed under the terms "wearable technology", "smart textiles", "electronic textiles" or similar textiles, with only point-to-point connections added to the garment, which can replace traditional weaving technology with patterned metal yarns. It can therefore be said that conductive textiles are a vital technology in the wearable industry. While lower conductivity textiles may be desirable for static dissipation and electromagnetic shielding applications, higher conductivity is desirable for smart textiles. To produce a metallic yarn of high conductivity, it is an option to weave or knit with a conductive yarn or wire. However, the metal wires limit the flexibility of the textiles and are broken during manufacture and use, and in addition, a general fabric cutting method includes heating, which is not suitable for textiles with metal wires due to the high thermal conductivity of metal.
Therefore, a method of integrating the conductive properties at the end of the textile finishing is preferred. The conductive yarn has great flexibility but also risks breaking and is relatively easy to wear. The conductive yarns may consist of a non-conductive core or a metal-plated core wrapped with metal wire, or may consist of very fine metal yarns that are drawn. With wires and threads, the function of the needling or knitting machine may limit the user's design because it can only weave in two directions.
Electroless plating on non-conductive textiles is carried out by first sensitizing the substrate surface with a catalyst to initiate metal deposition on these catalyst sites. In 1973, Thibodeaux and Baril first reported electroless plating as a method of metallizing textiles to conduct electricity and heat. Since the publication, the use of electroless plating to achieve full area coverage of textiles with metals such as copper, silver and nickel has been well explored by many people and a series of related work has been undertaken. Metallization of textiles using electroless plating techniques has significant advantages, such as high conductivity of the resulting textiles; this process can be carried out at any stage of textile production (yarn, cloth, garment); the process temperature is relatively low; vacuum operation is not required; if a suitable metal is chosen, the overall process is relatively simple and the cost can be kept low. Copper is one of the cheapest metal choices for electroless plating, and typical copper plating solutions consist of metal salts, reducing agents, complexing agents, buffers and stabilizers. In the current formulation, the complex copper-EDTA (formed from copper chloride and the complexing agent ethylenediaminetetraacetic acid in solution) is reduced by formaldehyde in a plating bath at pH > 11. The reaction is at the copper surface once the initial catalyst layer has been covered by the plating. In addition to comparative catalyst selection, most studies of electroless copper plating on textiles have used synthetic fibers such as polyester/PET and nylon. There is less concern with cotton. The cotton fiber is a common natural fiber and has good comfort, water absorption, strength and heat resistance. Applications of conductive textiles in the health care field include their use as connecting leads, assisting in the integration of sensors and electrodes to monitor physiological properties or medical conditions. Therefore, the development of a rapid and efficient chemical copper plating method which can be applied to cotton fabrics and has controllable cost is greatly helpful to the health care field and even the intelligent clothing field.
Palladium tin colloids are used in the Printed Circuit Board (PCB) industry for activating substrates into electroless plating. Many researchers have used tin/palladium catalyzed processes for treating textiles, however palladium is costly, involves multiple processing steps in addition to the sensitization and activation stages, such as scouring, etching and rinsing, and has a long process time.
Disclosure of Invention
The invention aims to provide a process for chemically plating copper on cotton fabric of clothing, and provides a method for the cotton fabric based on the current situation that most of chemical copper plating on textiles uses synthetic fibers. The research obtains an electroless copper plating solution system, and the electroless copper plating solution contains copper salt, a reducing agent, a complexing agent and a catalyst. The catalyst is nano silver particles, so that the production cost can be effectively reduced, on the basis, the cotton fabric can achieve the optimal chemical copper plating condition with high conductivity, the selective patterning of a conductive track is successfully realized, and the development requirements in the fields of health care and intelligent clothing can be further met.
In order to solve the technical problems, the following technical scheme is adopted:
a chemical copper plating process suitable for clothing cotton fabric is characterized by comprising the following steps: the chemical copper plating process comprises the following steps:
(1) preparing a copper plating solution system;
(2) soaking the cotton fabric in a poly dimethyl diallyl ammonium chloride aqueous solution, taking out the cotton fabric after soaking, rolling the cotton fabric by using a roller to remove redundant liquid, and drying the cotton fabric after rolling;
(3) adding a layer of sodium borohydride solution on the cotton fabric treated in the step (2), and drying the cotton fabric;
(4) preparing a nano silver particle/ethylene glycol mixed solution, taking the mixed solution, and adding silver nano particles to the cotton fabric treated in the step (3) by using an ink-jet printer;
(5) and (3) completely immersing the cotton fabric treated in the step (4) into the copper plating solution system in the step (1) for chemical plating deposition.
Preferably, the step (1) of preparing a copper plating solution system comprises the following specific steps: a. sequentially adding Cirtuosit 3350M-1 and Cirtuosit 3350A-1 into deionized water to prepare a mixed solution system; b. uniformly stirring the mixed solution system; c. keeping stirring and heating the mixed solution system to 40-55 ℃; d. and adding a reducing agent into the mixed solution system to prepare a copper plating solution system. In order to improve the production efficiency and simplify the process flow, the invention uses two copper salt products of Circuosit 3350M-1 and Circuosit 3350A-1. The stabilizer and the surfactant are added in both products, so that the complexity of the process can be greatly reduced. By adding Circluosit 3350A-1, the copper plating solution system can be better applied to cotton fabrics. In the copper plating process, the reducing agent reduces divalent copper ions in the chemical copper plating solution system into metal copper, so that the metal copper is attached to the surface of cotton fabric, and the purpose of chemical copper plating is achieved.
Preferably, in the solution system, the volume ratio of the deionized water to the Circluosit 3350M-1 to the Circluosit 3350A-1 to the reducing agent is 82:15:2: 1. Through complicated research, the invention discovers that the full-scale chemical copper plating of the cotton fabric can be realized under the volume ratio, the raw materials can be saved, and the cost is reduced.
Preferably, the content of the Circuostit 3350M-1 is 8-20g/L, and the content of the Circuostit 3350A-1 can be 4-10 g/L. Through complicated research, the invention discovers that the content of the Cirtuosit 3350M-1 and the content of the Cirtuosit 3350A-1 are lower, so that the full-scale chemical copper plating of cotton fabrics can be realized, the raw materials can be saved, and the cost is reduced.
Preferably, the reducing agent is one or more of formaldehyde, amino borane, sodium hypophosphite and hydrazine hydrate, and the content of the reducing agent is 1-4 g/L. The invention selects formaldehyde as reducing agent, which is convenient to obtain materials and has good reducing effect.
Preferably, the content of the poly dimethyl diallyl ammonium chloride in the step (2) is 2 g/L; controlling the pH value of the aqueous solution of the poly dimethyl diallyl ammonium chloride to be 5.5-6.5; the soaking time of the cotton fabric is 180-300 s. A balance is required because the viscous polydimethyldiallylammonium chloride increases the stiffness of cotton at high concentrations. Therefore, considering that the original hand feeling of the cotton fabric is not changed to the maximum extent by the chemical plating process, the concentration of the chemical plating process is recommended to be optimized to be 2 g/L.
Preferably, the drying temperature in the step (2) is 65 ℃, and the drying time is 10-15 min. Under the drying condition, the drying is fast, and the structure of the poly dimethyl diallyl ammonium chloride and the cotton fabric can not be damaged.
Preferably, the content of the sodium borohydride in the step (3) is 0.01 mol/L.
Preferably, the volume ratio of the nano silver particle solution to the ethylene glycol in the step (4) is 8: 1, mixing to obtain a nano silver particle/ethylene glycol mixed solution.
Due to the adoption of the technical scheme, the method has the following beneficial effects:
the invention relates to a chemical copper plating process suitable for clothing cotton fabric, and provides a method for the cotton fabric based on the current situation that most of chemical copper plating on textiles uses synthetic fibers. The research obtains an electroless copper plating solution system, and the electroless copper plating solution contains copper salt, a reducing agent, a complexing agent and a catalyst. The catalyst is nano silver particles, so that the production cost can be effectively reduced, on the basis, the cotton fabric can achieve the optimal chemical copper plating condition with high conductivity, the selective patterning of a conductive track is successfully realized, and the development requirements in the fields of health care and intelligent clothing can be further met. The concrete beneficial effects are as follows:
1. the electroless copper plating of the present invention can be produced without the use of vacuum, high temperature or lengthy curing operations, which means that the total process time can be much shorter than conventional printing and curing operations.
2. The cationic polymer, polydimethyldiallylammonium chloride, was used to improve the adhesion and uniformity of the nanosilver particle catalyst because the polymer helped to form a uniform charge layer on the surface of the adherent, allowing the silver particles to adhere to it. The process is continued here by applying polydimethyldiallylammonium chloride before applying the catalyst.
3. The spray deposition is carried out on the cotton fabric by utilizing the ink jet printing technology, so that the cotton fabric can only keep single-side conductivity. This is because the amount of liquid used in the spraying process can be controlled to limit penetration of the catalyst into the textile. For this process, a key issue for potential applications of wearable technology is solved, for example, the problem of effectively limiting the contact of metal coatings with the skin.
4. In consideration of cost, the cotton fabric has good hand feeling and drapability at the temperature of 25-50 ℃, and the sheet resistance can be measured. Therefore, 40 ℃ is preferably selected as the electroless plating process temperature.
Detailed Description
The present invention is further illustrated by reference to the following specific examples, wherein Cirtuosit 3350M-1 and Cirtuosit 3350A-1 used in the present invention are commercially available from A-GAS electronic materials, USA, and the remaining raw materials, unless otherwise specified, are commercially available or can be prepared by conventional methods.
Example 1
Preparing a copper plating solution with the content of 1LCircuposit 3350M-1 being 15g/L, the content of Circcuosit 3350A-1 being 8g/L, the content of formaldehyde being 4g/L and the temperature being 45 ℃ for later use; putting a cotton fabric with the size of 200mm multiplied by 200mm into a poly dimethyl diallyl ammonium chloride aqueous solution with the pH value of 6 and the content of 2g/L, soaking for 200s, and drying in a drying oven at the temperature of 65 ℃; adding a layer of sodium borohydride solution with the content of 0.01mol/L on the surface of the dried cotton fabric, and drying for later use; then preparing a nano silver particle/glycol mixed solution, and taking 10ml of the nano silver particle/glycol mixed solution for ink-jet printing of the cotton fabric;
and after ink-jet printing, the cotton fabric is completely immersed in the copper plating solution for chemical plating deposition to obtain the copper-plated cotton fabric.
Example 2
Preparing a copper plating solution with the content of 1LCircuposit 3350M-1 being 12g/L, the content of Circcuosit 3350A-1 being 6g/L, the content of formaldehyde being 2g/L and the temperature being 55 ℃ for later use; putting a cotton fabric with the size of 200mm multiplied by 200mm into a poly dimethyl diallyl ammonium chloride aqueous solution with the pH value of 5.5 and the content of 2g/L, soaking for 200s, and drying in a drying oven at 65 ℃; adding a layer of sodium borohydride solution with the content of 0.01mol/L on the surface of the dried cotton fabric, and drying for later use; then preparing a nano silver particle/glycol mixed solution, and taking 10ml of the nano silver particle/glycol mixed solution for ink-jet printing of the cotton fabric;
and after ink-jet printing, the cotton fabric is completely immersed in the copper plating solution for chemical plating deposition to obtain the copper-plated cotton fabric.
Example 3
Preparing copper plating solution with the content of 1LCircuposit 3350M-1 being 13g/L, the content of Circcuosit 3350A-1 being 6g/L, the content of formaldehyde being 3g/L and the temperature being 55 ℃ for later use; putting a cotton fabric with the size of 200mm multiplied by 200mm into a poly dimethyl diallyl ammonium chloride aqueous solution with the pH value of 6 and the content of 2g/L, soaking for 200s, and drying in a drying oven at the temperature of 65 ℃; adding a layer of sodium borohydride solution with the content of 0.01mol/L on the surface of the dried cotton fabric, and drying for later use; then preparing a nano silver particle/glycol mixed solution, and taking 10ml of the nano silver particle/glycol mixed solution for ink-jet printing of the cotton fabric;
and after ink-jet printing, the cotton fabric is completely immersed in the copper plating solution for chemical plating deposition to obtain the copper-plated cotton fabric.
Example 4
Preparing a copper plating solution with the content of 1LCircuposit 3350M-1 being 15g/L, the content of Circcuosit 3350A-1 being 8g/L, the content of aminoborane being 4g/L and the temperature being 45 ℃ for later use; putting a cotton fabric with the size of 200mm multiplied by 200mm into a poly dimethyl diallyl ammonium chloride aqueous solution with the pH value of 6 and the content of 2g/L, soaking for 200s, and drying in a drying oven at the temperature of 65 ℃; adding a layer of sodium borohydride solution with the content of 0.01mol/L on the surface of the dried cotton fabric, and drying for later use; then preparing a nano silver particle/glycol mixed solution, and taking 10ml of the nano silver particle/glycol mixed solution for ink-jet printing of the cotton fabric;
and after ink-jet printing, the cotton fabric is completely immersed in the copper plating solution for chemical plating deposition to obtain the copper-plated cotton fabric.
Example 5
Preparing a copper plating solution with the content of 1LCircuposit 3350M-1 of 15g/L, the content of Circcuosit 3350A-1 of 8g/L, the content of sodium hypophosphite of 4g/L and the temperature of 45 ℃ for later use; putting a cotton fabric with the size of 200mm multiplied by 200mm into a poly dimethyl diallyl ammonium chloride aqueous solution with the pH value of 6 and the content of 2g/L, soaking for 200s, and drying in a drying oven at the temperature of 65 ℃; adding a layer of sodium borohydride solution with the content of 0.01mol/L on the surface of the dried cotton fabric, and drying for later use; then preparing a nano silver particle/glycol mixed solution, and taking 10ml of the nano silver particle/glycol mixed solution for ink-jet printing of the cotton fabric;
and after ink-jet printing, the cotton fabric is completely immersed in the copper plating solution for chemical plating deposition to obtain the copper-plated cotton fabric.
The above is only a specific embodiment of the present invention, but the technical features of the present invention are not limited thereto. Any simple changes, equivalent substitutions or modifications made on the basis of the present invention to solve the same technical problems and achieve the same technical effects are all covered in the protection scope of the present invention.
Claims (9)
1. A chemical copper plating process suitable for clothing cotton fabric is characterized by comprising the following steps: the chemical copper plating process comprises the following steps:
(1) preparing a copper plating solution system;
(2) soaking the cotton fabric in a poly dimethyl diallyl ammonium chloride aqueous solution, taking out the cotton fabric after soaking, rolling the cotton fabric by using a roller to remove redundant liquid, and drying the cotton fabric after rolling;
(3) adding a layer of sodium borohydride solution on the cotton fabric treated in the step (2), and drying the cotton fabric;
(4) preparing a nano silver particle/ethylene glycol mixed solution, taking the mixed solution, and adding silver nano particles to the cotton fabric treated in the step (3) by using an ink-jet printer;
(5) and (3) completely immersing the cotton fabric treated in the step (4) into the copper plating solution system in the step (1) for chemical plating deposition.
2. The process for electroless copper plating suitable for clothing cotton fabric according to claim 1, characterized in that: the copper plating solution system prepared in the step (1) comprises the following specific steps: a. sequentially adding Cirtuosit 3350M-1 and Cirtuosit 3350A-1 into deionized water to prepare a mixed solution system; b. uniformly stirring the mixed solution system; c. keeping stirring and heating the mixed solution system to 40-55 ℃; d. and adding a reducing agent into the mixed solution system to prepare a copper plating solution system.
3. The process for electroless copper plating suitable for clothing cotton fabric according to claim 2, characterized in that: in the solution system, the volume ratio of deionized water, Cirtuosit 3350M-1, Cirtuosit 3350A-1 and a reducing agent is 82:15:2: 1.
4. The process for electroless copper plating suitable for clothing cotton fabric according to any one of claims 2 and 3, characterized in that: the content of Circcuposit 3350M-1 is 8-20g/L, and the content of Circcuposit 3350A-1 can be 4-10 g/L.
5. The process for electroless copper plating suitable for clothing cotton fabric according to claim 3, characterized in that: the reducing agent is one or more of formaldehyde, amino borane, sodium hypophosphite and hydrazine hydrate, and the content of the reducing agent is 1-4 g/L.
6. The process for electroless copper plating suitable for clothing cotton fabric according to claim 1, characterized in that: the content of the poly dimethyl diallyl ammonium chloride in the step (2) is 2 g/L; controlling the pH value of the aqueous solution of the poly dimethyl diallyl ammonium chloride to be 5.5-6.5; the soaking time of the cotton fabric is 180-300 s.
7. The process for electroless copper plating suitable for clothing cotton fabric according to claim 1, characterized in that: the drying temperature in the step (2) is 65 ℃, and the drying time is 10-15 min.
8. The process for electroless copper plating suitable for clothing cotton fabric according to claim 1, characterized in that: the content of the sodium borohydride in the step (3) is 0.01 mol/L.
9. The process for electroless copper plating suitable for clothing cotton fabric according to claim 1, characterized in that: in the step (4), the volume ratio of the nano silver particle solution to the ethylene glycol is 8: 1, mixing to obtain a nano silver particle/ethylene glycol mixed solution.
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| CN113279258A (en) * | 2021-05-19 | 2021-08-20 | 北京石墨烯研究院 | Conductive yarn and manufacturing method thereof, myoelectricity acquisition oversleeve and artificial limb interaction system |
| CN116219739A (en) * | 2022-12-29 | 2023-06-06 | 东华大学 | Preparation method of unidirectional moisture-conducting antibacterial multi-energy coupling heating textile |
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