JPS5713164A - Paste of activating metallic material for electroless plating and plating method using said paste - Google Patents
Paste of activating metallic material for electroless plating and plating method using said pasteInfo
- Publication number
- JPS5713164A JPS5713164A JP8821780A JP8821780A JPS5713164A JP S5713164 A JPS5713164 A JP S5713164A JP 8821780 A JP8821780 A JP 8821780A JP 8821780 A JP8821780 A JP 8821780A JP S5713164 A JPS5713164 A JP S5713164A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- plating
- electroless plating
- metallic material
- electroless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
Landscapes
- Chemically Coating (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
PURPOSE: To improve the adhesive strength and electrical characteristics of a plating layer by beforehand coating and heat treating the paste of an activating metallic material of specific composition on a ceramic material then electroless plating the same at the time of electroless plating Ni or Cu on said material.
CONSTITUTION: In electroless plating Ni or Cu on the surface of a ceramic material of dielectrics, semiconductors, insulators or the like, the paste of a metallic material for activating plating parts is beforehand coated on said surface. To prepare the paste, 0.03W5.0wt% in terms of metal chloroplatinic acid, palladium chloride or compound of other platinum group metals is dissolved in water, or mineral acid, to prepare metal varnish, and this is dispersed together with 0.5W30wt% carbon powder of ≤2μ in a vehicle of one or ≥2 kinds of oil soluble, water soluble and amphoteric resins such as cellulosic, rubber base and vinyl base resins as well as their derivatives, whereby the paste is prepared. This is coated on the required parts of the ceramics. After it is heat-treated at 420W920°C, it is electroless-plated with Ni, Cu or the like.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8821780A JPS5926661B2 (en) | 1980-06-28 | 1980-06-28 | Electroless plating active metal material paste and plating method using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8821780A JPS5926661B2 (en) | 1980-06-28 | 1980-06-28 | Electroless plating active metal material paste and plating method using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5713164A true JPS5713164A (en) | 1982-01-23 |
JPS5926661B2 JPS5926661B2 (en) | 1984-06-29 |
Family
ID=13936721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8821780A Expired JPS5926661B2 (en) | 1980-06-28 | 1980-06-28 | Electroless plating active metal material paste and plating method using the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5926661B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5831075A (en) * | 1981-08-19 | 1983-02-23 | Matsushita Electric Ind Co Ltd | Local electroless plating method |
JPS5933869A (en) * | 1982-08-20 | 1984-02-23 | Hitachi Ltd | Electrode material for semiconductor device |
JPS5974528A (en) * | 1982-10-21 | 1984-04-27 | Seiko Epson Corp | Vertical conducting agent for display panel |
-
1980
- 1980-06-28 JP JP8821780A patent/JPS5926661B2/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5831075A (en) * | 1981-08-19 | 1983-02-23 | Matsushita Electric Ind Co Ltd | Local electroless plating method |
JPS6237112B2 (en) * | 1981-08-19 | 1987-08-11 | Matsushita Electric Ind Co Ltd | |
JPS5933869A (en) * | 1982-08-20 | 1984-02-23 | Hitachi Ltd | Electrode material for semiconductor device |
JPH023555B2 (en) * | 1982-08-20 | 1990-01-24 | Hitachi Ltd | |
JPS5974528A (en) * | 1982-10-21 | 1984-04-27 | Seiko Epson Corp | Vertical conducting agent for display panel |
Also Published As
Publication number | Publication date |
---|---|
JPS5926661B2 (en) | 1984-06-29 |
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