JPS5713165A - Paste of activating metallic material for electroless plating and plating method using said paste - Google Patents

Paste of activating metallic material for electroless plating and plating method using said paste

Info

Publication number
JPS5713165A
JPS5713165A JP8821880A JP8821880A JPS5713165A JP S5713165 A JPS5713165 A JP S5713165A JP 8821880 A JP8821880 A JP 8821880A JP 8821880 A JP8821880 A JP 8821880A JP S5713165 A JPS5713165 A JP S5713165A
Authority
JP
Japan
Prior art keywords
paste
plating
electroless plating
metallic material
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8821880A
Other languages
Japanese (ja)
Other versions
JPS5926662B2 (en
Inventor
Kusuo Kuguhara
Hiromitsu Tagi
Noriya Satou
Katsuhiko Honjo
Makoto Ogawa
Shoji Kuroda
Kenichi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8821880A priority Critical patent/JPS5926662B2/en
Publication of JPS5713165A publication Critical patent/JPS5713165A/en
Publication of JPS5926662B2 publication Critical patent/JPS5926662B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques

Abstract

PURPOSE: To improve the adhesive strength and electrical characteristics of a plating layer by beforehand coating and heat treating the paste of an activating metallic material of specific composition on a ceramic material then electroless plating the same at the time of electroless plating Ni or Cu or said material.
CONSTITUTION: In electroless plating Ni or Cu on a ceramic material of dielectrics, semiconductors or the like, the paste of a metallic material for activating plating parts is beforehand coated thereon. As the paste, the paste as prepared by dissolving soluble inorg. and org. compounds of platinum group metals such at Pt, Ir, Os, Pd, Rh, Ru in water or mineral acid, to prepare metal varnish of 0.03W5.0wt% in terms of metal, and dispersing the same together with 1W30wt% a combustible org. compound of ≤2μ which is insoluble in solvents into a vehicle of one or ≥2 kinds of oil soluble, water soluble and amphoteric resins such as cellulosic, rubber base and vinyl base resins is used. This is coated on the required parts of the ceramics and is heat-treated at 420W920°C, after which it is electroless-plated with Ni or Cu.
COPYRIGHT: (C)1982,JPO&Japio
JP8821880A 1980-06-28 1980-06-28 Electroless plating active metal material paste and plating method using the same Expired JPS5926662B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8821880A JPS5926662B2 (en) 1980-06-28 1980-06-28 Electroless plating active metal material paste and plating method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8821880A JPS5926662B2 (en) 1980-06-28 1980-06-28 Electroless plating active metal material paste and plating method using the same

Publications (2)

Publication Number Publication Date
JPS5713165A true JPS5713165A (en) 1982-01-23
JPS5926662B2 JPS5926662B2 (en) 1984-06-29

Family

ID=13936744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8821880A Expired JPS5926662B2 (en) 1980-06-28 1980-06-28 Electroless plating active metal material paste and plating method using the same

Country Status (1)

Country Link
JP (1) JPS5926662B2 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831075A (en) * 1981-08-19 1983-02-23 Matsushita Electric Ind Co Ltd Local electroless plating method
WO1987002029A1 (en) * 1984-03-16 1987-04-09 Yoshito Akai Catalyst composition for electroless plating of ceramics
US6941843B2 (en) 1994-07-29 2005-09-13 Allen-Pal Llc Tool handle for holding multiple tools of different sizes during use
US9604349B2 (en) 2008-01-17 2017-03-28 Wagic, Inc. Universal ratcheting tool
US9676083B2 (en) 2009-10-05 2017-06-13 Wagic, Inc. Dual purpose flip-out and T handle
US10207400B2 (en) 2012-05-15 2019-02-19 Wagic, Inc. Adjustable tool handle for holding a tool during use
US10239197B2 (en) 2013-03-15 2019-03-26 Wagic, Inc. Post lock tool holder for L-shaped wrenches
US10322503B2 (en) 2008-01-17 2019-06-18 Wagic, Inc. Tool handle for holding multiple tools of different sizes during use
US10442069B2 (en) 2008-01-17 2019-10-15 Wagic, Inc. Biaxial foldout tool with multiple tools on a side and a rotational stop
US10723014B2 (en) 2012-05-15 2020-07-28 Wagic, Inc. Tool holder for holding multiple tools of different sizes

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6237112B2 (en) * 1981-08-19 1987-08-11 Matsushita Electric Ind Co Ltd
JPS5831075A (en) * 1981-08-19 1983-02-23 Matsushita Electric Ind Co Ltd Local electroless plating method
WO1987002029A1 (en) * 1984-03-16 1987-04-09 Yoshito Akai Catalyst composition for electroless plating of ceramics
US6941843B2 (en) 1994-07-29 2005-09-13 Allen-Pal Llc Tool handle for holding multiple tools of different sizes during use
US10322503B2 (en) 2008-01-17 2019-06-18 Wagic, Inc. Tool handle for holding multiple tools of different sizes during use
US9604349B2 (en) 2008-01-17 2017-03-28 Wagic, Inc. Universal ratcheting tool
US10442069B2 (en) 2008-01-17 2019-10-15 Wagic, Inc. Biaxial foldout tool with multiple tools on a side and a rotational stop
US10434631B2 (en) 2008-01-17 2019-10-08 Wagic, Inc. Universal ratcheting tool
US10343273B2 (en) 2009-10-05 2019-07-09 Wagic, Inc. Dual purpose flip-out and T handle
US9676083B2 (en) 2009-10-05 2017-06-13 Wagic, Inc. Dual purpose flip-out and T handle
US10207400B2 (en) 2012-05-15 2019-02-19 Wagic, Inc. Adjustable tool handle for holding a tool during use
US10723014B2 (en) 2012-05-15 2020-07-28 Wagic, Inc. Tool holder for holding multiple tools of different sizes
US10239197B2 (en) 2013-03-15 2019-03-26 Wagic, Inc. Post lock tool holder for L-shaped wrenches

Also Published As

Publication number Publication date
JPS5926662B2 (en) 1984-06-29

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