KR20020070443A - 전도성 상호연결장치 - Google Patents

전도성 상호연결장치 Download PDF

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Publication number
KR20020070443A
KR20020070443A KR1020027006699A KR20027006699A KR20020070443A KR 20020070443 A KR20020070443 A KR 20020070443A KR 1020027006699 A KR1020027006699 A KR 1020027006699A KR 20027006699 A KR20027006699 A KR 20027006699A KR 20020070443 A KR20020070443 A KR 20020070443A
Authority
KR
South Korea
Prior art keywords
alloy
copper
silver
metal alloy
contained
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020027006699A
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English (en)
Korean (ko)
Inventor
나가노소조
하가터힌리치
리지앙싱
뷰흘러제인
Original Assignee
허니웰 인터내셔널 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 허니웰 인터내셔널 인코포레이티드 filed Critical 허니웰 인터내셔널 인코포레이티드
Publication of KR20020070443A publication Critical patent/KR20020070443A/ko
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C22C5/08—Alloys based on silver with copper as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/425—Barrier, adhesion or liner layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H10W20/4403—Conductive materials thereof based on metals, e.g. alloys, metal silicides
    • H10W20/4421—Conductive materials thereof based on metals, e.g. alloys, metal silicides the principal metal being copper
    • H10W20/4424—Copper alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Physical Vapour Deposition (AREA)
KR1020027006699A 1999-11-24 2000-11-14 전도성 상호연결장치 Ceased KR20020070443A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US44902599A 1999-11-24 1999-11-24
US09/449,025 1999-11-24
PCT/US2000/031310 WO2001039250A2 (en) 1999-11-24 2000-11-14 Conductive interconnection

Publications (1)

Publication Number Publication Date
KR20020070443A true KR20020070443A (ko) 2002-09-09

Family

ID=23782571

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027006699A Ceased KR20020070443A (ko) 1999-11-24 2000-11-14 전도성 상호연결장치

Country Status (7)

Country Link
US (3) US6797079B2 (https=)
EP (1) EP1232525A2 (https=)
JP (1) JP2003529206A (https=)
KR (1) KR20020070443A (https=)
CN (1) CN1425196A (https=)
AU (1) AU1609501A (https=)
WO (1) WO2001039250A2 (https=)

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CN105364428A (zh) * 2015-12-24 2016-03-02 常熟市欧迪管业有限公司 凝汽器用钛管
CN105463239A (zh) * 2015-12-28 2016-04-06 苏州众禹环境科技有限公司 工业用旋流分离机
CN107475557A (zh) * 2015-12-29 2017-12-15 刘雷 一种高导电率高韧性的铜合金电缆导线及其制备方法
CN105463242A (zh) * 2016-01-05 2016-04-06 刘操 一种高导电率高延展性的铜合金导线及其制备方法
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CN107316671A (zh) * 2017-06-29 2017-11-03 合肥达户电线电缆科技有限公司 一种低电阻率电线及其制作工艺
CN107739873B (zh) * 2017-09-30 2019-02-12 重庆鸽牌电线电缆有限公司 调相机用含银铜排坯料配方
CN107937878A (zh) * 2017-11-13 2018-04-20 有研亿金新材料有限公司 一种铜银合金靶材的制备方法
KR102872450B1 (ko) 2018-12-13 2025-10-16 미쓰비시 마테리알 가부시키가이샤 순구리판
CN114269957B (zh) * 2019-09-27 2022-07-29 三菱综合材料株式会社 纯铜板

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US6758920B2 (en) 2004-07-06
WO2001039250A3 (en) 2001-12-13
WO2001039250A2 (en) 2001-05-31
CN1425196A (zh) 2003-06-18
AU1609501A (en) 2001-06-04
US20010035237A1 (en) 2001-11-01
US20010035238A1 (en) 2001-11-01

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