CN85104006B - 电介质/银合金/电介质型透明导电膜 - Google Patents
电介质/银合金/电介质型透明导电膜 Download PDFInfo
- Publication number
- CN85104006B CN85104006B CN85104006A CN85104006A CN85104006B CN 85104006 B CN85104006 B CN 85104006B CN 85104006 A CN85104006 A CN 85104006A CN 85104006 A CN85104006 A CN 85104006A CN 85104006 B CN85104006 B CN 85104006B
- Authority
- CN
- China
- Prior art keywords
- silver
- dielectric
- nesa coating
- silver alloys
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011248 coating agent Substances 0.000 title claims abstract description 11
- 238000000576 coating method Methods 0.000 title claims abstract description 11
- 229910001316 Ag alloy Inorganic materials 0.000 title claims description 11
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 5
- 239000000956 alloy Substances 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910000906 Bronze Inorganic materials 0.000 claims description 3
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000010974 bronze Substances 0.000 claims description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052793 cadmium Inorganic materials 0.000 claims description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 2
- NSAODVHAXBZWGW-UHFFFAOYSA-N cadmium silver Chemical compound [Ag].[Cd] NSAODVHAXBZWGW-UHFFFAOYSA-N 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- YZASAXHKAQYPEH-UHFFFAOYSA-N indium silver Chemical compound [Ag].[In] YZASAXHKAQYPEH-UHFFFAOYSA-N 0.000 claims description 2
- 239000012528 membrane Substances 0.000 abstract description 5
- 239000011521 glass Substances 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 2
- 239000004033 plastic Substances 0.000 abstract description 2
- 229920003023 plastic Polymers 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- 238000001771 vacuum deposition Methods 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 11
- 229910052709 silver Inorganic materials 0.000 description 11
- 239000004332 silver Substances 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 4
- 238000005987 sulfurization reaction Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229910052946 acanthite Inorganic materials 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 235000006708 antioxidants Nutrition 0.000 description 2
- XUARKZBEFFVFRG-UHFFFAOYSA-N silver sulfide Chemical compound [S-2].[Ag+].[Ag+] XUARKZBEFFVFRG-UHFFFAOYSA-N 0.000 description 2
- 229940056910 silver sulfide Drugs 0.000 description 2
- 229910000108 silver(I,III) oxide Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241001311547 Patina Species 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
Abstract
“电介质／合金／电介质型透明导电膜”，适用于玻璃、有机玻璃、聚酯、塑料等材料的表面真空镀膜。该导电膜采用合金做为中间层，可以改善膜堆的光电特性，提高机械强度及化学稳定性，降低成本，重复性好。此型膜堆可应用到相应于该领域采用的其它类型的透明导电膜上。
Description
本发明按“Thin Solid Films”杂志1982年第89卷287～293页发表的那一类“ZnS/Ag/ZnS型透明导电膜”发展而来的。
采用银合金主要目的，是为了提高该类型膜堆的透射率、机械强度和化学稳定性。
以往利用电介质/金属/电介质型透明导电膜，这种类型的透明导电膜，具有生产周期短、成本低、镀制方便，可以在低于100℃的基底上镀膜，可以镀在玻璃、有机玻璃、聚酯和塑料上。使得这种类型的透明导电膜，在与光电子学有关的所有领域中都有应用，另外，在航空、航海、轻工和建筑等许多领域也都有应用。近年来先后采用了各种金属做中间层进行研究，比如：银、金、铜、铝……最后确认银是最好的材料，目前广泛使用银做中间层。本发明人经反复研究，证实银的化学稳定性很差，很易氧化和硫化，并且机械强度较差。通过采用了银合金做中间层，使性能得到改善，在同样的电阻值情况下，用银合金做中间层，最大透射率为92%，用银做中间层，最大透射率为87%;并且抗氧化、硫化能力也得到提高，机械强度也有提高。其提高的主要原因是，由于用银做中间层，就银本身来说导电性非常好，但是由于银化学稳定性非常差，很容易氧化和硫化，所以当镀完银膜层以后，很快就形成一层氧化银和硫化银，由于这层氧化银和硫化银并不导电，使得透光性下降，电阻增大。当采用银合金做中间层时，虽然银合金的导电性不如银好，但是，由于银合金的抗氧化、硫化能力大大优于银，使得形成的氧化层和硫化层大大下降，因此，使得在同样的电阻值情况下，透光性增大。指标超过“Thin Solid Eilms”杂志1982年第89卷287～293页发表的ZnS/Ag/ZnS膜堆。
在镀制ZnS/Ag/ZnS膜堆时，用银合金代替银即可实现。
可采用下列合金之一：
银-镉（1～10%镉）
银-铟（1～20%铟）
银-铜（0.5～30%铜）
其中银-铜（1～10%铜）镀制的效果最佳。
Claims (6)
1、本发明为一种电介质/金属/电介质型透明导电膜，其特征在于用合金做该金属中间层。
2、根据权项1的透明导电膜，其特征是做为金属中间层的合金。采用的是银合金。
3、根据权项1或2的透明导电膜，其特征是做为金属中间层的银合金为：
银-镉（1～10%镉）
银-铟（1～10%铟）
银-铜（0.5～30%铜）
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN85104006A CN85104006B (zh) | 1985-05-20 | 1985-05-20 | 电介质/银合金/电介质型透明导电膜 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN85104006A CN85104006B (zh) | 1985-05-20 | 1985-05-20 | 电介质/银合金/电介质型透明导电膜 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN85104006A CN85104006A (zh) | 1986-01-10 |
| CN85104006B true CN85104006B (zh) | 1988-06-29 |
Family
ID=4793579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN85104006A Expired CN85104006B (zh) | 1985-05-20 | 1985-05-20 | 电介质/银合金/电介质型透明导电膜 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN85104006B (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6858102B1 (en) | 2000-11-15 | 2005-02-22 | Honeywell International Inc. | Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets |
| EP1232525A2 (en) | 1999-11-24 | 2002-08-21 | Honeywell International, Inc. | Conductive interconnection |
| CN103198873A (zh) * | 2012-01-04 | 2013-07-10 | 造能科技有限公司 | 透明导电薄膜 |
| CN102543271B (zh) * | 2012-02-17 | 2014-12-24 | 华东师范大学 | 热稳定性增强的透明导电薄膜及其应用 |
-
1985
- 1985-05-20 CN CN85104006A patent/CN85104006B/zh not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| CN85104006A (zh) | 1986-01-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| C10 | Entry into substantive examination | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| C13 | Decision | ||
| GR02 | Examined patent application | ||
| WD01 | Invention patent application deemed withdrawn after publication |