KR20020005439A - 디스크형 물체 처리 장치 - Google Patents
디스크형 물체 처리 장치 Download PDFInfo
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- KR20020005439A KR20020005439A KR1020010039626A KR20010039626A KR20020005439A KR 20020005439 A KR20020005439 A KR 20020005439A KR 1020010039626 A KR1020010039626 A KR 1020010039626A KR 20010039626 A KR20010039626 A KR 20010039626A KR 20020005439 A KR20020005439 A KR 20020005439A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
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- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Weting (AREA)
- Photographic Processing Devices Using Wet Methods (AREA)
- Drying Of Solid Materials (AREA)
- Treatment Of Fiber Materials (AREA)
- Sampling And Sample Adjustment (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (12)
- 디스크형 물체(1)의 하나 이상의 하단(1u)을 처리하기 위한 장치에 있어서,상부면(2o)을 가진 회전가능한 캐리어(2)가 구성되고, 상기 상부면(2o)으로부터 2개 이상의 장치(19)가 디스크형 물체(1)를 위치설정하기 위해 캐리어(2)의 상부면(2o)에 수직으로 돌출되며,디스크형 물체(1)의 하단(1u)에 처리 매개물을 공급하기 위한 하나 이상의 라인(20,22,24,26)이 구성되고, 상기 라인(20,22,24,26)은 정지되도록 구성되며, 중앙에서 캐리어(2)를 관통하도록 구성되고,커버(4)가 구성되며, 상기 커버(4)는 정지되도록 구성되고, 환형 갭(16)을 형성하며, 캐리어(2) 하부면(2u)의 하나 이상의 영역으로부터 이격되어 구성되고, 상기 커버(4)는 상기 하나 이상의 라인(20,22,24,26)에 의해 간극없이 천공되는 것을 특징으로 하는 장치.
- 제 1 항에 있어서, 하나 이상의 라인(20,22,24,26)에 인접한 커버(4)는 내측부(4i) 및 외측부(4a)로 구성되고, 상기 내측부(4i)는 캐리어(2)의 상부면(2o)에 평행하게 연장구성되며, 상기 외측부(4a)는 캐리어(2)의 상부면(2o)에 대해 하향으로 경사져 구성되는 것을 특징으로 하는 장치.
- 제 1 항에 있어서, 캐리어(2)의 하부면(2u)은 커버(4)와 상응하도록 구성되는 것을 특징으로 하는 장치.
- 제 1 항에 있어서, 캐리어(2)는 라인(20,22,24,26)에 대해 반경방향으로 커버(4)를 돌출시키는 것을 특징으로 하는 장치.
- 제 1 항에 있어서, 커버(4)는 정지되도록 튜브형 몸체(8)에 안착되고, 상기 튜브형 몸체(8)는 하나 이상의 라인(20,22,24,26)을 수용하는 것을 특징으로 하는 장치.
- 제 1 항에 있어서, 환형 디스크(7)는 캐리어(2)의 하부면(2u)에 인접되어 구성되고, 상기 환형 디스크(7)는 일정 거리에서 하나 이상의 라인(20,22,24,26)을 둘러싸며 구성되며, 외측부를 따라 캐리어(2)에 연결되고, 일정 거리(16u)에서 상기 커버(4)로 연장구성되는 것을 특징으로 하는 장치.
- 제 6 항에 있어서, 라인(20,22,24,26)에 반경방향으로 연장구성된 하나 이상의 갭(16s)이 환형갭(16)의 연장부로서 캐리어(2) 및 환형 디스크(7) 사이에 구성되는 것을 특징으로 하는 장치.
- 제 6 항에 있어서, 환형 디스크(7)는 회전 베어링(D1)에서 상기 환형 디스크(7)의 내측부를 따라 안내되고, 상기 회전 베어링(D1)은 커버(4)를 지지하는튜브형 몸체(8)에 지지되는 것을 특징으로 하는 장치.
- 제 6 항에 있어서, 환형 디스크(7)는 튜브형 연장부(5)로 구성되고, 상기 연장부는 캐리어(2)의 하부면(2u)으로부터 이격된 방향으로 하나 이상의 라인(20,22,24,26)에 평행하게 정렬되는 것을 특징으로 하는 장치.
- 제 9 항에 있어서, 튜브형 연장부(5)는 일정 거리에서 하나 이상의 라인(20,22,24,26) 및 튜브형 몸체(8)를 둘러싸며 구성되고, 상기 튜브형 몸체(8)는 하나 이상의 라인(20,22,24,26)을 수용하는 것을 특징으로 하는 장치.
- 제 9 항에 있어서, 튜브형 연장부(5)는 회전 구동장치(3)에 연결되는 것을 특징으로 하는 장치.
- 제 11 항에 있어서, 회전 구동장치(3)는 모터이고, 상기 모터의 로터(3r)는 튜브형 연장부(5)에 연결되며, 상기 모터의 스테이터(3s)는 하나 이상의 회전 베어링(D2,D3)에 의해 튜브형 연장부(5)에 지지되는 것을 특징으로 하는 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10033172.6 | 2000-07-07 | ||
DE10033172 | 2000-07-07 |
Publications (2)
Publication Number | Publication Date |
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KR20020005439A true KR20020005439A (ko) | 2002-01-17 |
KR100528741B1 KR100528741B1 (ko) | 2005-11-15 |
Family
ID=7648203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2001-0039626A KR100528741B1 (ko) | 2000-07-07 | 2001-07-04 | 디스크형 물체 처리 장치 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6536454B2 (ko) |
EP (1) | EP1170782B1 (ko) |
JP (2) | JP4091272B2 (ko) |
KR (1) | KR100528741B1 (ko) |
AT (1) | ATE360884T1 (ko) |
DE (1) | DE50112394D1 (ko) |
SG (1) | SG96222A1 (ko) |
TW (1) | TW555597B (ko) |
Cited By (1)
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-
2001
- 2001-05-01 US US09/846,049 patent/US6536454B2/en not_active Expired - Lifetime
- 2001-05-16 TW TW090111720A patent/TW555597B/zh not_active IP Right Cessation
- 2001-05-17 SG SG200102972A patent/SG96222A1/en unknown
- 2001-06-12 EP EP01114182A patent/EP1170782B1/de not_active Expired - Lifetime
- 2001-06-12 AT AT01114182T patent/ATE360884T1/de active
- 2001-06-12 DE DE50112394T patent/DE50112394D1/de not_active Expired - Lifetime
- 2001-06-18 JP JP2001183617A patent/JP4091272B2/ja not_active Expired - Fee Related
- 2001-07-04 KR KR10-2001-0039626A patent/KR100528741B1/ko active IP Right Grant
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2007
- 2007-07-11 JP JP2007182660A patent/JP2007311816A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050070702A (ko) * | 2003-12-30 | 2005-07-07 | 동부아남반도체 주식회사 | 웨이퍼 가이드핀 구조 |
Also Published As
Publication number | Publication date |
---|---|
EP1170782B1 (de) | 2007-04-25 |
US6536454B2 (en) | 2003-03-25 |
ATE360884T1 (de) | 2007-05-15 |
EP1170782A3 (de) | 2005-10-12 |
JP2002064078A (ja) | 2002-02-28 |
DE50112394D1 (de) | 2007-06-06 |
TW555597B (en) | 2003-10-01 |
SG96222A1 (en) | 2003-05-23 |
KR100528741B1 (ko) | 2005-11-15 |
JP4091272B2 (ja) | 2008-05-28 |
US20020002991A1 (en) | 2002-01-10 |
EP1170782A2 (de) | 2002-01-09 |
JP2007311816A (ja) | 2007-11-29 |
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