KR100820177B1 - 스핀 척 장치 - Google Patents
스핀 척 장치 Download PDFInfo
- Publication number
- KR100820177B1 KR100820177B1 KR1020060079215A KR20060079215A KR100820177B1 KR 100820177 B1 KR100820177 B1 KR 100820177B1 KR 1020060079215 A KR1020060079215 A KR 1020060079215A KR 20060079215 A KR20060079215 A KR 20060079215A KR 100820177 B1 KR100820177 B1 KR 100820177B1
- Authority
- KR
- South Korea
- Prior art keywords
- spin chuck
- injection
- wafer
- chuck body
- sheet member
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (5)
- 중심에 유로(12)가 형성되고 제자리에서 회전 구동되는 중심축(10)의 상부에 스핀척 본체(20)를 수평으로 설치하여 이루어지되,상기 스핀척 본체(20)의 상부에는 중심의 분사돌기부(22)와 상기 분사돌기부(22)의 외향 만곡가이드요부(24)를 형성하고,상기 분사돌기부(22)에는 중심축(10)의 유로(12)와 연통되고 경사지게 방사상으로 다수 형성된 분사로(26)를 마련하고,상기 분사돌기부(22)의 상부엔 상기 분사로(26)와 이격된 위치에 별도의 시트부재(40)를 설치하여 이루어지는 것을 특징으로 하는 스핀 척 장치.
- 제1항에 있어서,상기 스핀척 본체(20)와 상기 시트부재(40)가 서로 결합되는 부위로서 유로(12)의 상부 위치인 스핀척 본체(20)의 저부에는 분배공간(28)을 형성하고 상기 분배공간(28)과 상기 분사로(26)가 서로 연통될 수 있게 구성되고,상기 분배공간(28)의 상부 위치에는 설치홈(30)을 마련하여 상기 시트부재(40)의 저부에 형성된 설치돌기(42)를 끼워 스핀척 본체(20)와 시트부재(40)를 상호간 결합할 수 있게 이루어지는 것을 특징으로 하는 스핀 척 장치.
- 제1항에 있어서,상기 시트부재(40)의 상부 표면은 중심 부위가 높게 형성되고 외향으로 갈수록 낮게 형성하여 이루어지는 것을 특징으로 하는 스핀 척 장치.
- 제1항에 있어서,상기 스핀척 본체(20)에 형성되는 만곡가이드요부(24)의 외곽 부위에는 다수의 가이드돌기(32)를 미리 설치하고 상기 가이드돌기(32)의 내측으로 웨이퍼(50)를 위치시키게 되는 경우 회전 작동시에도 항상 수평상태를 유지할 수 있도록 상기 스핀척 본체(20)의 상부 표면으로서 상기 가이드돌기(32)의 내측으로 인접하고 상기 웨이퍼(50)의 외곽 저부가 위치하게 되는 부위의 높이와 상기 시트부재(40)의 상부 중심표면이 차지하는 높이가 서로 수평으로 동일한 높이를 유지하도록 구성이 이루어지는 것을 특징으로 하는 스핀 척 장치.
- 제1항에 있어서,상기 시트부재(40)의 저부로서 스핀척 본체(20) 중 분사돌기부(22)의 분사로(26)에 위치한 배출부엔 간극(34)을 형성하여 이루어지는 것을 특징으로 하는 스핀 척 장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060079215A KR100820177B1 (ko) | 2006-08-22 | 2006-08-22 | 스핀 척 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060079215A KR100820177B1 (ko) | 2006-08-22 | 2006-08-22 | 스핀 척 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080017702A KR20080017702A (ko) | 2008-02-27 |
KR100820177B1 true KR100820177B1 (ko) | 2008-04-07 |
Family
ID=39384980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060079215A KR100820177B1 (ko) | 2006-08-22 | 2006-08-22 | 스핀 척 장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100820177B1 (ko) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0338978A (ja) * | 1989-07-06 | 1991-02-20 | Canon Inc | 撮像装置 |
JPH0513276A (ja) * | 1991-07-04 | 1993-01-22 | Matsushita Electric Ind Co Ltd | 電解コンデンサ駆動用電解液 |
JP2008006000A (ja) * | 2006-06-28 | 2008-01-17 | Fujinon Corp | 内視鏡装置 |
-
2006
- 2006-08-22 KR KR1020060079215A patent/KR100820177B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0338978A (ja) * | 1989-07-06 | 1991-02-20 | Canon Inc | 撮像装置 |
JPH0513276A (ja) * | 1991-07-04 | 1993-01-22 | Matsushita Electric Ind Co Ltd | 電解コンデンサ駆動用電解液 |
JP2008006000A (ja) * | 2006-06-28 | 2008-01-17 | Fujinon Corp | 内視鏡装置 |
Non-Patent Citations (3)
Title |
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공개특허 제2006-0000417호 |
등록실용신안 제0338978호 |
등록특허 제0513276호 |
Also Published As
Publication number | Publication date |
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KR20080017702A (ko) | 2008-02-27 |
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