KR20010085494A - 시트 제거 장치 및 방법 - Google Patents
시트 제거 장치 및 방법 Download PDFInfo
- Publication number
- KR20010085494A KR20010085494A KR1020010009115A KR20010009115A KR20010085494A KR 20010085494 A KR20010085494 A KR 20010085494A KR 1020010009115 A KR1020010009115 A KR 1020010009115A KR 20010009115 A KR20010009115 A KR 20010009115A KR 20010085494 A KR20010085494 A KR 20010085494A
- Authority
- KR
- South Korea
- Prior art keywords
- sheet
- adhesive tape
- tape
- plate
- wafer
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 12
- 239000002390 adhesive tape Substances 0.000 claims abstract description 74
- 230000001681 protective effect Effects 0.000 abstract description 42
- 238000005520 cutting process Methods 0.000 description 24
- 238000010438 heat treatment Methods 0.000 description 21
- 238000003825 pressing Methods 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 238000007665 sagging Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000002788 crimping Methods 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
- Y10T156/1983—Poking delaminating means
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
- Dicing (AREA)
Abstract
Description
Claims (5)
- 판형 부재에 부착된 시트를 제거하도록 소정의 길이를 갖는 접착 테이프를 이용하는 시트 제거 장치에 있어서,시트의 연부에 접착 테이프를 접합하는 접합 수단과,판형 부재로부터 시트를 제거하도록 접착 테이프를 경사지게 상향으로 당기는 당김 수단을 포함하는 것을 특징으로 하는 시트 제거 장치.
- 판형 부재에 부착된 시트를 제거하도록 소정의 길이를 갖는 접착 테이프를 이용하는 시트 제거 장치에 있어서,시트의 연부에 접착 테이프를 접합하는 접합 수단과,판형 부재로부터 시트를 제거하도록 접착 테이프를 당기는 당김 수단과,상기 시트가 안내 롤러 위로 회전하게 될 때 시트가 확실하게 당겨지도록 상기 시트 부근에 배치된 안내 롤러를 포함하는 것을 특징으로 하는 시트 제거 장치.
- 제2항에 있어서, 상기 안내 롤러는 상기 판형 부재의 상향 이동을 방지하도록 하는 위치에 배치되는 것을 특징으로 하는 시트 제거 장치.
- 소정의 길이를 갖는 접착 테이프를 이용하여 판형 부재에 부착된 시트를 제거하는 방법에 있어서,시트의 연부에 접착 테이프를 접합하는 단계와,판형 부재로부터 시트를 제거하도록 접착 테이프를 경사지게 상향으로 당기는 단계를 포함하는 것을 특징으로 하는 시트 제거 방법.
- 소정의 길이를 갖는 접착 테이프를 이용하여 판형 부재에 부착된 시트를 제거하는 방법에 있어서,시트의 연부에 접착 테이프를 접합하는 단계와,안내 롤러 위로 회전하는 상기 시트와 함께 접착 테이프를 당기는 단계를 포함하는 것을 특징으로 하는 시트 제거 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-47647 | 2000-02-24 | ||
JP2000047647A JP4166920B2 (ja) | 2000-02-24 | 2000-02-24 | シート剥離装置および方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010085494A true KR20010085494A (ko) | 2001-09-07 |
KR100560014B1 KR100560014B1 (ko) | 2006-03-15 |
Family
ID=18569866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010009115A KR100560014B1 (ko) | 2000-02-24 | 2001-02-23 | 시트 제거 장치 및 방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6616799B2 (ko) |
EP (1) | EP1128415B8 (ko) |
JP (1) | JP4166920B2 (ko) |
KR (1) | KR100560014B1 (ko) |
DE (1) | DE60142499D1 (ko) |
SG (1) | SG99327A1 (ko) |
TW (1) | TW588417B (ko) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3441696B2 (ja) * | 1999-04-22 | 2003-09-02 | 日本サーボ株式会社 | チップマウンター用チップフィーダ |
JP4502547B2 (ja) * | 2000-08-07 | 2010-07-14 | 日東電工株式会社 | 半導体ウエハの保護テープ除去方法およびその装置 |
JP4266106B2 (ja) * | 2001-09-27 | 2009-05-20 | 株式会社東芝 | 粘着性テープの剥離装置、粘着性テープの剥離方法、半導体チップのピックアップ装置、半導体チップのピックアップ方法及び半導体装置の製造方法 |
JP4494753B2 (ja) * | 2003-10-27 | 2010-06-30 | リンテック株式会社 | シート剥離装置及び剥離方法 |
JP4538242B2 (ja) * | 2004-01-23 | 2010-09-08 | 株式会社東芝 | 剥離装置及び剥離方法 |
JP4485248B2 (ja) * | 2004-04-28 | 2010-06-16 | リンテック株式会社 | 剥離装置及び剥離方法 |
TW200539296A (en) * | 2004-04-28 | 2005-12-01 | Lintec Corp | Sheet peeling apparatus and peeling method |
JP2011140232A (ja) * | 2004-07-06 | 2011-07-21 | Fujifilm Corp | 感光性積層体の製造装置及び製造方法 |
JP4326418B2 (ja) * | 2004-07-16 | 2009-09-09 | 株式会社東京精密 | フィルム剥離方法およびフィルム剥離装置 |
JP4771729B2 (ja) * | 2005-04-04 | 2011-09-14 | 長野オートメーション株式会社 | 保護フィルム剥取り方法と保護フィルム剥取り装置 |
JP4795743B2 (ja) * | 2005-05-19 | 2011-10-19 | リンテック株式会社 | 貼付装置 |
KR20070009865A (ko) * | 2005-07-14 | 2007-01-19 | 삼성전자주식회사 | 보호시트 제거 장치 및 방법 |
JP2007036111A (ja) | 2005-07-29 | 2007-02-08 | Tokyo Seimitsu Co Ltd | フィルム剥離方法およびフィルム剥離装置 |
JP2007109927A (ja) * | 2005-10-14 | 2007-04-26 | Tokyo Seimitsu Co Ltd | 表面保護フィルム剥離方法および表面保護フィルム剥離装置 |
JP4953764B2 (ja) * | 2005-11-29 | 2012-06-13 | 株式会社東京精密 | 剥離テープ貼付方法および剥離テープ貼付装置 |
TWI335899B (en) * | 2006-11-03 | 2011-01-11 | Kodak Graphic Comm Canada Co | Methods and apparatus for peeling a flexible sheet from a substrate |
WO2008112660A1 (en) * | 2007-03-09 | 2008-09-18 | Nexus Biosystems, Inc. | Device and method for removing a peelable seal |
JP4824622B2 (ja) * | 2007-05-10 | 2011-11-30 | リンテック株式会社 | シート剥離装置及び剥離方法 |
JP4728281B2 (ja) * | 2007-05-21 | 2011-07-20 | リンテック株式会社 | シート剥離装置及び剥離方法 |
JP4839284B2 (ja) * | 2007-09-03 | 2011-12-21 | 日立設備エンジニアリング株式会社 | 半導体ウエハ等の板状部材の保護シート剥離用接着テープの取り付け方法及び保護シート剥離方法 |
JP4724742B2 (ja) * | 2008-01-09 | 2011-07-13 | 日東電工株式会社 | 光学表示装置の製造システムおよび光学表示装置の製造方法 |
DE102008000461B3 (de) | 2008-02-29 | 2009-07-30 | Foliotec Gmbh | Verfahren und Vorrichtung zum Abziehen einer Folie von einem plattenartigen Trägern oder einer Folie |
JP5235111B2 (ja) * | 2008-07-24 | 2013-07-10 | リンテック株式会社 | シート剥離装置及び剥離方法 |
JP5442288B2 (ja) * | 2009-03-27 | 2014-03-12 | 日東電工株式会社 | 保護テープ剥離方法およびこれを用いた保護テープ剥離装置 |
JP4740381B2 (ja) * | 2010-03-12 | 2011-08-03 | リンテック株式会社 | シート剥離装置及び剥離方法 |
JP5607557B2 (ja) * | 2011-02-21 | 2014-10-15 | リンテック株式会社 | シート保持装置及びシート貼付装置 |
JP5981229B2 (ja) * | 2012-06-01 | 2016-08-31 | リンテック株式会社 | シート剥離装置及び剥離方法 |
KR101989484B1 (ko) * | 2012-07-09 | 2019-06-17 | 삼성디스플레이 주식회사 | 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템 |
JP5778116B2 (ja) * | 2012-11-05 | 2015-09-16 | 日東電工株式会社 | 粘着シート貼付け方法および粘着シート貼付け装置 |
KR102069851B1 (ko) * | 2013-03-26 | 2020-01-28 | 삼성디스플레이 주식회사 | 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템 |
KR101969092B1 (ko) * | 2013-04-10 | 2019-04-16 | 삼성디스플레이 주식회사 | 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템 |
TWI555071B (zh) * | 2014-05-07 | 2016-10-21 | 鴻積科機股份有限公司 | 使黏著物能夠轉換至另一膠膜的撕膜裝置 |
KR101701565B1 (ko) * | 2014-08-14 | 2017-02-01 | 주식회사 엘지화학 | 패널로부터 편광 필름을 박리하기 위한 박리바, 이를 이용한 박리 장치 및 박리 방법 |
KR102200652B1 (ko) * | 2018-10-11 | 2021-01-11 | 주식회사 쿠온솔루션 | 웨이퍼 박리 시스템에 사용되는 테이프 분리 장치 및 방법 |
JP7488148B2 (ja) | 2020-08-03 | 2024-05-21 | 株式会社ディスコ | 剥離装置 |
DE102022134515A1 (de) | 2022-12-22 | 2024-06-27 | Advanced Engineering Industrie Automation GmbH | Vorrichtung und Verfahren zum Abziehen von Schutzfolien von plattenförmigen Gegenständen |
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US4285759A (en) * | 1979-11-19 | 1981-08-25 | E. I. Du Pont De Nemours And Company | Apparatus for stripping a cover sheet |
JPS59174677A (ja) * | 1983-03-24 | 1984-10-03 | Nitto Electric Ind Co Ltd | 保護フイルムの剥離方法 |
DE3532553C1 (de) * | 1985-09-12 | 1987-03-12 | Loehr & Herrmann Gmbh | Verfahren und Vorrichtung zum Abziehen der Schutzfolie von einer mit belichtetem Fotoresist beschichteten Leiterplatte |
US4752346A (en) * | 1987-07-06 | 1988-06-21 | Hoechst Celanese Corporation | Apparatus and method for separating adherent films |
JPH0691153B2 (ja) * | 1987-11-28 | 1994-11-14 | 日東電工株式会社 | 保護フイルムの剥離方法 |
JPH0682750B2 (ja) * | 1989-08-30 | 1994-10-19 | 日東電工株式会社 | ウエハ保護シートの剥離方法 |
JPH04336428A (ja) * | 1991-05-13 | 1992-11-24 | Nitto Denko Corp | ウエハのテープ貼合わせ剥離装置 |
DE4127724A1 (de) * | 1991-08-22 | 1993-02-25 | Hoechst Ag | Vorrichtung zum trennen und abziehen einer auf einem traegermaterial auflaminierten folie |
JP3156419B2 (ja) * | 1993-02-15 | 2001-04-16 | 松下電器産業株式会社 | 異方性導電フィルム保護用セパレータの剥離方法 |
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EP0848415A1 (en) * | 1995-08-31 | 1998-06-17 | Nitto Denko Corporation | Method and apparatus for peeling protective adhesive tape from semiconductor wafer |
JP4204658B2 (ja) | 1997-11-28 | 2009-01-07 | リンテック株式会社 | シート剥離装置および方法 |
US6149758A (en) | 1997-06-20 | 2000-11-21 | Lintec Corporation | Sheet removing apparatus and method |
JP4204653B2 (ja) | 1997-06-20 | 2009-01-07 | リンテック株式会社 | シート剥離装置および方法 |
JP3560823B2 (ja) * | 1998-08-18 | 2004-09-02 | リンテック株式会社 | ウェハ転写装置 |
US6500291B1 (en) * | 1998-09-11 | 2002-12-31 | Hitachi Chemical Co. Ltd. | Device and method for lamination |
US6500298B1 (en) * | 2000-01-14 | 2002-12-31 | Kevin P. Wright | Stripping machine and method |
KR100383265B1 (ko) * | 2001-01-17 | 2003-05-09 | 삼성전자주식회사 | 웨이퍼 보호 테이프 제거용 반도체 제조장치 |
-
2000
- 2000-02-24 JP JP2000047647A patent/JP4166920B2/ja not_active Expired - Lifetime
-
2001
- 2001-01-03 US US09/755,384 patent/US6616799B2/en not_active Expired - Lifetime
- 2001-01-05 SG SG200100098A patent/SG99327A1/en unknown
- 2001-01-08 DE DE60142499T patent/DE60142499D1/de not_active Expired - Lifetime
- 2001-01-08 EP EP01100463A patent/EP1128415B8/en not_active Expired - Lifetime
- 2001-01-09 TW TW090100399A patent/TW588417B/zh not_active IP Right Cessation
- 2001-02-23 KR KR1020010009115A patent/KR100560014B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP1128415A2 (en) | 2001-08-29 |
US6616799B2 (en) | 2003-09-09 |
EP1128415B8 (en) | 2011-01-12 |
KR100560014B1 (ko) | 2006-03-15 |
DE60142499D1 (de) | 2010-08-19 |
JP2001233542A (ja) | 2001-08-28 |
US20010017189A1 (en) | 2001-08-30 |
EP1128415B1 (en) | 2010-07-07 |
SG99327A1 (en) | 2003-10-27 |
EP1128415A3 (en) | 2006-05-31 |
TW588417B (en) | 2004-05-21 |
JP4166920B2 (ja) | 2008-10-15 |
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