KR102661147B1 - 프로브 가이드판, 그 제조 방법 및 프로브 장치 - Google Patents

프로브 가이드판, 그 제조 방법 및 프로브 장치 Download PDF

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Publication number
KR102661147B1
KR102661147B1 KR1020170005902A KR20170005902A KR102661147B1 KR 102661147 B1 KR102661147 B1 KR 102661147B1 KR 1020170005902 A KR1020170005902 A KR 1020170005902A KR 20170005902 A KR20170005902 A KR 20170005902A KR 102661147 B1 KR102661147 B1 KR 102661147B1
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South Korea
Prior art keywords
hole
silicon substrate
oxide layer
silicon oxide
guide plate
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Korean (ko)
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KR20170085450A (ko
Inventor
고스케 후지하라
유이치로 시미즈
Original Assignee
신꼬오덴기 고교 가부시키가이샤
재팬 일렉트로닉 메트리얼스 코오포레이숀
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Publication of KR20170085450A publication Critical patent/KR20170085450A/ko
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Publication of KR102661147B1 publication Critical patent/KR102661147B1/ko
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020170005902A 2016-01-14 2017-01-13 프로브 가이드판, 그 제조 방법 및 프로브 장치 Active KR102661147B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016004970A JP6706076B2 (ja) 2016-01-14 2016-01-14 プローブガイド板及びその製造方法とプローブ装置
JPJP-P-2016-004970 2016-01-14

Publications (2)

Publication Number Publication Date
KR20170085450A KR20170085450A (ko) 2017-07-24
KR102661147B1 true KR102661147B1 (ko) 2024-04-29

Family

ID=59313627

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170005902A Active KR102661147B1 (ko) 2016-01-14 2017-01-13 프로브 가이드판, 그 제조 방법 및 프로브 장치

Country Status (4)

Country Link
US (1) US10386387B2 (https=)
JP (1) JP6706076B2 (https=)
KR (1) KR102661147B1 (https=)
TW (1) TWI719120B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6563317B2 (ja) * 2015-11-25 2019-08-21 新光電気工業株式会社 プローブガイド板及びその製造方法とプローブ装置
CN107728043B (zh) * 2017-11-15 2020-08-28 奥士康科技股份有限公司 一种电路板测试方法及电路板测试系统
CN109212282B (zh) * 2018-08-22 2021-04-16 矽电半导体设备(深圳)股份有限公司 一种全自动探针检测台及其探针定位模组
TWI752732B (zh) * 2020-11-18 2022-01-11 中華精測科技股份有限公司 穿孔對位總成及穿孔對位方法
KR20230086509A (ko) * 2021-12-08 2023-06-15 삼성전자주식회사 반도체 장치, 반도체 패키지, 및 반도체 장치의 제조 방법

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000243942A (ja) 1998-02-04 2000-09-08 Canon Inc 半導体基板とその製造方法
JP2001118943A (ja) 1999-10-22 2001-04-27 Fujitsu Ltd 不揮発性半導体記憶装置の製造方法
US20020004320A1 (en) 1995-05-26 2002-01-10 David V. Pedersen Attaratus for socketably receiving interconnection elements of an electronic component
US20020113239A1 (en) 1995-06-20 2002-08-22 Semiconductor Energy Laboratory Co., Ltd. A Japan Corporation Semiconductor device with a tapered hole formed using multiple layers with different etching rates
US20050225344A1 (en) 2003-03-06 2005-10-13 Kirby Kyle K Interconnect having spring contacts
JP2007171139A (ja) 2005-12-26 2007-07-05 Apex Inc プローブ保持構造およびバネ型プローブ
US20070259506A1 (en) 2004-08-30 2007-11-08 Tomohisa Hoshino Probe Needle, Method for Manufacturing the Probe Needle and Method for Constructing a Three-Dimensional Structure
US20070257689A1 (en) 2006-05-05 2007-11-08 Dalton Timothy J High density thermally matched contacting probe assembly and method for producing same
US20080217791A1 (en) 2007-03-06 2008-09-11 Olympus Corporation Semiconductor device
US20100231249A1 (en) 2009-03-12 2010-09-16 Dang Son N Probe Head Structure For Probe Test Cards

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19748823B4 (de) * 1997-11-05 2005-09-08 Feinmetall Gmbh Servicefreundliche Kontaktiervorrichtung
JP3862845B2 (ja) * 1998-02-05 2006-12-27 セイコーインスツル株式会社 近接場用光プローブ
TWI239685B (en) * 2003-05-13 2005-09-11 Jsr Corp Flaky probe, its manufacturing method and its application
JP2007057447A (ja) 2005-08-26 2007-03-08 Japan Electronic Materials Corp プローブカード用ガイド板およびその加工方法
KR20070057447A (ko) 2005-12-02 2007-06-07 주식회사 대우일렉트로닉스 데이터 방송을 이용한 온도 제어 장치
US8907689B2 (en) * 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
WO2013006771A2 (en) * 2011-07-06 2013-01-10 Celadon Systems, Inc. Test systems with a probe apparatus and index mechanism
JP5847663B2 (ja) * 2012-08-01 2016-01-27 日本電子材料株式会社 プローブカード用ガイド板の製造方法
JP2014071069A (ja) 2012-10-01 2014-04-21 Japan Electronic Materials Corp 垂直型プローブ
KR102045729B1 (ko) 2012-12-03 2019-11-18 엘지디스플레이 주식회사 적하장치용 제팅 밸브
JP6112890B2 (ja) * 2013-02-07 2017-04-12 日置電機株式会社 プローブユニット、基板検査装置およびプローブユニット組立方法
JP6235785B2 (ja) 2013-03-18 2017-11-22 日本電子材料株式会社 プローブカード用ガイド板およびプローブカード用ガイド板の製造方法
JP6341634B2 (ja) * 2013-05-28 2018-06-13 新光電気工業株式会社 プローブガイド板及びその製造方法、半導体検査装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020004320A1 (en) 1995-05-26 2002-01-10 David V. Pedersen Attaratus for socketably receiving interconnection elements of an electronic component
US20020113239A1 (en) 1995-06-20 2002-08-22 Semiconductor Energy Laboratory Co., Ltd. A Japan Corporation Semiconductor device with a tapered hole formed using multiple layers with different etching rates
JP2000243942A (ja) 1998-02-04 2000-09-08 Canon Inc 半導体基板とその製造方法
JP2001118943A (ja) 1999-10-22 2001-04-27 Fujitsu Ltd 不揮発性半導体記憶装置の製造方法
US20050225344A1 (en) 2003-03-06 2005-10-13 Kirby Kyle K Interconnect having spring contacts
US20070259506A1 (en) 2004-08-30 2007-11-08 Tomohisa Hoshino Probe Needle, Method for Manufacturing the Probe Needle and Method for Constructing a Three-Dimensional Structure
JP2007171139A (ja) 2005-12-26 2007-07-05 Apex Inc プローブ保持構造およびバネ型プローブ
US20070257689A1 (en) 2006-05-05 2007-11-08 Dalton Timothy J High density thermally matched contacting probe assembly and method for producing same
US20080217791A1 (en) 2007-03-06 2008-09-11 Olympus Corporation Semiconductor device
US20100231249A1 (en) 2009-03-12 2010-09-16 Dang Son N Probe Head Structure For Probe Test Cards

Also Published As

Publication number Publication date
US20170205444A1 (en) 2017-07-20
JP6706076B2 (ja) 2020-06-03
TW201734463A (zh) 2017-10-01
US10386387B2 (en) 2019-08-20
KR20170085450A (ko) 2017-07-24
TWI719120B (zh) 2021-02-21
JP2017125761A (ja) 2017-07-20

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