KR102526223B1 - 절삭 장치, 및 전극 단자 유닛 - Google Patents

절삭 장치, 및 전극 단자 유닛 Download PDF

Info

Publication number
KR102526223B1
KR102526223B1 KR1020180078102A KR20180078102A KR102526223B1 KR 102526223 B1 KR102526223 B1 KR 102526223B1 KR 1020180078102 A KR1020180078102 A KR 1020180078102A KR 20180078102 A KR20180078102 A KR 20180078102A KR 102526223 B1 KR102526223 B1 KR 102526223B1
Authority
KR
South Korea
Prior art keywords
electrode terminal
cutting
spindle
face
cutting blade
Prior art date
Application number
KR1020180078102A
Other languages
English (en)
Korean (ko)
Other versions
KR20190010435A (ko
Inventor
히로유키 하시모토
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20190010435A publication Critical patent/KR20190010435A/ko
Application granted granted Critical
Publication of KR102526223B1 publication Critical patent/KR102526223B1/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mining & Mineral Resources (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
KR1020180078102A 2017-07-21 2018-07-05 절삭 장치, 및 전극 단자 유닛 KR102526223B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017142119A JP6975570B2 (ja) 2017-07-21 2017-07-21 切削装置、及び、電極端子ユニット
JPJP-P-2017-142119 2017-07-21

Publications (2)

Publication Number Publication Date
KR20190010435A KR20190010435A (ko) 2019-01-30
KR102526223B1 true KR102526223B1 (ko) 2023-04-26

Family

ID=65182717

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180078102A KR102526223B1 (ko) 2017-07-21 2018-07-05 절삭 장치, 및 전극 단자 유닛

Country Status (4)

Country Link
JP (1) JP6975570B2 (ja)
KR (1) KR102526223B1 (ja)
CN (1) CN109278205B (ja)
TW (1) TWI752235B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111445783B (zh) * 2020-05-09 2022-02-08 山东赛纳石油科技有限公司 一种方便更换的抗风警示牌

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010251577A (ja) 2009-04-17 2010-11-04 Disco Abrasive Syst Ltd 切削装置
JP2012232357A (ja) 2011-04-28 2012-11-29 Disco Corp 電極ユニット
KR101738418B1 (ko) 2017-03-30 2017-05-22 주식회사 삼흥테크놀리지 다이싱 장치의 스핀들 위치 영점설정을 위한 조기 안전 경보 시스템 및 그 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2311428A1 (fr) * 1975-05-13 1976-12-10 Sev Marchal Machine electrique tournante ayant un dispositif porte-balais perfectionne
AR220485A1 (es) * 1980-08-12 1980-10-31 Soroka E Portacontacto electrico del tipo denominado portacarbones
JPH0448134Y2 (ja) * 1987-05-29 1992-11-12
GB9307761D0 (en) 1993-04-15 1993-06-02 Emhart Glass Mach Invest Glassware forming machine
JP2597808Y2 (ja) * 1993-07-20 1999-07-19 株式会社ディスコ エアースピンドル通電機構
US5631513A (en) * 1995-03-20 1997-05-20 Ametek, Inc. Dynamoelectric brush holder clip and connector
KR0135179Y1 (ko) * 1995-05-02 1999-04-15 한순윤 카본 브러쉬 홀더
JPH11317382A (ja) * 1998-05-06 1999-11-16 Seiko Seiki Co Ltd エアスピンドル用ブラシの取付構造
CN202042783U (zh) * 2011-03-17 2011-11-16 浙江皇冠电动工具制造有限公司 一种碳刷的簧片与刷握连接结构改进
JP6059931B2 (ja) * 2012-09-24 2017-01-11 株式会社ディスコ 切削装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010251577A (ja) 2009-04-17 2010-11-04 Disco Abrasive Syst Ltd 切削装置
JP2012232357A (ja) 2011-04-28 2012-11-29 Disco Corp 電極ユニット
KR101738418B1 (ko) 2017-03-30 2017-05-22 주식회사 삼흥테크놀리지 다이싱 장치의 스핀들 위치 영점설정을 위한 조기 안전 경보 시스템 및 그 방법

Also Published As

Publication number Publication date
CN109278205A (zh) 2019-01-29
TWI752235B (zh) 2022-01-11
KR20190010435A (ko) 2019-01-30
CN109278205B (zh) 2022-02-11
JP2019018331A (ja) 2019-02-07
JP6975570B2 (ja) 2021-12-01
TW201909260A (zh) 2019-03-01

Similar Documents

Publication Publication Date Title
JP4837973B2 (ja) 切削ブレードの交換装置
CN110233128B (zh) 卡盘工作台、切削装置以及卡盘工作台的修正方法
JP2007229843A (ja) 切削装置
TW200950922A (en) Blade breakage and abrasion detecting device
KR102526223B1 (ko) 절삭 장치, 및 전극 단자 유닛
JP5313026B2 (ja) 切削装置
TWI772361B (zh) 被加工物的切割方法
US11292145B2 (en) Blade changer unit
JP2009274177A (ja) 切削装置
JP4837974B2 (ja) 切削ブレードの交換装置
US10086485B2 (en) Machine tool
JP5512946B2 (ja) 切削装置
JP2018113352A (ja) チャックテーブル及び加工装置
JP5335532B2 (ja) 切削装置
JP6078297B2 (ja) 加工装置
JP5681038B2 (ja) 電極ユニット
KR102341606B1 (ko) 절삭 장치
CN211662380U (zh) 一种具有可调节式真空吸盘的晶圆切割机
JP7129904B2 (ja) 電極端子挿入治具
JP6059931B2 (ja) 切削装置
JP5906134B2 (ja) 切削装置
JP6168967B2 (ja) 切削装置
JP2021079490A (ja) 切削装置
JP2014042943A (ja) 加工装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant