JP2019018331A - 切削装置、及び、電極端子ユニット - Google Patents
切削装置、及び、電極端子ユニット Download PDFInfo
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- JP2019018331A JP2019018331A JP2017142119A JP2017142119A JP2019018331A JP 2019018331 A JP2019018331 A JP 2019018331A JP 2017142119 A JP2017142119 A JP 2017142119A JP 2017142119 A JP2017142119 A JP 2017142119A JP 2019018331 A JP2019018331 A JP 2019018331A
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- 238000005452 bending Methods 0.000 claims description 39
- 239000004020 conductor Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000002173 cutting fluid Substances 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000006870 function Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 150000001721 carbon Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mining & Mineral Resources (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Machine Tool Sensing Apparatuses (AREA)
Abstract
Description
10 チャックテーブル(保持テーブル)
13 金属基台
20 切削手段
21 切削ブレード
22 スピンドル
23 スピンドルハウジング
26 サーボモータ
261 ステータ
262 ロータ
262A 端面(スピンドルの端面)
70 原点検出機構
71 キャップ(スピンドルハウジング)
71A 肉厚部
72 挿入孔
73 係止溝(受け入れ部)
74 電極端子
74A 当接面
76 導電性屈曲プレート
76A 係止部
76B 挿入部
77 把持部
78 ストッパー部
78A 折り返し部
78A1 山部
80,81 電極端子ユニット
95 原点検出回路
100 ウエーハ(被加工物)
Claims (4)
- 被加工物を保持する保持テーブルと、該保持テーブルで保持された被加工物を切削する切削ブレードと該切削ブレードが一端に装着されるスピンドルとを有した切削手段と、該切削ブレードと該保持テーブルとを接触させて電気的導通により該保持テーブルに対する該切削ブレードの切り込み方向の原点位置を検出する原点検出機構と、を備えた切削装置であって、
該原点検出機構は、
該スピンドルを回転可能に支持するハウジングに該スピンドルの他端側の端面に対向して挿入され、該端面に当接する当接面を有した電極端子と、
該電極端子を該端面に押圧する導電性材料からなる押圧ばねと、
該押圧ばねを係止する係止部を有し、該係止部と一体的に形成されるとともに該電極端子側に屈曲した挿入部を有する導電性屈曲プレートと、を備え、
該ハウジングには、該電極端子が該押圧ばねを介して挿入される挿入孔が形成されるとともに該導電性屈曲プレートの該挿入部が挿入される受け入れ部が形成され、
該受け入れ部には、挿入された該導電性屈曲プレートを保持するストッパー部が形成されることで、該導電性屈曲プレートを該ハウジングに挿入することで該電極端子を該端面に当接した状態で固定する、切削装置。 - 該導電性屈曲プレートには、作業者が把持する把持部が形成されている、請求項1に記載の切削装置。
- 該ストッパー部は導電性部材からなり、該導電性屈曲プレートの該挿入部が該受け入れ部に挿入されることで該原点検出機構による原点検出回路を構成する、請求項1に記載の切削装置。
- 被加工物を保持する保持テーブルと、該保持テーブルで保持された被加工物を切削する切削ブレードと該切削ブレードが一端に装着されるスピンドルとを有した切削手段と、該切削ブレードと該保持テーブルとを接触させて電気的導通により該保持テーブルに対する該切削ブレードの切り込み方向の原点位置を検出する原点検出機構と、を備えた切削装置において該原点検出機構を構成する電極端子ユニットであって、
該スピンドルを回転可能に支持するハウジングに該スピンドルの他端側の端面に対向して挿入され、該端面に当接する当接面を有した電極端子と、
該電極端子を該端面に押圧する導電性材料からなる押圧ばねと、
該電極端子と反対側で該押圧ばねを係止する係止部を有し、該係止部と一体的に形成されるとともに該電極端子側に屈曲した挿入部を有する導電性屈曲プレートと、を備えた電極端子ユニット。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017142119A JP6975570B2 (ja) | 2017-07-21 | 2017-07-21 | 切削装置、及び、電極端子ユニット |
TW107119943A TWI752235B (zh) | 2017-07-21 | 2018-06-11 | 切削裝置及電極端子單元 |
KR1020180078102A KR102526223B1 (ko) | 2017-07-21 | 2018-07-05 | 절삭 장치, 및 전극 단자 유닛 |
CN201810794674.1A CN109278205B (zh) | 2017-07-21 | 2018-07-19 | 切削装置和电极端子组件 |
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JP2017142119A JP6975570B2 (ja) | 2017-07-21 | 2017-07-21 | 切削装置、及び、電極端子ユニット |
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JP2019018331A true JP2019018331A (ja) | 2019-02-07 |
JP6975570B2 JP6975570B2 (ja) | 2021-12-01 |
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JP (1) | JP6975570B2 (ja) |
KR (1) | KR102526223B1 (ja) |
CN (1) | CN109278205B (ja) |
TW (1) | TWI752235B (ja) |
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CN111445783B (zh) * | 2020-05-09 | 2022-02-08 | 山东赛纳石油科技有限公司 | 一种方便更换的抗风警示牌 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11317382A (ja) * | 1998-05-06 | 1999-11-16 | Seiko Seiki Co Ltd | エアスピンドル用ブラシの取付構造 |
JP2012232357A (ja) * | 2011-04-28 | 2012-11-29 | Disco Corp | 電極ユニット |
KR101738418B1 (ko) * | 2017-03-30 | 2017-05-22 | 주식회사 삼흥테크놀리지 | 다이싱 장치의 스핀들 위치 영점설정을 위한 조기 안전 경보 시스템 및 그 방법 |
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FR2311428A1 (fr) * | 1975-05-13 | 1976-12-10 | Sev Marchal | Machine electrique tournante ayant un dispositif porte-balais perfectionne |
AR220485A1 (es) * | 1980-08-12 | 1980-10-31 | Soroka E | Portacontacto electrico del tipo denominado portacarbones |
JPH0448134Y2 (ja) * | 1987-05-29 | 1992-11-12 | ||
GB9307761D0 (en) | 1993-04-15 | 1993-06-02 | Emhart Glass Mach Invest | Glassware forming machine |
JP2597808Y2 (ja) * | 1993-07-20 | 1999-07-19 | 株式会社ディスコ | エアースピンドル通電機構 |
US5631513A (en) * | 1995-03-20 | 1997-05-20 | Ametek, Inc. | Dynamoelectric brush holder clip and connector |
KR0135179Y1 (ko) * | 1995-05-02 | 1999-04-15 | 한순윤 | 카본 브러쉬 홀더 |
JP5313026B2 (ja) | 2009-04-17 | 2013-10-09 | 株式会社ディスコ | 切削装置 |
CN202042783U (zh) * | 2011-03-17 | 2011-11-16 | 浙江皇冠电动工具制造有限公司 | 一种碳刷的簧片与刷握连接结构改进 |
JP6059931B2 (ja) * | 2012-09-24 | 2017-01-11 | 株式会社ディスコ | 切削装置 |
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2017
- 2017-07-21 JP JP2017142119A patent/JP6975570B2/ja active Active
-
2018
- 2018-06-11 TW TW107119943A patent/TWI752235B/zh active
- 2018-07-05 KR KR1020180078102A patent/KR102526223B1/ko active IP Right Grant
- 2018-07-19 CN CN201810794674.1A patent/CN109278205B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11317382A (ja) * | 1998-05-06 | 1999-11-16 | Seiko Seiki Co Ltd | エアスピンドル用ブラシの取付構造 |
JP2012232357A (ja) * | 2011-04-28 | 2012-11-29 | Disco Corp | 電極ユニット |
KR101738418B1 (ko) * | 2017-03-30 | 2017-05-22 | 주식회사 삼흥테크놀리지 | 다이싱 장치의 스핀들 위치 영점설정을 위한 조기 안전 경보 시스템 및 그 방법 |
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Publication number | Publication date |
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CN109278205A (zh) | 2019-01-29 |
TWI752235B (zh) | 2022-01-11 |
KR20190010435A (ko) | 2019-01-30 |
CN109278205B (zh) | 2022-02-11 |
JP6975570B2 (ja) | 2021-12-01 |
TW201909260A (zh) | 2019-03-01 |
KR102526223B1 (ko) | 2023-04-26 |
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