JP6975570B2 - 切削装置、及び、電極端子ユニット - Google Patents
切削装置、及び、電極端子ユニット Download PDFInfo
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- JP6975570B2 JP6975570B2 JP2017142119A JP2017142119A JP6975570B2 JP 6975570 B2 JP6975570 B2 JP 6975570B2 JP 2017142119 A JP2017142119 A JP 2017142119A JP 2017142119 A JP2017142119 A JP 2017142119A JP 6975570 B2 JP6975570 B2 JP 6975570B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Description
また、該受け入れ部に挿入された該挿入部と該受け入れ部との摩擦力を該押圧ばねの付勢力よりも大きく設定しても良い。
また、該受け入れ部に挿入された該挿入部の該受け入れ部との摩擦力が、該押圧ばねの付勢力よりも大きく設定されても良い。
10 チャックテーブル(保持テーブル)
13 金属基台
20 切削手段
21 切削ブレード
22 スピンドル
23 スピンドルハウジング
26 サーボモータ
261 ステータ
262 ロータ
262A 端面(スピンドルの端面)
70 原点検出機構
71 キャップ(スピンドルハウジング)
71A 肉厚部
72 挿入孔
73 係止溝(受け入れ部)
74 電極端子
74A 当接面
76 導電性屈曲プレート
76A 係止部
76B 挿入部
77 把持部
78 ストッパー部
78A 折り返し部
78A1 山部
80,81 電極端子ユニット
95 原点検出回路
100 ウエーハ(被加工物)
Claims (6)
- 被加工物を保持する保持テーブルと、該保持テーブルで保持された被加工物を切削する切削ブレードと該切削ブレードが一端に装着されるスピンドルとを有した切削手段と、該切削ブレードと該保持テーブルとを接触させて電気的導通により該保持テーブルに対する該切削ブレードの切り込み方向の原点位置を検出する原点検出機構と、を備えた切削装置であって、
該原点検出機構は、
該スピンドルを回転可能に支持するハウジングに該スピンドルの他端側の端面に対向して挿入され、該端面に当接する当接面を有した電極端子と、
該電極端子と連結しかつ該電極端子を該端面に押圧する導電性材料からなる押圧ばねと、
該押圧ばねに連結され、該押圧ばねを係止する係止部と、該係止部と一体的に形成されるとともに該電極端子側に屈曲した挿入部とを有する導電性屈曲プレートと、を備え、
該ハウジングには、該電極端子が該押圧ばねを介して挿入される挿入孔が形成されるとともに該導電性屈曲プレートの該挿入部が挿入される受け入れ部が形成され、
該受け入れ部には、挿入された該導電性屈曲プレートを保持するとともに該ハウジングに取り付けられたストッパー部が形成され、
該導電性屈曲プレートの該挿入部を該ハウジングの該受け入れ部に挿入して、該ストッパー部が該挿入部を該受け入れ部内の壁面に押し付けることで該電極端子を該端面に当接した状態で固定する、切削装置。 - 該受け入れ部に挿入された該挿入部と該受け入れ部との摩擦力を該押圧ばねの付勢力よりも大きく設定する請求項1に記載の切削装置。
- 該導電性屈曲プレートには、作業者が把持する把持部が形成されている、請求項1又は請求項2に記載の切削装置。
- 該ストッパー部は導電性部材からなり、該導電性屈曲プレートの該挿入部が該受け入れ部に挿入されることで該原点検出機構による原点検出回路を構成する、請求項1又は請求項2に記載の切削装置。
- 被加工物を保持する保持テーブルと、該保持テーブルで保持された被加工物を切削する切削ブレードと該切削ブレードが一端に装着されるスピンドルとを有した切削手段と、該切削ブレードと該保持テーブルとを接触させて電気的導通により該保持テーブルに対する該切削ブレードの切り込み方向の原点位置を検出する原点検出機構と、を備えた切削装置において該原点検出機構を構成する電極端子ユニットであって、
該スピンドルを回転可能に支持するハウジングに該スピンドルの他端側の端面に対向して挿入され、該端面に当接する当接面を有した電極端子と、
該電極端子と連結しかつ該電極端子を該端面に押圧する導電性材料からなる押圧ばねと、
該押圧ばねに連結され、該電極端子と反対側で該押圧ばねを係止する係止部と、該係止部と一体的に形成されるとともに該電極端子側に屈曲した挿入部とを有する導電性屈曲プレートと、を備え、
該ハウジングに形成された受け入れ部に該挿入部が挿入され、該受け入れ部に配置されたストッパー部により該挿入部が該受け入れ部内の壁面に押し付けられることで該電極端子が該端面に当接した状態で固定される電極端子ユニット。 - 該受け入れ部に挿入された該挿入部の該受け入れ部との摩擦力が、該押圧ばねの付勢力よりも大きく設定されている請求項5に記載の電極端子ユニット。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2017142119A JP6975570B2 (ja) | 2017-07-21 | 2017-07-21 | 切削装置、及び、電極端子ユニット |
TW107119943A TWI752235B (zh) | 2017-07-21 | 2018-06-11 | 切削裝置及電極端子單元 |
KR1020180078102A KR102526223B1 (ko) | 2017-07-21 | 2018-07-05 | 절삭 장치, 및 전극 단자 유닛 |
CN201810794674.1A CN109278205B (zh) | 2017-07-21 | 2018-07-19 | 切削装置和电极端子组件 |
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JP2017142119A JP6975570B2 (ja) | 2017-07-21 | 2017-07-21 | 切削装置、及び、電極端子ユニット |
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JP2019018331A JP2019018331A (ja) | 2019-02-07 |
JP6975570B2 true JP6975570B2 (ja) | 2021-12-01 |
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KR (1) | KR102526223B1 (ja) |
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FR2311428A1 (fr) * | 1975-05-13 | 1976-12-10 | Sev Marchal | Machine electrique tournante ayant un dispositif porte-balais perfectionne |
AR220485A1 (es) * | 1980-08-12 | 1980-10-31 | Soroka E | Portacontacto electrico del tipo denominado portacarbones |
JPH0448134Y2 (ja) * | 1987-05-29 | 1992-11-12 | ||
GB9307761D0 (en) | 1993-04-15 | 1993-06-02 | Emhart Glass Mach Invest | Glassware forming machine |
JP2597808Y2 (ja) * | 1993-07-20 | 1999-07-19 | 株式会社ディスコ | エアースピンドル通電機構 |
US5631513A (en) * | 1995-03-20 | 1997-05-20 | Ametek, Inc. | Dynamoelectric brush holder clip and connector |
KR0135179Y1 (ko) * | 1995-05-02 | 1999-04-15 | 한순윤 | 카본 브러쉬 홀더 |
JPH11317382A (ja) * | 1998-05-06 | 1999-11-16 | Seiko Seiki Co Ltd | エアスピンドル用ブラシの取付構造 |
JP5313026B2 (ja) * | 2009-04-17 | 2013-10-09 | 株式会社ディスコ | 切削装置 |
CN202042783U (zh) * | 2011-03-17 | 2011-11-16 | 浙江皇冠电动工具制造有限公司 | 一种碳刷的簧片与刷握连接结构改进 |
JP5681038B2 (ja) * | 2011-04-28 | 2015-03-04 | 株式会社ディスコ | 電極ユニット |
JP6059931B2 (ja) * | 2012-09-24 | 2017-01-11 | 株式会社ディスコ | 切削装置 |
KR101738418B1 (ko) * | 2017-03-30 | 2017-05-22 | 주식회사 삼흥테크놀리지 | 다이싱 장치의 스핀들 위치 영점설정을 위한 조기 안전 경보 시스템 및 그 방법 |
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- 2018-06-11 TW TW107119943A patent/TWI752235B/zh active
- 2018-07-05 KR KR1020180078102A patent/KR102526223B1/ko active IP Right Grant
- 2018-07-19 CN CN201810794674.1A patent/CN109278205B/zh active Active
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Publication number | Publication date |
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CN109278205A (zh) | 2019-01-29 |
TW201909260A (zh) | 2019-03-01 |
KR20190010435A (ko) | 2019-01-30 |
CN109278205B (zh) | 2022-02-11 |
JP2019018331A (ja) | 2019-02-07 |
TWI752235B (zh) | 2022-01-11 |
KR102526223B1 (ko) | 2023-04-26 |
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