KR102492491B1 - 검사 장치 - Google Patents
검사 장치 Download PDFInfo
- Publication number
- KR102492491B1 KR102492491B1 KR1020207027249A KR20207027249A KR102492491B1 KR 102492491 B1 KR102492491 B1 KR 102492491B1 KR 1020207027249 A KR1020207027249 A KR 1020207027249A KR 20207027249 A KR20207027249 A KR 20207027249A KR 102492491 B1 KR102492491 B1 KR 102492491B1
- Authority
- KR
- South Korea
- Prior art keywords
- electronic device
- led
- refrigerant
- temperature
- inspected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2632—Circuits therefor for testing diodes
- G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2608—Circuits therefor for testing bipolar transistors
- G01R31/2619—Circuits therefor for testing bipolar transistors for measuring thermal properties thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2868—Complete testing stations; systems; procedures; software aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- H01L21/26—
-
- H01L21/683—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/10—Controlling the intensity of the light
- H05B45/18—Controlling the intensity of the light using temperature feedback
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
- H05B45/56—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits involving measures to prevent abnormal temperature of the LEDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Optics & Photonics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- High Energy & Nuclear Physics (AREA)
- Tests Of Electronic Circuits (AREA)
- Eye Examination Apparatus (AREA)
- Molding Of Porous Articles (AREA)
- Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2018-038843 | 2018-03-05 | ||
| JP2018038843A JP7161854B2 (ja) | 2018-03-05 | 2018-03-05 | 検査装置 |
| PCT/JP2019/005988 WO2019171932A1 (ja) | 2018-03-05 | 2019-02-19 | 検査装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20200123213A KR20200123213A (ko) | 2020-10-28 |
| KR102492491B1 true KR102492491B1 (ko) | 2023-01-30 |
Family
ID=67845653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020207027249A Active KR102492491B1 (ko) | 2018-03-05 | 2019-02-19 | 검사 장치 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11340283B2 (https=) |
| JP (1) | JP7161854B2 (https=) |
| KR (1) | KR102492491B1 (https=) |
| CN (1) | CN111788666B (https=) |
| DE (1) | DE112019001139B4 (https=) |
| TW (1) | TWI797267B (https=) |
| WO (1) | WO2019171932A1 (https=) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7161854B2 (ja) * | 2018-03-05 | 2022-10-27 | 東京エレクトロン株式会社 | 検査装置 |
| JP7153556B2 (ja) * | 2018-12-28 | 2022-10-14 | 東京エレクトロン株式会社 | 温度測定部材、検査装置及び温度測定方法 |
| JP7398935B2 (ja) * | 2019-11-25 | 2023-12-15 | 東京エレクトロン株式会社 | 載置台、及び、検査装置 |
| JP7365923B2 (ja) * | 2020-02-12 | 2023-10-20 | 東京エレクトロン株式会社 | 温度制御装置、温度制御方法、および検査装置 |
| JP7393986B2 (ja) * | 2020-03-17 | 2023-12-07 | 東京エレクトロン株式会社 | 載置台及び検査装置 |
| JP7433147B2 (ja) * | 2020-06-26 | 2024-02-19 | 東京エレクトロン株式会社 | 載置台及び検査装置 |
| JP7455015B2 (ja) * | 2020-07-14 | 2024-03-25 | 東京エレクトロン株式会社 | 検査装置 |
| JP7500312B2 (ja) * | 2020-07-16 | 2024-06-17 | 東京エレクトロン株式会社 | 検査装置及び検査装置の制御方法 |
| JP7568360B2 (ja) * | 2020-08-07 | 2024-10-16 | 東京エレクトロン株式会社 | 検査装置の制御方法及び検査装置 |
| JP7449814B2 (ja) * | 2020-08-12 | 2024-03-14 | 東京エレクトロン株式会社 | 検査方法及び検査装置 |
| JP7479266B2 (ja) * | 2020-09-25 | 2024-05-08 | 東京エレクトロン株式会社 | 検査装置の制御方法、及び、検査装置 |
| JP7474678B2 (ja) * | 2020-10-28 | 2024-04-25 | 東京エレクトロン株式会社 | 載置台、検査装置及び検査方法 |
| JP7680303B2 (ja) * | 2021-08-04 | 2025-05-20 | 株式会社ディスコ | チャックテーブル |
| TW202534335A (zh) | 2022-10-21 | 2025-09-01 | 新加坡商永科控股有限公司 | 用於獨立控制若干區域的熱能頭 |
| US11796589B1 (en) | 2022-10-21 | 2023-10-24 | AEM Holdings Ltd. | Thermal head for independent control of zones |
| US11828795B1 (en) | 2022-10-21 | 2023-11-28 | AEM Holdings Ltd. | Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones |
| US11828796B1 (en) | 2023-05-02 | 2023-11-28 | AEM Holdings Ltd. | Integrated heater and temperature measurement |
| US12013432B1 (en) | 2023-08-23 | 2024-06-18 | Aem Singapore Pte. Ltd. | Thermal control wafer with integrated heating-sensing elements |
| US12085609B1 (en) | 2023-08-23 | 2024-09-10 | Aem Singapore Pte. Ltd. | Thermal control wafer with integrated heating-sensing elements |
| US12000885B1 (en) | 2023-12-20 | 2024-06-04 | Aem Singapore Pte. Ltd. | Multiplexed thermal control wafer and coldplate |
| KR102901865B1 (ko) * | 2024-12-13 | 2025-12-18 | 청주대학교 산학협력단 | 넓은 에너지갭을 가지는 반도체용 고온 용량-전압(c-v) 및 누설전류 측정 시스템 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010014421A (ja) * | 2008-07-01 | 2010-01-21 | Nippon Eng Kk | バーンイン装置及びその制御方法 |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2649836B2 (ja) * | 1989-02-17 | 1997-09-03 | 東京エレクトロン株式会社 | 温調方法 |
| JPH10135315A (ja) | 1996-10-29 | 1998-05-22 | Tokyo Electron Ltd | 試料載置台の温度制御装置及び検査装置 |
| US6891627B1 (en) * | 2000-09-20 | 2005-05-10 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension and overlay of a specimen |
| US7364839B2 (en) * | 2002-07-24 | 2008-04-29 | Kabushiki Kaisha Toshiba | Method for forming a pattern and substrate-processing apparatus |
| JP2004134674A (ja) * | 2002-10-11 | 2004-04-30 | Toshiba Corp | 基板処理方法、加熱処理装置、パターン形成方法 |
| JP4659328B2 (ja) | 2002-10-21 | 2011-03-30 | 東京エレクトロン株式会社 | 被検査体を温度制御するプローブ装置 |
| TW200506375A (en) * | 2003-05-16 | 2005-02-16 | Tokyo Electron Ltd | Inspection apparatus |
| KR100543754B1 (ko) * | 2003-09-15 | 2006-01-23 | 현대모비스 주식회사 | 동력 조향장치의 조향변위 천이상태 판단방법 |
| JP2007003409A (ja) * | 2005-06-24 | 2007-01-11 | Ushio Inc | マイクロチップ検査装置 |
| JP2007040926A (ja) * | 2005-08-05 | 2007-02-15 | Tokyo Seimitsu Co Ltd | プローバ |
| JP4667158B2 (ja) * | 2005-08-09 | 2011-04-06 | パナソニック株式会社 | ウェーハレベルバーンイン方法 |
| JP5055756B2 (ja) * | 2005-09-21 | 2012-10-24 | 東京エレクトロン株式会社 | 熱処理装置及び記憶媒体 |
| JP4902986B2 (ja) * | 2005-12-01 | 2012-03-21 | 株式会社東京精密 | プローバ、及び、プローバのウェハステージ加熱、又は、冷却方法 |
| US20070164426A1 (en) * | 2006-01-18 | 2007-07-19 | International Business Machines Corporation | Apparatus and method for integrated circuit cooling during testing and image based analysis |
| JP2007315986A (ja) * | 2006-05-29 | 2007-12-06 | Sony Corp | 回路検査装置および回路検査方法 |
| JP2008060560A (ja) | 2006-08-04 | 2008-03-13 | Tokyo Electron Ltd | アニール装置およびアニール方法 |
| JP5138253B2 (ja) * | 2006-09-05 | 2013-02-06 | 東京エレクトロン株式会社 | アニール装置 |
| US8222574B2 (en) * | 2007-01-15 | 2012-07-17 | Applied Materials, Inc. | Temperature measurement and control of wafer support in thermal processing chamber |
| US7860379B2 (en) * | 2007-01-15 | 2010-12-28 | Applied Materials, Inc. | Temperature measurement and control of wafer support in thermal processing chamber |
| JP4949091B2 (ja) * | 2007-03-16 | 2012-06-06 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記録媒体 |
| JP4999615B2 (ja) * | 2007-08-31 | 2012-08-15 | 東京エレクトロン株式会社 | 検査装置及び検査方法 |
| JP5351479B2 (ja) * | 2008-01-28 | 2013-11-27 | 東京エレクトロン株式会社 | 加熱源の冷却構造 |
| US8404499B2 (en) * | 2009-04-20 | 2013-03-26 | Applied Materials, Inc. | LED substrate processing |
| CN102947922B (zh) * | 2010-06-23 | 2015-07-29 | 浜松光子学株式会社 | 使用吸附固浸透镜的吸附器的半导体器件的观察方法 |
| TWI454722B (zh) * | 2010-12-03 | 2014-10-01 | Lextar Electronics Corp | 檢測機台、檢測方法與檢測系統 |
| JP5982758B2 (ja) | 2011-02-23 | 2016-08-31 | 東京エレクトロン株式会社 | マイクロ波照射装置 |
| JP5732941B2 (ja) * | 2011-03-16 | 2015-06-10 | 東京エレクトロン株式会社 | プラズマエッチング装置及びプラズマエッチング方法 |
| MX344664B (es) | 2011-05-24 | 2017-01-04 | Deka Products Lp | Sistemas y metodos de tratamiento de la sangre. |
| JP5786487B2 (ja) * | 2011-06-22 | 2015-09-30 | 東京エレクトロン株式会社 | 熱処理装置及び熱処理方法 |
| KR101783079B1 (ko) * | 2011-08-26 | 2017-09-28 | 도쿄엘렉트론가부시키가이샤 | 액처리 장치 및 액처리 방법 |
| JP5536136B2 (ja) * | 2012-04-19 | 2014-07-02 | 株式会社九州日昌 | 恒温装置 |
| JP2013257189A (ja) * | 2012-06-12 | 2013-12-26 | Tokyo Electron Ltd | 温度測定装置及び処理装置 |
| US20140270731A1 (en) * | 2013-03-12 | 2014-09-18 | Applied Materials, Inc. | Thermal management apparatus for solid state light source arrays |
| JP2015056624A (ja) | 2013-09-13 | 2015-03-23 | 東京エレクトロン株式会社 | 基板温調装置およびそれを用いた基板処理装置 |
| TWI615503B (zh) * | 2013-11-26 | 2018-02-21 | Applied Materials, Inc. | 用於減少快速熱處理的污染之影響的設備 |
| JP6452449B2 (ja) * | 2015-01-06 | 2019-01-16 | 東京エレクトロン株式会社 | 載置台及び基板処理装置 |
| US9728430B2 (en) | 2015-06-29 | 2017-08-08 | Varian Semiconductor Equipment Associates, Inc. | Electrostatic chuck with LED heating |
| JP6655996B2 (ja) * | 2016-01-19 | 2020-03-04 | 東京エレクトロン株式会社 | 基板温調装置及び基板処理装置 |
| US11221358B2 (en) * | 2017-03-21 | 2022-01-11 | Tokyo Electron Limited | Placement stand and electronic device inspecting apparatus |
| JP6955989B2 (ja) * | 2017-12-13 | 2021-10-27 | 東京エレクトロン株式会社 | 検査装置 |
| JP7161854B2 (ja) * | 2018-03-05 | 2022-10-27 | 東京エレクトロン株式会社 | 検査装置 |
| JP7361624B2 (ja) * | 2020-02-12 | 2023-10-16 | 東京エレクトロン株式会社 | 加熱源の寿命推定システム、寿命推定方法、および検査装置 |
| JP7365923B2 (ja) * | 2020-02-12 | 2023-10-20 | 東京エレクトロン株式会社 | 温度制御装置、温度制御方法、および検査装置 |
-
2018
- 2018-03-05 JP JP2018038843A patent/JP7161854B2/ja active Active
-
2019
- 2019-02-19 DE DE112019001139.1T patent/DE112019001139B4/de active Active
- 2019-02-19 WO PCT/JP2019/005988 patent/WO2019171932A1/ja not_active Ceased
- 2019-02-19 KR KR1020207027249A patent/KR102492491B1/ko active Active
- 2019-02-19 CN CN201980015484.8A patent/CN111788666B/zh active Active
- 2019-02-19 US US16/976,672 patent/US11340283B2/en active Active
- 2019-02-27 TW TW108106696A patent/TWI797267B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010014421A (ja) * | 2008-07-01 | 2010-01-21 | Nippon Eng Kk | バーンイン装置及びその制御方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112019001139B4 (de) | 2024-10-31 |
| DE112019001139T5 (de) | 2020-11-19 |
| WO2019171932A1 (ja) | 2019-09-12 |
| US11340283B2 (en) | 2022-05-24 |
| CN111788666A (zh) | 2020-10-16 |
| TW201942993A (zh) | 2019-11-01 |
| JP2019153717A (ja) | 2019-09-12 |
| JP7161854B2 (ja) | 2022-10-27 |
| US20200408828A1 (en) | 2020-12-31 |
| CN111788666B (zh) | 2024-03-15 |
| TWI797267B (zh) | 2023-04-01 |
| KR20200123213A (ko) | 2020-10-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102492491B1 (ko) | 검사 장치 | |
| US11385280B2 (en) | Inspection apparatus and temperature control meihod | |
| KR102212941B1 (ko) | 적재대 및 전자 디바이스 검사 장치 | |
| JP7266481B2 (ja) | 温度制御装置、温度制御方法、および検査装置 | |
| JP7304722B2 (ja) | 温度制御装置、温度制御方法、および検査装置 | |
| KR102517505B1 (ko) | 온도 제어 장치, 온도 제어 방법, 및 검사 장치 | |
| WO2018100881A1 (ja) | 載置台及び電子デバイス検査装置 | |
| TWI899148B (zh) | 加熱源之壽命推定系統、壽命推定方法、及電子元件檢查裝置 | |
| JP2016003965A (ja) | 湿度センサ検査装置 | |
| JP7724668B2 (ja) | 基板載置機構、検査装置、および検査方法 | |
| EP3882644B1 (en) | Substrate support, test device, and method of adjusting temperature of substrate support |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |