DE112019001139B4 - Testvorrichtung - Google Patents

Testvorrichtung Download PDF

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Publication number
DE112019001139B4
DE112019001139B4 DE112019001139.1T DE112019001139T DE112019001139B4 DE 112019001139 B4 DE112019001139 B4 DE 112019001139B4 DE 112019001139 T DE112019001139 T DE 112019001139T DE 112019001139 B4 DE112019001139 B4 DE 112019001139B4
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DE
Germany
Prior art keywords
electronic component
coolant
leds
temperature
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE112019001139.1T
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German (de)
English (en)
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DE112019001139T5 (de
Inventor
Shigeru Kasai
Masahito Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
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Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of DE112019001139T5 publication Critical patent/DE112019001139T5/de
Application granted granted Critical
Publication of DE112019001139B4 publication Critical patent/DE112019001139B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2632—Circuits therefor for testing diodes
    • G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2608—Circuits therefor for testing bipolar transistors
    • G01R31/2619—Circuits therefor for testing bipolar transistors for measuring thermal properties thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H05B45/18—Controlling the intensity of the light using temperature feedback
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
    • H05B45/56—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits involving measures to prevent abnormal temperature of the LEDs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Eye Examination Apparatus (AREA)
  • Molding Of Porous Articles (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
DE112019001139.1T 2018-03-05 2019-02-19 Testvorrichtung Active DE112019001139B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-038843 2018-03-05
JP2018038843A JP7161854B2 (ja) 2018-03-05 2018-03-05 検査装置
PCT/JP2019/005988 WO2019171932A1 (ja) 2018-03-05 2019-02-19 検査装置

Publications (2)

Publication Number Publication Date
DE112019001139T5 DE112019001139T5 (de) 2020-11-19
DE112019001139B4 true DE112019001139B4 (de) 2024-10-31

Family

ID=67845653

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112019001139.1T Active DE112019001139B4 (de) 2018-03-05 2019-02-19 Testvorrichtung

Country Status (7)

Country Link
US (1) US11340283B2 (https=)
JP (1) JP7161854B2 (https=)
KR (1) KR102492491B1 (https=)
CN (1) CN111788666B (https=)
DE (1) DE112019001139B4 (https=)
TW (1) TWI797267B (https=)
WO (1) WO2019171932A1 (https=)

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* Cited by examiner, † Cited by third party
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JP7161854B2 (ja) * 2018-03-05 2022-10-27 東京エレクトロン株式会社 検査装置
JP7153556B2 (ja) * 2018-12-28 2022-10-14 東京エレクトロン株式会社 温度測定部材、検査装置及び温度測定方法
JP7398935B2 (ja) * 2019-11-25 2023-12-15 東京エレクトロン株式会社 載置台、及び、検査装置
JP7365923B2 (ja) * 2020-02-12 2023-10-20 東京エレクトロン株式会社 温度制御装置、温度制御方法、および検査装置
JP7393986B2 (ja) * 2020-03-17 2023-12-07 東京エレクトロン株式会社 載置台及び検査装置
JP7433147B2 (ja) * 2020-06-26 2024-02-19 東京エレクトロン株式会社 載置台及び検査装置
JP7455015B2 (ja) * 2020-07-14 2024-03-25 東京エレクトロン株式会社 検査装置
JP7500312B2 (ja) * 2020-07-16 2024-06-17 東京エレクトロン株式会社 検査装置及び検査装置の制御方法
JP7568360B2 (ja) * 2020-08-07 2024-10-16 東京エレクトロン株式会社 検査装置の制御方法及び検査装置
JP7449814B2 (ja) * 2020-08-12 2024-03-14 東京エレクトロン株式会社 検査方法及び検査装置
JP7479266B2 (ja) * 2020-09-25 2024-05-08 東京エレクトロン株式会社 検査装置の制御方法、及び、検査装置
JP7474678B2 (ja) * 2020-10-28 2024-04-25 東京エレクトロン株式会社 載置台、検査装置及び検査方法
JP7680303B2 (ja) * 2021-08-04 2025-05-20 株式会社ディスコ チャックテーブル
TW202534335A (zh) 2022-10-21 2025-09-01 新加坡商永科控股有限公司 用於獨立控制若干區域的熱能頭
US11796589B1 (en) 2022-10-21 2023-10-24 AEM Holdings Ltd. Thermal head for independent control of zones
US11828795B1 (en) 2022-10-21 2023-11-28 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones
US11828796B1 (en) 2023-05-02 2023-11-28 AEM Holdings Ltd. Integrated heater and temperature measurement
US12013432B1 (en) 2023-08-23 2024-06-18 Aem Singapore Pte. Ltd. Thermal control wafer with integrated heating-sensing elements
US12085609B1 (en) 2023-08-23 2024-09-10 Aem Singapore Pte. Ltd. Thermal control wafer with integrated heating-sensing elements
US12000885B1 (en) 2023-12-20 2024-06-04 Aem Singapore Pte. Ltd. Multiplexed thermal control wafer and coldplate
KR102901865B1 (ko) * 2024-12-13 2025-12-18 청주대학교 산학협력단 넓은 에너지갭을 가지는 반도체용 고온 용량-전압(c-v) 및 누설전류 측정 시스템

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JP2008060560A (ja) 2006-08-04 2008-03-13 Tokyo Electron Ltd アニール装置およびアニール方法
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JPH10135315A (ja) 1996-10-29 1998-05-22 Tokyo Electron Ltd 試料載置台の温度制御装置及び検査装置
JP2008060560A (ja) 2006-08-04 2008-03-13 Tokyo Electron Ltd アニール装置およびアニール方法
JP2018038843A (ja) 2011-05-24 2018-03-15 デカ・プロダクツ・リミテッド・パートナーシップ 血液処置システムおよび方法
JP2015056624A (ja) 2013-09-13 2015-03-23 東京エレクトロン株式会社 基板温調装置およびそれを用いた基板処理装置

Also Published As

Publication number Publication date
KR102492491B1 (ko) 2023-01-30
DE112019001139T5 (de) 2020-11-19
WO2019171932A1 (ja) 2019-09-12
US11340283B2 (en) 2022-05-24
CN111788666A (zh) 2020-10-16
TW201942993A (zh) 2019-11-01
JP2019153717A (ja) 2019-09-12
JP7161854B2 (ja) 2022-10-27
US20200408828A1 (en) 2020-12-31
CN111788666B (zh) 2024-03-15
TWI797267B (zh) 2023-04-01
KR20200123213A (ko) 2020-10-28

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