KR102463845B1 - 접착력이 향상된 폴리아믹산 조성물 및 이를 포함하는 폴리이미드 필름 - Google Patents
접착력이 향상된 폴리아믹산 조성물 및 이를 포함하는 폴리이미드 필름 Download PDFInfo
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
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- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
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Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150185930A KR102463845B1 (ko) | 2015-12-24 | 2015-12-24 | 접착력이 향상된 폴리아믹산 조성물 및 이를 포함하는 폴리이미드 필름 |
CN201680075840.1A CN108473677B (zh) | 2015-12-24 | 2016-11-09 | 粘接力提高了的聚酰胺酸组合物及包含其的聚酰亚胺膜 |
JP2018533263A JP2019506478A (ja) | 2015-12-24 | 2016-11-09 | 接着力が向上したポリアミック酸組成物及びこれを含むポリイミドフィルム |
PCT/KR2016/012828 WO2017111299A1 (ko) | 2015-12-24 | 2016-11-09 | 접착력이 향상된 폴리아믹산 조성물 및 이를 포함하는 폴리이미드 필름 |
JP2021036799A JP7163437B2 (ja) | 2015-12-24 | 2021-03-09 | 接着力が向上したポリアミック酸組成物及びこれを含むポリイミドフィルム |
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KR1020150185930A KR102463845B1 (ko) | 2015-12-24 | 2015-12-24 | 접착력이 향상된 폴리아믹산 조성물 및 이를 포함하는 폴리이미드 필름 |
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KR20170076096A KR20170076096A (ko) | 2017-07-04 |
KR102463845B1 true KR102463845B1 (ko) | 2022-11-04 |
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KR1020150185930A KR102463845B1 (ko) | 2015-12-24 | 2015-12-24 | 접착력이 향상된 폴리아믹산 조성물 및 이를 포함하는 폴리이미드 필름 |
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JP (2) | JP2019506478A (zh) |
KR (1) | KR102463845B1 (zh) |
CN (1) | CN108473677B (zh) |
WO (1) | WO2017111299A1 (zh) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6900152B2 (ja) * | 2016-04-07 | 2021-07-07 | 株式会社カネカ | ガラス代替材料用のフィルム |
CN111212867A (zh) * | 2017-10-11 | 2020-05-29 | 株式会社钟化 | 聚酰亚胺树脂及其制造方法、聚酰亚胺溶液、以及聚酰亚胺薄膜及其制造方法 |
JP7039947B2 (ja) * | 2017-11-17 | 2022-03-23 | 大日本印刷株式会社 | ポリイミドフィルム、ポリイミド前駆体、ポリイミドフィルムの製造方法、及び表示装置用部材 |
KR102430152B1 (ko) * | 2017-12-08 | 2022-08-08 | 주식회사 두산 | 폴리아믹산 용액, 이를 이용한 투명 폴리이미드 수지 필름 및 투명 기판 |
WO2019142866A1 (ja) * | 2018-01-17 | 2019-07-25 | 旭化成株式会社 | ポリイミド前駆体樹脂組成物 |
KR102289812B1 (ko) * | 2018-08-20 | 2021-08-13 | 주식회사 엘지화학 | 폴리이미드 전구체 조성물, 이를 이용하여 제조된 폴리이미드 필름 및 플렉서블 디바이스 |
WO2020040495A1 (ko) * | 2018-08-20 | 2020-02-27 | 주식회사 엘지화학 | 폴리이미드 전구체 조성물, 그 제조 방법 및 이를 이용한 폴리이미드 필름 |
KR102264423B1 (ko) * | 2018-08-20 | 2021-06-14 | 주식회사 엘지화학 | 폴리이미드 전구체 조성물, 그 제조 방법 및 이를 이용한 폴리이미드 필름 |
KR102675752B1 (ko) * | 2018-09-04 | 2024-06-17 | 주식회사 동진쎄미켐 | 폴리아믹산-이미드 조성물 및 이로부터 형성된 폴리이미드 필름 |
KR101999926B1 (ko) * | 2018-10-11 | 2019-07-12 | 에스케이씨코오롱피아이 주식회사 | 접착력이 우수한 폴리이미드 수지를 제조하기 위한 폴리아믹산 조성물 및 이로부터 제조된 폴리이미드 수지 |
JP7298141B2 (ja) * | 2018-11-30 | 2023-06-27 | 株式会社リコー | 硬化型組成物、組成物収容容器、2次元又は3次元の像の形成方法及び形成装置、硬化物、構造体、並びに成形加工品 |
KR102551047B1 (ko) | 2019-02-01 | 2023-07-04 | 주식회사 엘지화학 | 폴리이미드 필름, 이를 이용한 플렉서블 기판 및 플렉서블 기판을 포함하는 플렉서블 디스플레이 |
KR102262507B1 (ko) * | 2019-02-14 | 2021-06-08 | 주식회사 엘지화학 | 폴리이미드 전구체 조성물 및 이를 이용하여 제조된 폴리이미드 필름 |
KR102097431B1 (ko) * | 2019-05-13 | 2020-04-07 | 에스케이씨코오롱피아이 주식회사 | 폴리이미드 및 이의 제조 방법 |
KR20210075610A (ko) * | 2019-12-13 | 2021-06-23 | 주식회사 두산 | 우수한 내후성을 갖는 폴리이미드 필름 |
CN111363354A (zh) * | 2020-03-27 | 2020-07-03 | 中天电子材料有限公司 | 聚酰亚胺无色透明薄膜及其制备方法、光学pi膜 |
CN116057109B (zh) * | 2020-09-10 | 2024-05-14 | 三菱瓦斯化学株式会社 | 聚合物组合物、清漆、和聚酰亚胺薄膜 |
KR20220072009A (ko) | 2020-11-23 | 2022-06-02 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102485698B1 (ko) * | 2021-02-05 | 2023-01-06 | 주식회사 두산 | 우수한 광학 특성을 갖는 폴리이미드 필름 |
KR102493648B1 (ko) * | 2021-03-04 | 2023-01-31 | 주식회사 두산 | 우수한 복원 특성을 갖는 폴리이미드 필름 |
KR20220144510A (ko) | 2021-04-20 | 2022-10-27 | 에스케이이노베이션 주식회사 | 신규한 디아자스피로 화합물 및 이의 용도 |
KR20220155722A (ko) | 2021-05-17 | 2022-11-24 | 에스케이이노베이션 주식회사 | 신규한 디아민 화합물, 이를 이용한 폴리이미드 전구체 및 폴리이미드 필름 및 이의 용도 |
KR102700133B1 (ko) * | 2021-12-22 | 2024-08-28 | 에스케이마이크로웍스 주식회사 | 필름, 다층전자장비 및 필름의 제조방법 |
KR102700132B1 (ko) * | 2021-12-22 | 2024-08-28 | 에스케이마이크로웍스 주식회사 | 다층전자장비, 필름 및 이의 제조방법 |
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JP2003073345A (ja) * | 2001-06-22 | 2003-03-12 | Mitsui Chemicals Inc | 新規な含フッ素ビスアミノフェノール類及びその製造方法 |
WO2015152178A1 (ja) * | 2014-03-31 | 2015-10-08 | 日産化学工業株式会社 | 樹脂薄膜の製造方法および樹脂薄膜形成用組成物 |
WO2016121691A1 (ja) | 2015-01-27 | 2016-08-04 | 東レ株式会社 | 樹脂、感光性樹脂組成物およびそれらを用いた電子部品、表示装置 |
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- 2016-11-09 JP JP2018533263A patent/JP2019506478A/ja active Pending
- 2016-11-09 CN CN201680075840.1A patent/CN108473677B/zh active Active
- 2016-11-09 WO PCT/KR2016/012828 patent/WO2017111299A1/ko active Application Filing
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Patent Citations (3)
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JP2003073345A (ja) * | 2001-06-22 | 2003-03-12 | Mitsui Chemicals Inc | 新規な含フッ素ビスアミノフェノール類及びその製造方法 |
WO2015152178A1 (ja) * | 2014-03-31 | 2015-10-08 | 日産化学工業株式会社 | 樹脂薄膜の製造方法および樹脂薄膜形成用組成物 |
WO2016121691A1 (ja) | 2015-01-27 | 2016-08-04 | 東レ株式会社 | 樹脂、感光性樹脂組成物およびそれらを用いた電子部品、表示装置 |
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CN108473677B (zh) | 2021-05-04 |
CN108473677A (zh) | 2018-08-31 |
JP7163437B2 (ja) | 2022-10-31 |
JP2021102770A (ja) | 2021-07-15 |
KR20170076096A (ko) | 2017-07-04 |
JP2019506478A (ja) | 2019-03-07 |
WO2017111299A1 (ko) | 2017-06-29 |
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