KR102373908B1 - 에폭시 수지 조성물 및 반도체 장치 - Google Patents

에폭시 수지 조성물 및 반도체 장치 Download PDF

Info

Publication number
KR102373908B1
KR102373908B1 KR1020170106837A KR20170106837A KR102373908B1 KR 102373908 B1 KR102373908 B1 KR 102373908B1 KR 1020170106837 A KR1020170106837 A KR 1020170106837A KR 20170106837 A KR20170106837 A KR 20170106837A KR 102373908 B1 KR102373908 B1 KR 102373908B1
Authority
KR
South Korea
Prior art keywords
epoxy resin
resin composition
less
reaching
group
Prior art date
Application number
KR1020170106837A
Other languages
English (en)
Korean (ko)
Other versions
KR20180027336A (ko
Inventor
교헤이 나카키
가즈노부 세노오
Original Assignee
스미토모 베이클리트 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미토모 베이클리트 컴퍼니 리미티드 filed Critical 스미토모 베이클리트 컴퍼니 리미티드
Publication of KR20180027336A publication Critical patent/KR20180027336A/ko
Application granted granted Critical
Publication of KR102373908B1 publication Critical patent/KR102373908B1/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020170106837A 2016-09-05 2017-08-23 에폭시 수지 조성물 및 반도체 장치 KR102373908B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016172600 2016-09-05
JPJP-P-2016-172600 2016-09-05

Publications (2)

Publication Number Publication Date
KR20180027336A KR20180027336A (ko) 2018-03-14
KR102373908B1 true KR102373908B1 (ko) 2022-03-14

Family

ID=61531771

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170106837A KR102373908B1 (ko) 2016-09-05 2017-08-23 에폭시 수지 조성물 및 반도체 장치

Country Status (4)

Country Link
JP (1) JP6907773B2 (zh)
KR (1) KR102373908B1 (zh)
CN (1) CN107793553A (zh)
TW (1) TWI752996B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7145426B2 (ja) * 2018-05-25 2022-10-03 パナソニックＩｐマネジメント株式会社 電子部品補強用熱硬化性樹脂組成物、半導体装置及び半導体装置の製造方法
KR102181351B1 (ko) * 2019-03-07 2020-11-20 주식회사 케이씨씨 에폭시 수지 조성물
JP6954485B1 (ja) * 2021-02-17 2021-10-27 住友ベークライト株式会社 射出成形用封止樹脂組成物
WO2024024883A1 (ja) * 2022-07-29 2024-02-01 ナガセケムテックス株式会社 モールドアンダーフィル封止用シートおよびこれを用いる電子部品実装基板の封止方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003238659A (ja) 2002-02-22 2003-08-27 Toray Ind Inc エポキシ樹脂組成物およびエポキシ樹脂部材の製造方法
JP2008530321A (ja) 2005-02-18 2008-08-07 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン ラクトンを含有する低収縮アミン硬化エポキシ樹脂組成物
JP2015083634A (ja) 2013-10-25 2015-04-30 日立化成株式会社 エポキシ樹脂組成物、このエポキシ樹脂組成物を用いた電子部品装置及び電子部品装置の製造方法。
JP2016027133A (ja) 2014-06-30 2016-02-18 新日鉄住金化学株式会社 芳香族ポリエステル含有硬化性樹脂組成物、硬化物、電気・電子部品及び回路基板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61276861A (ja) * 1985-05-31 1986-12-06 Nippon Paint Co Ltd 金属素材用プライマ−組成物
JPH0195900A (ja) * 1987-10-07 1989-04-13 Takeda Chem Ind Ltd 打錠装置
JPH11158350A (ja) * 1997-09-24 1999-06-15 Hitachi Chem Co Ltd エポキシ樹脂組成物、これを用いたぺースト状組成物およびこれを用いて製造される半導体装置
JP5035548B2 (ja) * 2008-02-13 2012-09-26 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
TWI440647B (zh) * 2008-07-03 2014-06-11 Asahi Kasei Chemicals Corp 改質樹脂組成物、其製造方法及含該組成物之硬化性樹脂組成物
JP5708486B2 (ja) * 2009-06-03 2015-04-30 住友ベークライト株式会社 半導体封止用樹脂組成物及び半導体装置
JP2013032510A (ja) * 2011-06-29 2013-02-14 Toray Ind Inc エポキシ樹脂組成物、成形材料および繊維強化複合材料
CN105073822A (zh) * 2013-02-18 2015-11-18 株式会社大赛璐 环氧树脂组合物及其固化物、预浸料、以及纤维强化复合材料
JP6471745B2 (ja) * 2014-03-20 2019-02-20 日本ゼオン株式会社 感放射線樹脂組成物及び電子部品
KR102338614B1 (ko) * 2014-06-30 2021-12-13 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 방향족 폴리에스테르 함유 경화성 수지 조성물, 경화물, 전기·전자 부품 및 회로 기판
CN107200995A (zh) * 2016-03-16 2017-09-26 住友电木株式会社 环氧树脂组合物和半导体装置
JP6938869B2 (ja) * 2016-03-16 2021-09-22 住友ベークライト株式会社 エポキシ樹脂組成物および半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003238659A (ja) 2002-02-22 2003-08-27 Toray Ind Inc エポキシ樹脂組成物およびエポキシ樹脂部材の製造方法
JP2008530321A (ja) 2005-02-18 2008-08-07 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン ラクトンを含有する低収縮アミン硬化エポキシ樹脂組成物
JP2015083634A (ja) 2013-10-25 2015-04-30 日立化成株式会社 エポキシ樹脂組成物、このエポキシ樹脂組成物を用いた電子部品装置及び電子部品装置の製造方法。
JP2016027133A (ja) 2014-06-30 2016-02-18 新日鉄住金化学株式会社 芳香族ポリエステル含有硬化性樹脂組成物、硬化物、電気・電子部品及び回路基板

Also Published As

Publication number Publication date
KR20180027336A (ko) 2018-03-14
JP6907773B2 (ja) 2021-07-21
TWI752996B (zh) 2022-01-21
TW201821526A (zh) 2018-06-16
CN107793553A (zh) 2018-03-13
JP2018039981A (ja) 2018-03-15

Similar Documents

Publication Publication Date Title
KR102373908B1 (ko) 에폭시 수지 조성물 및 반도체 장치
US20050075474A1 (en) Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device
KR20140009185A (ko) 밀봉용 수지 조성물 및 전자 부품 장치
TWI829708B (zh) 硬化性樹脂組成物及電子零件裝置
JPWO2015005275A1 (ja) 半導体装置の製造方法および半導体装置
KR20120040183A (ko) 반도체 밀봉용 수지 조성물, 및 반도체 장치
JP2023105016A (ja) ボールグリッドアレイパッケージ封止用エポキシ樹脂組成物、エポキシ樹脂硬化物及び電子部品装置
KR101522436B1 (ko) 반도체 봉지용 수지 조성물 및 이것을 이용한 반도체 장치
JP2023068032A (ja) 硬化性樹脂組成物用添加剤、硬化性樹脂組成物及び電子部品装置
JP5386836B2 (ja) 半導体封止用樹脂組成物及び半導体装置
JP6938869B2 (ja) エポキシ樹脂組成物および半導体装置
JP7484081B2 (ja) 硬化性樹脂組成物及び電子部品装置
JP7269579B2 (ja) エポキシ樹脂組成物及び電子部品装置
CN114599729A (zh) 环氧树脂组合物、电子零件装置、及电子零件装置的制造方法
JP7322368B2 (ja) 硬化性樹脂組成物及び電子部品装置
JP2012246472A (ja) 封止用樹脂組成物及び電子部品装置
CN111094450A (zh) 环氧树脂组合物和电子部件装置
JP7119823B2 (ja) 封止用エポキシ樹脂組成物及び電子部品装置
JP6705487B2 (ja) モールドアンダーフィル用樹脂組成物及び電子部品装置
KR102127589B1 (ko) 에폭시 수지 조성물 및 전자 부품 장치
JP5316282B2 (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JP6686428B2 (ja) エポキシ樹脂組成物および半導体装置
JP6708242B2 (ja) モールドアンダーフィル用樹脂組成物及び電子部品装置
CN107200995A (zh) 环氧树脂组合物和半导体装置
WO2020171004A1 (ja) 硬化性樹脂組成物及び電子部品装置

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant