KR102213034B1 - 임베디드 다이 기판 및 임베디드 다이 기판을 제조하는 방법 - Google Patents

임베디드 다이 기판 및 임베디드 다이 기판을 제조하는 방법 Download PDF

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KR102213034B1
KR102213034B1 KR1020187029732A KR20187029732A KR102213034B1 KR 102213034 B1 KR102213034 B1 KR 102213034B1 KR 1020187029732 A KR1020187029732 A KR 1020187029732A KR 20187029732 A KR20187029732 A KR 20187029732A KR 102213034 B1 KR102213034 B1 KR 102213034B1
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die
layer
substrate
conductive
dielectric layer
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KR20180124932A (ko
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대익 김
지에 푸
창한 윤
진관 김
마누엘 올드릿
쳉지에 주오
마리오 벨레즈
종해 김
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퀄컴 인코포레이티드
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020187029732A 2016-03-18 2017-03-16 임베디드 다이 기판 및 임베디드 다이 기판을 제조하는 방법 Active KR102213034B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/074,750 US10325855B2 (en) 2016-03-18 2016-03-18 Backside drill embedded die substrate
US15/074,750 2016-03-18
PCT/US2017/022829 WO2017161199A1 (en) 2016-03-18 2017-03-16 Backside drill embedded die substrate

Publications (2)

Publication Number Publication Date
KR20180124932A KR20180124932A (ko) 2018-11-21
KR102213034B1 true KR102213034B1 (ko) 2021-02-04

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Country Link
US (1) US10325855B2 (enExample)
EP (1) EP3430644B1 (enExample)
JP (1) JP6679748B2 (enExample)
KR (1) KR102213034B1 (enExample)
CN (1) CN109075154B (enExample)
BR (1) BR112018068970B1 (enExample)
ES (1) ES2821728T3 (enExample)
TW (1) TWI692048B (enExample)
WO (1) WO2017161199A1 (enExample)

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Publication number Priority date Publication date Assignee Title
US10373893B2 (en) * 2017-06-30 2019-08-06 Intel Corporation Embedded bridge with through-silicon vias
US10504865B2 (en) * 2017-09-28 2019-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Package structure and method of manufacturing the same
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