TWI692048B - 背側鑽孔嵌入晶粒式基板 - Google Patents

背側鑽孔嵌入晶粒式基板 Download PDF

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TWI692048B
TWI692048B TW106108653A TW106108653A TWI692048B TW I692048 B TWI692048 B TW I692048B TW 106108653 A TW106108653 A TW 106108653A TW 106108653 A TW106108653 A TW 106108653A TW I692048 B TWI692048 B TW I692048B
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die
layer
substrate
conductive
dielectric layer
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TW106108653A
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English (en)
Chinese (zh)
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TW201737394A (zh
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金大益
符杰
章韓 尹
金鎮寛
曼紐 阿爾德雷特
左承杰
馬利歐 維雷茲
鐘海 金
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美商高通公司
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
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    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW106108653A 2016-03-18 2017-03-16 背側鑽孔嵌入晶粒式基板 TWI692048B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/074,750 2016-03-18
US15/074,750 US10325855B2 (en) 2016-03-18 2016-03-18 Backside drill embedded die substrate

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TW201737394A TW201737394A (zh) 2017-10-16
TWI692048B true TWI692048B (zh) 2020-04-21

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US (1) US10325855B2 (enExample)
EP (1) EP3430644B1 (enExample)
JP (1) JP6679748B2 (enExample)
KR (1) KR102213034B1 (enExample)
CN (1) CN109075154B (enExample)
BR (1) BR112018068970B1 (enExample)
ES (1) ES2821728T3 (enExample)
TW (1) TWI692048B (enExample)
WO (1) WO2017161199A1 (enExample)

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US10504865B2 (en) * 2017-09-28 2019-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Package structure and method of manufacturing the same
EP3688798A4 (en) * 2017-09-29 2021-05-19 INTEL Corporation SEMI-CONDUCTOR ENCLOSURE WITH EMBEDDED CONNECTIONS
EP3732719A4 (en) * 2017-12-29 2021-11-17 Intel Corporation MICROELECTRONIC ARRANGEMENTS
TWI733056B (zh) * 2018-09-19 2021-07-11 矽品精密工業股份有限公司 電子封裝件及其製法
US11342243B2 (en) * 2018-09-25 2022-05-24 Intel Corporation Thermal management solutions for embedded integrated circuit devices
US11322428B2 (en) * 2019-12-02 2022-05-03 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same
KR102762887B1 (ko) * 2019-12-10 2025-02-07 삼성전기주식회사 전자부품 내장기판
US11289404B2 (en) 2020-01-17 2022-03-29 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method
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KR20180124932A (ko) 2018-11-21
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US20170271266A1 (en) 2017-09-21
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