KR102134500B1 - 땜납 코팅 부품, 그의 제조 방법 및 그의 실장 방법 - Google Patents

땜납 코팅 부품, 그의 제조 방법 및 그의 실장 방법 Download PDF

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Publication number
KR102134500B1
KR102134500B1 KR1020167023297A KR20167023297A KR102134500B1 KR 102134500 B1 KR102134500 B1 KR 102134500B1 KR 1020167023297 A KR1020167023297 A KR 1020167023297A KR 20167023297 A KR20167023297 A KR 20167023297A KR 102134500 B1 KR102134500 B1 KR 102134500B1
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South Korea
Prior art keywords
solder
frame member
metal member
treatment
film
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KR1020167023297A
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English (en)
Korean (ko)
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KR20160105913A (ko
Inventor
이사무 사또
고지 와따나베
미찌오 스즈끼
다께노리 아즈마
무쯔미 데구찌
마사야 이또
Original Assignee
센주긴조쿠고교 가부시키가이샤
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Publication of KR20160105913A publication Critical patent/KR20160105913A/ko
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Publication of KR102134500B1 publication Critical patent/KR102134500B1/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
KR1020167023297A 2009-05-22 2010-05-19 땜납 코팅 부품, 그의 제조 방법 및 그의 실장 방법 Active KR102134500B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009124716A JP5439950B2 (ja) 2009-05-22 2009-05-22 はんだコート部品、その製造方法及びその実装方法
JPJP-P-2009-124716 2009-05-22
PCT/JP2010/058466 WO2010134552A1 (ja) 2009-05-22 2010-05-19 はんだコート部品、その製造方法及びその実装方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020117027704A Division KR101970831B1 (ko) 2009-05-22 2010-05-19 땜납 코팅 부품, 그의 제조 방법 및 그의 실장 방법

Publications (2)

Publication Number Publication Date
KR20160105913A KR20160105913A (ko) 2016-09-07
KR102134500B1 true KR102134500B1 (ko) 2020-07-15

Family

ID=43126229

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020167023297A Active KR102134500B1 (ko) 2009-05-22 2010-05-19 땜납 코팅 부품, 그의 제조 방법 및 그의 실장 방법
KR1020117027704A Active KR101970831B1 (ko) 2009-05-22 2010-05-19 땜납 코팅 부품, 그의 제조 방법 및 그의 실장 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020117027704A Active KR101970831B1 (ko) 2009-05-22 2010-05-19 땜납 코팅 부품, 그의 제조 방법 및 그의 실장 방법

Country Status (5)

Country Link
JP (1) JP5439950B2 (enExample)
KR (2) KR102134500B1 (enExample)
CN (1) CN102440091B (enExample)
TW (1) TWI524964B (enExample)
WO (1) WO2010134552A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101029221B1 (ko) * 2011-01-14 2011-04-14 에프엔티주식회사 부분 도금층이 마련된 전자파 차단용 쉴드캔 고정클립
US9391029B2 (en) 2014-06-12 2016-07-12 Kabushiki Kaisha Toshiba Electronic device
DE102014110459A1 (de) * 2014-07-24 2016-01-28 Mahle International Gmbh Wärmeübertrager
KR102311677B1 (ko) 2014-08-13 2021-10-12 삼성전자주식회사 반도체소자 및 그 제조방법
EP3737216A1 (en) * 2015-09-18 2020-11-11 Toray Industries, Inc. Electronic device housing
KR102717102B1 (ko) 2016-09-06 2024-10-16 삼성디스플레이 주식회사 디스플레이 장치
CN109079270A (zh) * 2018-10-26 2018-12-25 南通舟舰钣金有限公司 一种锡焊方法
JP6871524B1 (ja) * 2020-03-23 2021-05-12 千住金属工業株式会社 積層接合材料、半導体パッケージおよびパワーモジュール
US11744019B2 (en) * 2020-11-18 2023-08-29 Murata Manufacturing Co., Ltd. Component mounted on circuit board
JP7549276B2 (ja) * 2021-04-28 2024-09-11 千住金属工業株式会社 積層接合材料、半導体パッケージおよびパワーモジュール
CN113205957B (zh) * 2021-05-26 2023-01-10 厦门匠锐科技有限公司 一种骨架线圈的生产线
CN115643738A (zh) * 2021-07-19 2023-01-24 台达电子企业管理（上海）有限公司 功率模块和固态变压器系统
CN115642773A (zh) 2021-07-19 2023-01-24 台达电子企业管理（上海）有限公司 电路模块和固态变压器系统

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004186502A (ja) * 2002-12-04 2004-07-02 Murata Mfg Co Ltd 電子部品、電子部品の実装構造及び電子部品の製造方法

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JPH01289298A (ja) * 1988-05-17 1989-11-21 Alps Electric Co Ltd シールドケースの製造方法
JPH03104197A (ja) * 1989-09-18 1991-05-01 Canon Inc シールドケース
JPH0563100U (ja) * 1992-01-30 1993-08-20 京セラ株式会社 シールドケース付電子部品
JPH07147495A (ja) * 1993-11-26 1995-06-06 Nec Corp プリント基板表面実装用シールドケース
JPH10117062A (ja) * 1996-08-19 1998-05-06 Sony Corp リード部品及び高周波信号が漏洩するのを防ぐシールドケースのプリント基板への取付け方法並びに取付け装置、チップ部品、リード部品及び高周波信号が漏洩するのを防ぐシールドケースのプリント基板への取付け方法並びに取付け装置
US5911356A (en) * 1996-08-19 1999-06-15 Sony Corporation Method for attaching lead parts and shield case to printed circuit board, and method for attaching chip parts, lead parts and shield case to printed circuit board
JP2001007588A (ja) * 1999-06-21 2001-01-12 Alps Electric Co Ltd 電子回路ユニット
JP2001155955A (ja) * 1999-11-30 2001-06-08 Taiyo Kagaku Kogyo Kk 外部端子電極具備電子部品及びその搭載電子用品
JP2001217588A (ja) * 2000-01-31 2001-08-10 Sharp Corp シールドケース及びそれを用いたｒｆ通信ユニット
JP3657874B2 (ja) * 2000-10-30 2005-06-08 株式会社ルネサステクノロジ 半導体装置および電子機器
JP4685274B2 (ja) * 2001-05-31 2011-05-18 京セラキンセキ株式会社 電子部品容器
JPWO2004070836A1 (ja) * 2003-02-06 2006-06-01 株式会社Ｎｅｏｍａｘマテリアル 気密封止用キャップおよびその製造方法
DE602005021129D1 (de) * 2004-09-27 2010-06-17 Murata Manufacturing Co Abschirmhülle
JP2006196664A (ja) 2005-01-13 2006-07-27 Fuji Photo Film Co Ltd 基板へのシールドケース取付構造及び携帯電話

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JP2004186502A (ja) * 2002-12-04 2004-07-02 Murata Mfg Co Ltd 電子部品、電子部品の実装構造及び電子部品の製造方法

Also Published As

Publication number Publication date
CN102440091A (zh) 2012-05-02
JP2010272774A (ja) 2010-12-02
JP5439950B2 (ja) 2014-03-12
KR20160105913A (ko) 2016-09-07
TW201102208A (en) 2011-01-16
TWI524964B (zh) 2016-03-11
KR20120023002A (ko) 2012-03-12
WO2010134552A1 (ja) 2010-11-25
CN102440091B (zh) 2014-09-03
KR101970831B1 (ko) 2019-08-27

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