TWI524964B - A solder coating member, a method for manufacturing the same, and a method of mounting the same - Google Patents
A solder coating member, a method for manufacturing the same, and a method of mounting the same Download PDFInfo
- Publication number
- TWI524964B TWI524964B TW099116264A TW99116264A TWI524964B TW I524964 B TWI524964 B TW I524964B TW 099116264 A TW099116264 A TW 099116264A TW 99116264 A TW99116264 A TW 99116264A TW I524964 B TWI524964 B TW I524964B
- Authority
- TW
- Taiwan
- Prior art keywords
- solder
- treatment
- substrate
- frame member
- nickel
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 252
- 238000000034 method Methods 0.000 title claims description 70
- 238000000576 coating method Methods 0.000 title claims description 61
- 239000011248 coating agent Substances 0.000 title claims description 58
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000000463 material Substances 0.000 claims description 129
- 238000007747 plating Methods 0.000 claims description 116
- 239000000758 substrate Substances 0.000 claims description 105
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 76
- 239000002184 metal Substances 0.000 claims description 59
- 229910052751 metal Inorganic materials 0.000 claims description 59
- 229910020888 Sn-Cu Inorganic materials 0.000 claims description 30
- 229910019204 Sn—Cu Inorganic materials 0.000 claims description 30
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 27
- 229910052759 nickel Inorganic materials 0.000 claims description 26
- 238000004381 surface treatment Methods 0.000 claims description 25
- 238000012545 processing Methods 0.000 claims description 21
- 230000003014 reinforcing effect Effects 0.000 claims description 19
- 229910017944 Ag—Cu Inorganic materials 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 15
- 229910020836 Sn-Ag Inorganic materials 0.000 claims description 14
- 229910020988 Sn—Ag Inorganic materials 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 14
- 229910016331 Bi—Ag Inorganic materials 0.000 claims description 10
- 229910002482 Cu–Ni Inorganic materials 0.000 claims description 10
- 229910017932 Cu—Sb Inorganic materials 0.000 claims description 10
- 229910020830 Sn-Bi Inorganic materials 0.000 claims description 10
- 229910018728 Sn—Bi Inorganic materials 0.000 claims description 10
- 230000002787 reinforcement Effects 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 88
- 239000010956 nickel silver Substances 0.000 description 88
- 239000010410 layer Substances 0.000 description 53
- 238000009736 wetting Methods 0.000 description 22
- 238000003466 welding Methods 0.000 description 19
- 238000005238 degreasing Methods 0.000 description 16
- 238000005452 bending Methods 0.000 description 15
- 239000011247 coating layer Substances 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 238000007654 immersion Methods 0.000 description 9
- 229910001220 stainless steel Inorganic materials 0.000 description 9
- 239000010935 stainless steel Substances 0.000 description 9
- 239000002335 surface treatment layer Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 230000002265 prevention Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052797 bismuth Inorganic materials 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000009194 climbing Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 210000001161 mammalian embryo Anatomy 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 241001503987 Clematis vitalba Species 0.000 description 1
- 240000004282 Grewia occidentalis Species 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910007567 Zn-Ni Inorganic materials 0.000 description 1
- 229910007614 Zn—Ni Inorganic materials 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 210000002257 embryonic structure Anatomy 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- AICMYQIGFPHNCY-UHFFFAOYSA-J methanesulfonate;tin(4+) Chemical compound [Sn+4].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O AICMYQIGFPHNCY-UHFFFAOYSA-J 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007447 staining method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
- B23K35/0238—Sheets, foils layered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009124716A JP5439950B2 (ja) | 2009-05-22 | 2009-05-22 | はんだコート部品、その製造方法及びその実装方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201102208A TW201102208A (en) | 2011-01-16 |
| TWI524964B true TWI524964B (zh) | 2016-03-11 |
Family
ID=43126229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099116264A TWI524964B (zh) | 2009-05-22 | 2010-05-21 | A solder coating member, a method for manufacturing the same, and a method of mounting the same |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5439950B2 (enExample) |
| KR (2) | KR102134500B1 (enExample) |
| CN (1) | CN102440091B (enExample) |
| TW (1) | TWI524964B (enExample) |
| WO (1) | WO2010134552A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101029221B1 (ko) * | 2011-01-14 | 2011-04-14 | 에프엔티주식회사 | 부분 도금층이 마련된 전자파 차단용 쉴드캔 고정클립 |
| US9391029B2 (en) | 2014-06-12 | 2016-07-12 | Kabushiki Kaisha Toshiba | Electronic device |
| DE102014110459A1 (de) * | 2014-07-24 | 2016-01-28 | Mahle International Gmbh | Wärmeübertrager |
| KR102311677B1 (ko) | 2014-08-13 | 2021-10-12 | 삼성전자주식회사 | 반도체소자 및 그 제조방법 |
| EP3737216A1 (en) * | 2015-09-18 | 2020-11-11 | Toray Industries, Inc. | Electronic device housing |
| KR102717102B1 (ko) | 2016-09-06 | 2024-10-16 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| CN109079270A (zh) * | 2018-10-26 | 2018-12-25 | 南通舟舰钣金有限公司 | 一种锡焊方法 |
| JP6871524B1 (ja) * | 2020-03-23 | 2021-05-12 | 千住金属工業株式会社 | 積層接合材料、半導体パッケージおよびパワーモジュール |
| US11744019B2 (en) * | 2020-11-18 | 2023-08-29 | Murata Manufacturing Co., Ltd. | Component mounted on circuit board |
| JP7549276B2 (ja) * | 2021-04-28 | 2024-09-11 | 千住金属工業株式会社 | 積層接合材料、半導体パッケージおよびパワーモジュール |
| CN113205957B (zh) * | 2021-05-26 | 2023-01-10 | 厦门匠锐科技有限公司 | 一种骨架线圈的生产线 |
| CN115643738A (zh) * | 2021-07-19 | 2023-01-24 | 台达电子企业管理（上海）有限公司 | 功率模块和固态变压器系统 |
| CN115642773A (zh) | 2021-07-19 | 2023-01-24 | 台达电子企业管理（上海）有限公司 | 电路模块和固态变压器系统 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01289298A (ja) * | 1988-05-17 | 1989-11-21 | Alps Electric Co Ltd | シールドケースの製造方法 |
| JPH03104197A (ja) * | 1989-09-18 | 1991-05-01 | Canon Inc | シールドケース |
| JPH0563100U (ja) * | 1992-01-30 | 1993-08-20 | 京セラ株式会社 | シールドケース付電子部品 |
| JPH07147495A (ja) * | 1993-11-26 | 1995-06-06 | Nec Corp | プリント基板表面実装用シールドケース |
| JPH10117062A (ja) * | 1996-08-19 | 1998-05-06 | Sony Corp | リード部品及び高周波信号が漏洩するのを防ぐシールドケースのプリント基板への取付け方法並びに取付け装置、チップ部品、リード部品及び高周波信号が漏洩するのを防ぐシールドケースのプリント基板への取付け方法並びに取付け装置 |
| US5911356A (en) * | 1996-08-19 | 1999-06-15 | Sony Corporation | Method for attaching lead parts and shield case to printed circuit board, and method for attaching chip parts, lead parts and shield case to printed circuit board |
| JP2001007588A (ja) * | 1999-06-21 | 2001-01-12 | Alps Electric Co Ltd | 電子回路ユニット |
| JP2001155955A (ja) * | 1999-11-30 | 2001-06-08 | Taiyo Kagaku Kogyo Kk | 外部端子電極具備電子部品及びその搭載電子用品 |
| JP2001217588A (ja) * | 2000-01-31 | 2001-08-10 | Sharp Corp | シールドケース及びそれを用いたｒｆ通信ユニット |
| JP3657874B2 (ja) * | 2000-10-30 | 2005-06-08 | 株式会社ルネサステクノロジ | 半導体装置および電子機器 |
| JP4685274B2 (ja) * | 2001-05-31 | 2011-05-18 | 京セラキンセキ株式会社 | 電子部品容器 |
| JP4222015B2 (ja) * | 2002-12-04 | 2009-02-12 | 株式会社村田製作所 | 電子部品の製造方法 |
| JPWO2004070836A1 (ja) * | 2003-02-06 | 2006-06-01 | 株式会社Ｎｅｏｍａｘマテリアル | 気密封止用キャップおよびその製造方法 |
| DE602005021129D1 (de) * | 2004-09-27 | 2010-06-17 | Murata Manufacturing Co | Abschirmhülle |
| JP2006196664A (ja) | 2005-01-13 | 2006-07-27 | Fuji Photo Film Co Ltd | 基板へのシールドケース取付構造及び携帯電話 |
-
2009
- 2009-05-22 JP JP2009124716A patent/JP5439950B2/ja active Active
-
2010
- 2010-05-19 KR KR1020167023297A patent/KR102134500B1/ko active Active
- 2010-05-19 WO PCT/JP2010/058466 patent/WO2010134552A1/ja not_active Ceased
- 2010-05-19 CN CN201080022520.2A patent/CN102440091B/zh active Active
- 2010-05-19 KR KR1020117027704A patent/KR101970831B1/ko active Active
- 2010-05-21 TW TW099116264A patent/TWI524964B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| CN102440091A (zh) | 2012-05-02 |
| JP2010272774A (ja) | 2010-12-02 |
| JP5439950B2 (ja) | 2014-03-12 |
| KR20160105913A (ko) | 2016-09-07 |
| TW201102208A (en) | 2011-01-16 |
| KR20120023002A (ko) | 2012-03-12 |
| WO2010134552A1 (ja) | 2010-11-25 |
| CN102440091B (zh) | 2014-09-03 |
| KR102134500B1 (ko) | 2020-07-15 |
| KR101970831B1 (ko) | 2019-08-27 |
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