CN102440091B - 焊料涂布元件及其制造方法、安装方法 - Google Patents

焊料涂布元件及其制造方法、安装方法 Download PDF

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Publication number
CN102440091B
CN102440091B CN201080022520.2A CN201080022520A CN102440091B CN 102440091 B CN102440091 B CN 102440091B CN 201080022520 A CN201080022520 A CN 201080022520A CN 102440091 B CN102440091 B CN 102440091B
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CN
China
Prior art keywords
solder
frame member
type
treatment
metal member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201080022520.2A
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English (en)
Chinese (zh)
Other versions
CN102440091A (zh
Inventor
佐藤勇
渡边光司
铃木道雄
东刚宪
出口睦
伊东雅哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
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Senju Metal Industry Co Ltd
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Publication date
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Publication of CN102440091A publication Critical patent/CN102440091A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
CN201080022520.2A 2009-05-22 2010-05-19 焊料涂布元件及其制造方法、安装方法 Active CN102440091B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009124716A JP5439950B2 (ja) 2009-05-22 2009-05-22 はんだコート部品、その製造方法及びその実装方法
JP2009-124716 2009-05-22
PCT/JP2010/058466 WO2010134552A1 (ja) 2009-05-22 2010-05-19 はんだコート部品、その製造方法及びその実装方法

Publications (2)

Publication Number Publication Date
CN102440091A CN102440091A (zh) 2012-05-02
CN102440091B true CN102440091B (zh) 2014-09-03

Family

ID=43126229

Family Applications (1)

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CN201080022520.2A Active CN102440091B (zh) 2009-05-22 2010-05-19 焊料涂布元件及其制造方法、安装方法

Country Status (5)

Country Link
JP (1) JP5439950B2 (enExample)
KR (2) KR102134500B1 (enExample)
CN (1) CN102440091B (enExample)
TW (1) TWI524964B (enExample)
WO (1) WO2010134552A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101029221B1 (ko) * 2011-01-14 2011-04-14 에프엔티주식회사 부분 도금층이 마련된 전자파 차단용 쉴드캔 고정클립
US9391029B2 (en) 2014-06-12 2016-07-12 Kabushiki Kaisha Toshiba Electronic device
DE102014110459A1 (de) * 2014-07-24 2016-01-28 Mahle International Gmbh Wärmeübertrager
KR102311677B1 (ko) 2014-08-13 2021-10-12 삼성전자주식회사 반도체소자 및 그 제조방법
EP3737216A1 (en) * 2015-09-18 2020-11-11 Toray Industries, Inc. Electronic device housing
KR102717102B1 (ko) 2016-09-06 2024-10-16 삼성디스플레이 주식회사 디스플레이 장치
CN109079270A (zh) * 2018-10-26 2018-12-25 南通舟舰钣金有限公司 一种锡焊方法
JP6871524B1 (ja) * 2020-03-23 2021-05-12 千住金属工業株式会社 積層接合材料、半導体パッケージおよびパワーモジュール
US11744019B2 (en) * 2020-11-18 2023-08-29 Murata Manufacturing Co., Ltd. Component mounted on circuit board
JP7549276B2 (ja) * 2021-04-28 2024-09-11 千住金属工業株式会社 積層接合材料、半導体パッケージおよびパワーモジュール
CN113205957B (zh) * 2021-05-26 2023-01-10 厦门匠锐科技有限公司 一种骨架线圈的生产线
CN115643738A (zh) * 2021-07-19 2023-01-24 台达电子企业管理（上海）有限公司 功率模块和固态变压器系统
CN115642773A (zh) 2021-07-19 2023-01-24 台达电子企业管理（上海）有限公司 电路模块和固态变压器系统

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JP2001155955A (ja) * 1999-11-30 2001-06-08 Taiyo Kagaku Kogyo Kk 外部端子電極具備電子部品及びその搭載電子用品
JP2002141456A (ja) * 2000-10-30 2002-05-17 Hitachi Ltd 電子装置
JP2002359312A (ja) * 2001-05-31 2002-12-13 Kinseki Ltd 電子部品容器
JP2004156147A (ja) * 2004-03-04 2004-06-03 Kobe Steel Ltd 多極端子用錫又は錫合金めっき銅合金及びその製造方法
CN1166266C (zh) * 1996-08-19 2004-09-08 索尼公司 芯片件、引线件和屏蔽壳连到印刷电路板上的方法和设备
WO2006035542A1 (ja) * 2004-09-27 2006-04-06 Murata Manufacturing Co., Ltd. シールドケース

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JPH03104197A (ja) * 1989-09-18 1991-05-01 Canon Inc シールドケース
JPH0563100U (ja) * 1992-01-30 1993-08-20 京セラ株式会社 シールドケース付電子部品
JPH07147495A (ja) * 1993-11-26 1995-06-06 Nec Corp プリント基板表面実装用シールドケース
JPH10117062A (ja) * 1996-08-19 1998-05-06 Sony Corp リード部品及び高周波信号が漏洩するのを防ぐシールドケースのプリント基板への取付け方法並びに取付け装置、チップ部品、リード部品及び高周波信号が漏洩するのを防ぐシールドケースのプリント基板への取付け方法並びに取付け装置
JP2001007588A (ja) * 1999-06-21 2001-01-12 Alps Electric Co Ltd 電子回路ユニット
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JP4222015B2 (ja) * 2002-12-04 2009-02-12 株式会社村田製作所 電子部品の製造方法
JPWO2004070836A1 (ja) * 2003-02-06 2006-06-01 株式会社Ｎｅｏｍａｘマテリアル 気密封止用キャップおよびその製造方法
JP2006196664A (ja) 2005-01-13 2006-07-27 Fuji Photo Film Co Ltd 基板へのシールドケース取付構造及び携帯電話

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CN1166266C (zh) * 1996-08-19 2004-09-08 索尼公司 芯片件、引线件和屏蔽壳连到印刷电路板上的方法和设备
JP2001155955A (ja) * 1999-11-30 2001-06-08 Taiyo Kagaku Kogyo Kk 外部端子電極具備電子部品及びその搭載電子用品
JP2002141456A (ja) * 2000-10-30 2002-05-17 Hitachi Ltd 電子装置
JP2002359312A (ja) * 2001-05-31 2002-12-13 Kinseki Ltd 電子部品容器
JP2004156147A (ja) * 2004-03-04 2004-06-03 Kobe Steel Ltd 多極端子用錫又は錫合金めっき銅合金及びその製造方法
WO2006035542A1 (ja) * 2004-09-27 2006-04-06 Murata Manufacturing Co., Ltd. シールドケース

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JP实开平5-63100U 1993.08.20
JP特开2001-155955A 2001.06.08
JP特开2002-141456A 2002.05.17
JP特开2002-359312A 2002.12.13
JP特开2004-156147A 2004.06.03

Also Published As

Publication number Publication date
CN102440091A (zh) 2012-05-02
JP2010272774A (ja) 2010-12-02
JP5439950B2 (ja) 2014-03-12
KR20160105913A (ko) 2016-09-07
TW201102208A (en) 2011-01-16
TWI524964B (zh) 2016-03-11
KR20120023002A (ko) 2012-03-12
WO2010134552A1 (ja) 2010-11-25
KR102134500B1 (ko) 2020-07-15
KR101970831B1 (ko) 2019-08-27

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