DE602005021129D1 - Abschirmhülle - Google Patents

Abschirmhülle

Info

Publication number
DE602005021129D1
DE602005021129D1 DE602005021129T DE602005021129T DE602005021129D1 DE 602005021129 D1 DE602005021129 D1 DE 602005021129D1 DE 602005021129 T DE602005021129 T DE 602005021129T DE 602005021129 T DE602005021129 T DE 602005021129T DE 602005021129 D1 DE602005021129 D1 DE 602005021129D1
Authority
DE
Germany
Prior art keywords
circuit board
board surface
shield case
fixed
joining material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005021129T
Other languages
English (en)
Inventor
Wataru Kakinoki
Yukio Nakazawa
Kenji Hayashikoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of DE602005021129D1 publication Critical patent/DE602005021129D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Saccharide Compounds (AREA)
  • Cable Accessories (AREA)
  • Radiation Pyrometers (AREA)
  • Casings For Electric Apparatus (AREA)
DE602005021129T 2004-09-27 2005-07-21 Abschirmhülle Active DE602005021129D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004279752 2004-09-27
PCT/JP2005/013394 WO2006035542A1 (ja) 2004-09-27 2005-07-21 シールドケース

Publications (1)

Publication Number Publication Date
DE602005021129D1 true DE602005021129D1 (de) 2010-06-17

Family

ID=36118694

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005021129T Active DE602005021129D1 (de) 2004-09-27 2005-07-21 Abschirmhülle

Country Status (7)

Country Link
US (1) US7746666B2 (de)
EP (1) EP1796449B1 (de)
JP (1) JP4289395B2 (de)
CN (1) CN100508714C (de)
AT (1) ATE467339T1 (de)
DE (1) DE602005021129D1 (de)
WO (1) WO2006035542A1 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI322661B (en) * 2006-05-19 2010-03-21 Asustek Comp Inc Electromagnetic sheilding device and method of fabricating the same
JP2009088754A (ja) * 2007-09-28 2009-04-23 Sharp Corp 高周波モジュール及びそれを用いた通信装置
CN101646333B (zh) * 2008-08-08 2014-01-01 深圳富泰宏精密工业有限公司 屏蔽罩及应用该屏蔽罩的电子装置
TWI355881B (en) * 2008-10-13 2012-01-01 Askey Computer Corp Circuit board for communication product and manufa
JP5439950B2 (ja) * 2009-05-22 2014-03-12 千住金属工業株式会社 はんだコート部品、その製造方法及びその実装方法
JP2011054888A (ja) * 2009-09-04 2011-03-17 Kyocera Corp シールド構造体及び電子機器
JP5657234B2 (ja) * 2009-11-06 2015-01-21 レノボ・イノベーションズ・リミテッド（香港） シールド部材及び該シールド部材を備える電子機器
DE102009054517B4 (de) * 2009-12-10 2011-12-29 Robert Bosch Gmbh Elektronisches Steuergerät
CN102742377A (zh) * 2010-02-03 2012-10-17 卓英社有限公司 容易焊接的电磁波屏蔽用屏蔽壳体
JP5163701B2 (ja) * 2010-06-16 2013-03-13 Ｎｅｃアクセステクニカ株式会社 プリント基板へのシールドケース取付け構造およびシールドケース
JP2012049434A (ja) * 2010-08-30 2012-03-08 Sony Corp 電子部品、給電装置、受電装置、およびワイヤレス給電システム
KR101052559B1 (ko) * 2011-02-25 2011-07-29 김선기 전자파 차폐 및 보호용 실드케이스
JP5930599B2 (ja) * 2011-04-05 2016-06-08 富士機械製造株式会社 電子部品装着方法及び装着装置
US20130033843A1 (en) * 2011-08-03 2013-02-07 Laird Technologies, Inc. Board level electromagnetic interference (emi) shields including releasably attached/detachable pickup members
US8792246B2 (en) * 2011-08-29 2014-07-29 Fisher Controls International Llc Electromagnetic interference shield
US20140218851A1 (en) 2013-02-01 2014-08-07 Microsoft Corporation Shield Can
US9215833B2 (en) * 2013-03-15 2015-12-15 Apple Inc. Electronic device with heat dissipating electromagnetic interference shielding structures
KR20140142600A (ko) * 2013-06-04 2014-12-12 삼성전자주식회사 전자 기기의 보호 장치 및 그를 구비하는 전자 기기
KR102223618B1 (ko) * 2014-02-21 2021-03-05 삼성전자주식회사 쉴드캔 고정구조
KR102382008B1 (ko) * 2015-07-30 2022-04-04 삼성전자주식회사 쉴드 커버 및 그것을 포함하는 전자 장치
CN205124109U (zh) * 2015-09-29 2016-03-30 3M创新有限公司 弯曲电路板系统及柔性矩形金属栅栏
US10893636B2 (en) 2017-03-10 2021-01-12 Laird Technologies Inc. Method for forming a pickup area of a board level shield
US10653048B1 (en) 2018-11-21 2020-05-12 Laird Technologies, Inc. Frames for shielding assemblies and shielding assemblies including the same
US11083118B2 (en) 2019-01-09 2021-08-03 Laird Technologies, Inc. Frames for electromagnetic interference (EMI) shielding assemblies including detachable pickup members
DE112019007104T5 (de) * 2019-03-28 2021-12-09 Mitsubishi Electric Corporation Abschirmgehäuse
US11822395B2 (en) * 2021-07-30 2023-11-21 Dell Products L.P. Information handling system thermal and EMI enclosures

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4603215A (en) 1984-08-20 1986-07-29 Dow Corning Corporation Platinum (O) alkyne complexes
JPS6157593U (de) * 1984-09-19 1986-04-17
JPH01165697A (ja) 1987-12-22 1989-06-29 Daikin Ind Ltd 共沸溶剤組成物
JPH03104197A (ja) 1989-09-18 1991-05-01 Canon Inc シールドケース
JPH03104198A (ja) 1989-09-18 1991-05-01 Canon Inc 表面実装型シールドケース
JPH0653621A (ja) 1992-06-05 1994-02-25 Mitsui Toatsu Chem Inc 立体印刷基板、これを用いた電子回路パッケージ及び印刷基板の製造方法
JPH0613522A (ja) 1992-06-24 1994-01-21 Sony Corp 複数のリード部を有するｉｃ部品
MY108723A (en) 1992-08-28 1996-11-30 Thomson Consumer Electronics Inc Printed circuit board shield assembly for a tuner and the like
JP3104197B2 (ja) 1993-06-11 2000-10-30 ポーラ化成工業株式会社 補体レセプター発現量の測定法
JPH07147495A (ja) 1993-11-26 1995-06-06 Nec Corp プリント基板表面実装用シールドケース
US5495399A (en) * 1994-07-05 1996-02-27 Motorola, Inc. Shield with detachable grasp support member
JP3104198B2 (ja) 1995-09-20 2000-10-30 株式会社ソニー・ディスクテクノロジー スタンパ製造装置及びスタンパ製造方法
JPH09312454A (ja) 1996-05-22 1997-12-02 Advantest Corp フレキシブル・プリント基板フレーム
US5844784A (en) * 1997-03-24 1998-12-01 Qualcomm Incorporated Brace apparatus and method for printed wiring board assembly
FR2784262A1 (fr) * 1998-10-06 2000-04-07 Philips Consumer Communication Ecran de blindage electromagnetique et substrat support de circuit equipe d'un tel ecran
US6246011B1 (en) * 1998-12-02 2001-06-12 Nortel Networks Limited Solder joint reliability
JP2001217588A (ja) 2000-01-31 2001-08-10 Sharp Corp シールドケース及びそれを用いたｒｆ通信ユニット
US6552261B2 (en) 2001-04-27 2003-04-22 Bmi, Inc. Push-fit shield
US20020185294A1 (en) * 2001-04-27 2002-12-12 Anatoliy Shlyakhtichman Push-fit shield and method for fabricating same
EP1420623A1 (de) 2002-11-12 2004-05-19 Thomson Licensing S.A. Abschirmgehäuse mit Wärmesenke für elektrische Schaltungen
US7138584B1 (en) * 2006-04-07 2006-11-21 Lotes Co., Ltd. Electrical connector

Also Published As

Publication number Publication date
JPWO2006035542A1 (ja) 2008-05-15
JP4289395B2 (ja) 2009-07-01
EP1796449A1 (de) 2007-06-13
CN101027952A (zh) 2007-08-29
US7746666B2 (en) 2010-06-29
ATE467339T1 (de) 2010-05-15
WO2006035542A1 (ja) 2006-04-06
EP1796449A4 (de) 2008-08-27
CN100508714C (zh) 2009-07-01
US20080062668A1 (en) 2008-03-13
EP1796449B1 (de) 2010-05-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition