ATE513452T1 - Elektronisches gerät mit flipmodul mit geringer höhe - Google Patents

Elektronisches gerät mit flipmodul mit geringer höhe

Info

Publication number
ATE513452T1
ATE513452T1 AT07804631T AT07804631T ATE513452T1 AT E513452 T1 ATE513452 T1 AT E513452T1 AT 07804631 T AT07804631 T AT 07804631T AT 07804631 T AT07804631 T AT 07804631T AT E513452 T1 ATE513452 T1 AT E513452T1
Authority
AT
Austria
Prior art keywords
electronic device
pcb
top surface
low height
module
Prior art date
Application number
AT07804631T
Other languages
English (en)
Inventor
Hakan Bygdoe
Per Holmberg
Original Assignee
Sony Ericsson Mobile Comm Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Ericsson Mobile Comm Ab filed Critical Sony Ericsson Mobile Comm Ab
Application granted granted Critical
Publication of ATE513452T1 publication Critical patent/ATE513452T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Telephone Set Structure (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
AT07804631T 2007-01-22 2007-07-20 Elektronisches gerät mit flipmodul mit geringer höhe ATE513452T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/625,426 US7965520B2 (en) 2007-01-22 2007-01-22 Electronic device with flip module having low height
PCT/IB2007/002063 WO2008090399A1 (en) 2007-01-22 2007-07-20 Electronic device with flip module having low height

Publications (1)

Publication Number Publication Date
ATE513452T1 true ATE513452T1 (de) 2011-07-15

Family

ID=38925672

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07804631T ATE513452T1 (de) 2007-01-22 2007-07-20 Elektronisches gerät mit flipmodul mit geringer höhe

Country Status (6)

Country Link
US (1) US7965520B2 (de)
EP (1) EP2127504B1 (de)
CN (1) CN101611658B (de)
AT (1) ATE513452T1 (de)
TW (1) TW200833203A (de)
WO (1) WO2008090399A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8804368B2 (en) * 2009-04-30 2014-08-12 Sony Corporation Downward-facing optical component module
GB2477358A (en) * 2010-02-02 2011-08-03 Thales Holdings Uk Plc RF testing an integrated circuit assembly during manufacture using a interposed adaptor layer which is removed after test to attach the IC to a BGA
US20120170230A1 (en) * 2010-12-30 2012-07-05 Research In Motion Limited Combining printed circuit boards
CN106659032A (zh) * 2015-10-29 2017-05-10 小米科技有限责任公司 电子设备的金属壳体和电子设备
CN105338772A (zh) * 2015-11-24 2016-02-17 小米科技有限责任公司 电子设备的前壳组件和金属前壳结构

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
US5608262A (en) * 1995-02-24 1997-03-04 Lucent Technologies Inc. Packaging multi-chip modules without wire-bond interconnection
US5617297A (en) * 1995-09-25 1997-04-01 National Semiconductor Corporation Encapsulation filler technology for molding active electronics components such as IC cards or PCMCIA cards
US5650755A (en) * 1996-03-18 1997-07-22 Motorola, Inc. Voltage controlled oscillator module assembly
US6197614B1 (en) * 1999-12-20 2001-03-06 Thin Film Module, Inc. Quick turn around fabrication process for packaging substrates and high density cards
US20010033478A1 (en) * 2000-04-21 2001-10-25 Shielding For Electronics, Inc. EMI and RFI shielding for printed circuit boards
US6734539B2 (en) * 2000-12-27 2004-05-11 Lucent Technologies Inc. Stacked module package
US6544047B2 (en) * 2001-03-30 2003-04-08 Intel Corporation Dual-swiping interconnection clip, and hook and slot arrangement for printed circuit board (PCB) attachment
JP2002314031A (ja) * 2001-04-13 2002-10-25 Fujitsu Ltd マルチチップモジュール
DE10142655A1 (de) 2001-08-31 2003-04-03 Epcos Ag Bauelementanordnung
JP2004118694A (ja) * 2002-09-27 2004-04-15 Toshiba Corp コンビｉｃカードの実装方法
JP2005026263A (ja) 2003-06-30 2005-01-27 Nec Compound Semiconductor Devices Ltd 混成集積回路
EP1537767B1 (de) * 2003-07-02 2008-12-03 Siemens Home and Office Communications Devices GmbH & Co. KG Abschirmung für emi-gefährdete elektronische bauelemente und/oder schaltungen von elektronischen geräten
US7076870B2 (en) * 2004-08-16 2006-07-18 Pericom Semiconductor Corp. Manufacturing process for a surface-mount metal-cavity package for an oscillator crystal blank
JP5459956B2 (ja) * 2004-09-16 2014-04-02 サーク・コーポレーション タッチパッドと一体化した無接触カード読取機
US7545029B2 (en) * 2006-08-18 2009-06-09 Tessera, Inc. Stack microelectronic assemblies

Also Published As

Publication number Publication date
WO2008090399A1 (en) 2008-07-31
TW200833203A (en) 2008-08-01
US20080174972A1 (en) 2008-07-24
EP2127504B1 (de) 2011-06-15
CN101611658B (zh) 2011-09-14
EP2127504A1 (de) 2009-12-02
US7965520B2 (en) 2011-06-21
CN101611658A (zh) 2009-12-23

Similar Documents

Publication Publication Date Title
DE602007003822D1 (de) Elektronische Steuereinheit mit erweiterten Blöcken
WO2007013001A3 (en) Light-emitting device with a sealing integrated driver circuit
EP1796444A3 (de) Thermisch leitendes Substrat und elektronische Baugruppe
EP1884992A4 (de) Leiterplatte
TW200802775A (en) An embedded electronic device and method for manufacturing an embedded electronic device
WO2008157143A3 (en) Edge connection structure for printed circuit boards
EP2034809A3 (de) Elektronische Vorrichtung mit Leiterplatte und auf der Leiterplatte montiertes elektronisches Element
WO2007117842A3 (en) Electronic device
TW200833203A (en) Electronic device with flip module having low height
TW200609585A (en) Printed circuit board and display device using the same
TW200744411A (en) Printed circuit board unit
WO2006114267A3 (en) Electronic component and electronic configuration
WO2009039263A3 (en) Thin circuit module and method
GB201208816D0 (en) Printed circuit board heatsink mounting
WO2008039990A3 (en) Electronic control module
TW200733030A (en) Light source driving device with light sensor module and electronic device using the same
TW200730055A (en) The FPC having next door to pads can prevent a short circuit
TW200746962A (en) Alignment plate
WO2009019771A1 (ja) 高実装密度回路基板
SG125183A1 (en) Frame for a device mounted above a printed circuitboard in an electronic device
WO2008132814A1 (ja) 部品内蔵基板と、これを用いた電子モジュール及び電子機器
TW200607411A (en) Wiring board and method of manufacturing wiring board
TW200635466A (en) Method for implementing a RF module in a motherboard
TW200520646A (en) Circuit board having sinking holes
GB2444775B (en) Chip mounting

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties