WO2009019771A1 - 高実装密度回路基板 - Google Patents

高実装密度回路基板 Download PDF

Info

Publication number
WO2009019771A1
WO2009019771A1 PCT/JP2007/065533 JP2007065533W WO2009019771A1 WO 2009019771 A1 WO2009019771 A1 WO 2009019771A1 JP 2007065533 W JP2007065533 W JP 2007065533W WO 2009019771 A1 WO2009019771 A1 WO 2009019771A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed wiring
packaging density
wiring board
high packaging
circuit board
Prior art date
Application number
PCT/JP2007/065533
Other languages
English (en)
French (fr)
Inventor
Takashi Matsuoka
Original Assignee
Bosch Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Corporation filed Critical Bosch Corporation
Priority to PCT/JP2007/065533 priority Critical patent/WO2009019771A1/ja
Publication of WO2009019771A1 publication Critical patent/WO2009019771A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10606—Permanent holder for component or auxiliary PCB mounted on a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

　製造容易で、低コストで、しかも、高い部品実装密度を確実に確保できる回路基板を提供する。 　高実装密度回路基板Ｓ１は、プリント配線基板１とコンポーネントテーブル２とに大別されてなり、コンポーネントテーブル２は、プリント配線基板１のリード部品配設面１ａ側に、プリント配線基板１との間に、電子部品の実装を可能とする実装空間５が形成されるようプリント配線基板１に取着される一方、コンポーネントテーブル２には、リード部品１２ａ～１２ｅが載置され、その半田付けは、プリント配線基板１になされるものとなっており、実装空間５に電子部品の実装を可能として電子部品の高実装密度を可能としている。
PCT/JP2007/065533 2007-08-08 2007-08-08 高実装密度回路基板 WO2009019771A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/065533 WO2009019771A1 (ja) 2007-08-08 2007-08-08 高実装密度回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/065533 WO2009019771A1 (ja) 2007-08-08 2007-08-08 高実装密度回路基板

Publications (1)

Publication Number Publication Date
WO2009019771A1 true WO2009019771A1 (ja) 2009-02-12

Family

ID=40341019

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/065533 WO2009019771A1 (ja) 2007-08-08 2007-08-08 高実装密度回路基板

Country Status (1)

Country Link
WO (1) WO2009019771A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104869760A (zh) * 2015-04-24 2015-08-26 深圳极智联合科技股份有限公司 光学组件的焊接工艺
CN114025482A (zh) * 2021-10-29 2022-02-08 苏州浪潮智能科技有限公司 焊接结构及电路板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61151372U (ja) * 1985-03-12 1986-09-18
JPS62128187A (ja) * 1985-11-28 1987-06-10 株式会社村田製作所 高周波機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61151372U (ja) * 1985-03-12 1986-09-18
JPS62128187A (ja) * 1985-11-28 1987-06-10 株式会社村田製作所 高周波機器

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104869760A (zh) * 2015-04-24 2015-08-26 深圳极智联合科技股份有限公司 光学组件的焊接工艺
CN114025482A (zh) * 2021-10-29 2022-02-08 苏州浪潮智能科技有限公司 焊接结构及电路板
CN114025482B (zh) * 2021-10-29 2023-07-14 苏州浪潮智能科技有限公司 焊接结构及电路板

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