WO2006109206A3 - Electronic circuit module comprising a heat producing component - Google Patents

Electronic circuit module comprising a heat producing component Download PDF

Info

Publication number
WO2006109206A3
WO2006109206A3 PCT/IB2006/050977 IB2006050977W WO2006109206A3 WO 2006109206 A3 WO2006109206 A3 WO 2006109206A3 IB 2006050977 W IB2006050977 W IB 2006050977W WO 2006109206 A3 WO2006109206 A3 WO 2006109206A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
producing component
heat producing
electronic circuit
circuit module
Prior art date
Application number
PCT/IB2006/050977
Other languages
French (fr)
Other versions
WO2006109206A2 (en
Inventor
Klaus Barth
Original Assignee
Koninkl Philips Electronics Nv
Klaus Barth
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Klaus Barth filed Critical Koninkl Philips Electronics Nv
Publication of WO2006109206A2 publication Critical patent/WO2006109206A2/en
Publication of WO2006109206A3 publication Critical patent/WO2006109206A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

An electronic module comprises a printed circuit board (PCB) on which a heat producing component (CMP) is mounted. A heat conductive coupling (HCC) passes through a hole in the printed circuit board (PCB). The heat conductive coupling (HCC) has a heat reception surface (HR) that is thermally coupled to the heat producing component (CMP), and a heat evacuation surface (HE) that is thermally coupled to a heat sink (HSG).
PCT/IB2006/050977 2005-04-12 2006-03-31 Electronic circuit module comprising a heat producing component WO2006109206A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05102857.9 2005-04-12
EP05102857 2005-04-12

Publications (2)

Publication Number Publication Date
WO2006109206A2 WO2006109206A2 (en) 2006-10-19
WO2006109206A3 true WO2006109206A3 (en) 2007-04-26

Family

ID=36954975

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2006/050977 WO2006109206A2 (en) 2005-04-12 2006-03-31 Electronic circuit module comprising a heat producing component

Country Status (2)

Country Link
TW (1) TW200640356A (en)
WO (1) WO2006109206A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007037297A1 (en) * 2007-08-07 2009-02-19 Continental Automotive Gmbh Circuit carrier structure with improved heat dissipation
DE102008040501A1 (en) * 2008-07-17 2010-01-21 Robert Bosch Gmbh Improved heat dissipation from a control unit
DE102009005067A1 (en) * 2009-01-19 2010-07-22 Trw Automotive Gmbh Plate for cover for locking housing of vehicle control unit, has one or multiple areas made from one material with heat conductivity and one or multiple other areas made from another material
JP2014236139A (en) * 2013-06-04 2014-12-15 三菱電機株式会社 Electronic control apparatus
US11683911B2 (en) * 2018-10-26 2023-06-20 Magna Electronics Inc. Vehicular sensing device with cooling feature

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020186542A1 (en) * 2001-06-11 2002-12-12 Samsung Electro-Mechanics Co., Ltd. Heat sink of module with built-in IC
DE10123198A1 (en) * 2001-05-12 2002-12-19 Hella Kg Hueck & Co Housing with circuit-board arrangement, has part of heat-sink extending through opening in circuit-board
EP1528847A1 (en) * 2003-10-29 2005-05-04 Magnetek S.p.A. Heat dissipating insert, circuit comprising said insert and production method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10123198A1 (en) * 2001-05-12 2002-12-19 Hella Kg Hueck & Co Housing with circuit-board arrangement, has part of heat-sink extending through opening in circuit-board
US20020186542A1 (en) * 2001-06-11 2002-12-12 Samsung Electro-Mechanics Co., Ltd. Heat sink of module with built-in IC
EP1528847A1 (en) * 2003-10-29 2005-05-04 Magnetek S.p.A. Heat dissipating insert, circuit comprising said insert and production method

Also Published As

Publication number Publication date
WO2006109206A2 (en) 2006-10-19
TW200640356A (en) 2006-11-16

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