WO2006105746A3 - Kühlvorrichtung für leiterplatten und verfahren zur herstellung derselben - Google Patents
Kühlvorrichtung für leiterplatten und verfahren zur herstellung derselben Download PDFInfo
- Publication number
- WO2006105746A3 WO2006105746A3 PCT/DE2006/000305 DE2006000305W WO2006105746A3 WO 2006105746 A3 WO2006105746 A3 WO 2006105746A3 DE 2006000305 W DE2006000305 W DE 2006000305W WO 2006105746 A3 WO2006105746 A3 WO 2006105746A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- printed circuit
- cooling device
- production
- circuit boards
- housing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
- H05K7/142—Spacers not being card guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/918,075 US20090122494A1 (en) | 2005-04-06 | 2006-02-18 | Cooling Device for Printed Circuit Board and Method for the Prosecution Thereof |
EP06705989A EP1867224A2 (de) | 2005-04-06 | 2006-02-18 | Kühlvorrichtung für leiterplatten und verfahren zur herstellung derselben |
DE112006000163T DE112006000163A5 (de) | 2005-04-06 | 2006-02-18 | Kühlvorrichtung für Leiterplatten und Verfahren zur Herstellung derselben |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005015749A DE102005015749A1 (de) | 2005-04-06 | 2005-04-06 | Kühlvorrichtung für Leiterplatten und Verfahren zur Herstellung derselben |
DE102005015749.1 | 2005-04-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006105746A2 WO2006105746A2 (de) | 2006-10-12 |
WO2006105746A3 true WO2006105746A3 (de) | 2007-04-26 |
Family
ID=36954870
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2006/000305 WO2006105746A2 (de) | 2005-04-06 | 2006-02-18 | Kühlvorrichtung für leiterplatten und verfahren zur herstellung derselben |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090122494A1 (de) |
EP (1) | EP1867224A2 (de) |
DE (2) | DE102005015749A1 (de) |
WO (1) | WO2006105746A2 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5738679B2 (ja) * | 2011-06-01 | 2015-06-24 | トヨタ自動車株式会社 | 放熱構造 |
JP5956948B2 (ja) * | 2013-03-21 | 2016-07-27 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
JP6435145B2 (ja) * | 2014-09-19 | 2018-12-05 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
KR102415119B1 (ko) * | 2015-08-21 | 2022-06-30 | 삼성에스디아이 주식회사 | 회로기판을 구비한 장치 |
US10206295B2 (en) | 2016-08-19 | 2019-02-12 | Flextronics Ap, Llc | Securing a PCB in a plastic and metal housing |
US11683911B2 (en) * | 2018-10-26 | 2023-06-20 | Magna Electronics Inc. | Vehicular sensing device with cooling feature |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19836887A1 (de) * | 1998-08-14 | 2000-02-17 | Krone Ag | Gehäuse für elektronische Baugruppen auf einer Leiterplatte |
WO2001071250A2 (en) * | 2000-03-18 | 2001-09-27 | Koninklijke Philips Electronics N.V. | Tamper-proof ballast enclosure |
WO2002069685A1 (de) * | 2001-02-24 | 2002-09-06 | Conti Temic Microelectronic Gmbh | Elektronische baugruppe |
US20030147204A1 (en) * | 2002-02-06 | 2003-08-07 | Keihin Corporation | Electronic circuit board case |
US20040014337A1 (en) * | 2002-07-22 | 2004-01-22 | Siemens Vdo Automotive Corporation | Automotive control module housing |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4278311A (en) * | 1979-04-06 | 1981-07-14 | Amp Incorporated | Surface to surface connector |
DE8427885U1 (de) * | 1984-09-21 | 1985-01-03 | Siemens AG, 1000 Berlin und 8000 München | Einrichtung zum Befestigen eines Kühlkörpers auf mehreren nebeneinander angeordneten integrierten Bausteinen |
DE8427872U1 (de) * | 1984-09-21 | 1985-01-03 | Siemens AG, 1000 Berlin und 8000 München | Einrichtung zum Befestigen eines Kühlkörpers auf mehreren nebeneinander angeordneten integrierten Bausteinen |
US5402313A (en) * | 1993-05-21 | 1995-03-28 | Cummins Engine Company, Inc. | Electronic component heat sink attachment using a canted coil spring |
DE4416460C2 (de) * | 1994-05-10 | 1996-04-11 | Hella Kg Hueck & Co | Schaltungsanordnung, insbesondere zur Gebläsesteuerung für Kraftfahrzeuge |
DE19518521C2 (de) * | 1995-05-19 | 1997-08-28 | Siemens Ag | Gehäuse eines Steuergeräts, insbesondere für ein Kraftfahrzeug |
DE19533298A1 (de) * | 1995-09-08 | 1997-03-13 | Siemens Ag | Elektronisches Modul mit Leistungsbauelementen |
DE19600619A1 (de) * | 1996-01-10 | 1997-07-17 | Bosch Gmbh Robert | Steuergerät bestehend aus mindestens zwei Gehäuseteilen |
DE19701731A1 (de) * | 1997-01-20 | 1998-07-23 | Bosch Gmbh Robert | Steuergerät bestehend aus mindestens zwei Gehäuseteilen |
DE19722602C2 (de) * | 1997-05-30 | 2001-03-29 | Lenze Gmbh & Co Kg Aerzen | Wärmeableitendes Gehäuse zur Aufnahme von elektrischen oder elektronischen Bauteilen |
US6088228A (en) * | 1998-12-16 | 2000-07-11 | 3M Innovative Properties Company | Protective enclosure for a multi-chip module |
US6111760A (en) * | 1998-12-30 | 2000-08-29 | Ericsson, Inc. | Simple enclosure for electronic components |
US6462954B1 (en) * | 2001-06-26 | 2002-10-08 | Inventec Corporation | Modular machine board structure capable of automatically correcting the contact travel for an electronic device |
DE10249436A1 (de) * | 2001-11-08 | 2003-05-22 | Tyco Electronics Amp Gmbh | Kühlkörper zur Kühlung eines Leistungsbauelements auf einer Platine |
DE10300175B4 (de) * | 2003-01-08 | 2016-12-29 | Hella Kgaa Hueck & Co. | Elektronische Baugruppe mit Wärme ableitendem Gehäuseteil |
US7336491B2 (en) * | 2005-09-06 | 2008-02-26 | Lear Corporation | Heat sink |
-
2005
- 2005-04-06 DE DE102005015749A patent/DE102005015749A1/de not_active Withdrawn
-
2006
- 2006-02-18 US US11/918,075 patent/US20090122494A1/en not_active Abandoned
- 2006-02-18 DE DE112006000163T patent/DE112006000163A5/de not_active Withdrawn
- 2006-02-18 WO PCT/DE2006/000305 patent/WO2006105746A2/de not_active Application Discontinuation
- 2006-02-18 EP EP06705989A patent/EP1867224A2/de not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19836887A1 (de) * | 1998-08-14 | 2000-02-17 | Krone Ag | Gehäuse für elektronische Baugruppen auf einer Leiterplatte |
WO2001071250A2 (en) * | 2000-03-18 | 2001-09-27 | Koninklijke Philips Electronics N.V. | Tamper-proof ballast enclosure |
WO2002069685A1 (de) * | 2001-02-24 | 2002-09-06 | Conti Temic Microelectronic Gmbh | Elektronische baugruppe |
US20030147204A1 (en) * | 2002-02-06 | 2003-08-07 | Keihin Corporation | Electronic circuit board case |
US20040014337A1 (en) * | 2002-07-22 | 2004-01-22 | Siemens Vdo Automotive Corporation | Automotive control module housing |
Also Published As
Publication number | Publication date |
---|---|
DE112006000163A5 (de) | 2007-10-11 |
EP1867224A2 (de) | 2007-12-19 |
DE102005015749A1 (de) | 2006-10-12 |
US20090122494A1 (en) | 2009-05-14 |
WO2006105746A2 (de) | 2006-10-12 |
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