WO2008132814A1 - 部品内蔵基板と、これを用いた電子モジュール及び電子機器 - Google Patents

部品内蔵基板と、これを用いた電子モジュール及び電子機器 Download PDF

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Publication number
WO2008132814A1
WO2008132814A1 PCT/JP2008/001005 JP2008001005W WO2008132814A1 WO 2008132814 A1 WO2008132814 A1 WO 2008132814A1 JP 2008001005 W JP2008001005 W JP 2008001005W WO 2008132814 A1 WO2008132814 A1 WO 2008132814A1
Authority
WO
WIPO (PCT)
Prior art keywords
built
substrate
component
dielectric layer
same
Prior art date
Application number
PCT/JP2008/001005
Other languages
English (en)
French (fr)
Inventor
Yoshikuni Fujihashi
Yosuke Wada
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Publication of WO2008132814A1 publication Critical patent/WO2008132814A1/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

　本発明の部品内蔵基板（６）は、内部または下面にグランド板（７）を有する回路基板（８）と、この回路基板（８）の上面に実装された半導体集積回路（９）と、この半導体集積回路（９）を覆うように回路基板（８）の上に積層された第１誘電体（１０）と、この第１誘電体（１０）の上に積層された第２誘電体（１１）とを備え、第２誘電体（１１）の誘電率は第１誘電体（１０）の誘電率より大きい。このような構成により、この部品内蔵基板を用いた電子チューナ等の受信モジュールの受信特性を向上させることができる。
PCT/JP2008/001005 2007-04-18 2008-04-17 部品内蔵基板と、これを用いた電子モジュール及び電子機器 WO2008132814A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007108897 2007-04-18
JP2007-108897 2007-04-18

Publications (1)

Publication Number Publication Date
WO2008132814A1 true WO2008132814A1 (ja) 2008-11-06

Family

ID=39925286

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001005 WO2008132814A1 (ja) 2007-04-18 2008-04-17 部品内蔵基板と、これを用いた電子モジュール及び電子機器

Country Status (1)

Country Link
WO (1) WO2008132814A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013077468A1 (en) * 2011-11-22 2013-05-30 Yazaki Corporation Electronic component module and method of manufacturing the same
EP2595462A3 (en) * 2011-11-16 2013-09-04 Thomas Hofmann Layered composite circuit with integrated components which are accessible from outside

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04340258A (ja) * 1990-10-08 1992-11-26 Toshiba Corp 半導体装置の製造方法
JPH06283562A (ja) * 1993-03-26 1994-10-07 Matsushita Electric Ind Co Ltd 集積回路素子用樹脂封止金型装置
JP2003243576A (ja) * 2002-02-14 2003-08-29 Rohm Co Ltd 半導体装置
JP2005235944A (ja) * 2004-02-18 2005-09-02 Tdk Corp 電子デバイスおよびその製造方法
WO2005122247A1 (ja) * 2004-06-10 2005-12-22 Matsushita Electric Industrial Co., Ltd. 複合型電子部品

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04340258A (ja) * 1990-10-08 1992-11-26 Toshiba Corp 半導体装置の製造方法
JPH06283562A (ja) * 1993-03-26 1994-10-07 Matsushita Electric Ind Co Ltd 集積回路素子用樹脂封止金型装置
JP2003243576A (ja) * 2002-02-14 2003-08-29 Rohm Co Ltd 半導体装置
JP2005235944A (ja) * 2004-02-18 2005-09-02 Tdk Corp 電子デバイスおよびその製造方法
WO2005122247A1 (ja) * 2004-06-10 2005-12-22 Matsushita Electric Industrial Co., Ltd. 複合型電子部品

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2595462A3 (en) * 2011-11-16 2013-09-04 Thomas Hofmann Layered composite circuit with integrated components which are accessible from outside
WO2013077468A1 (en) * 2011-11-22 2013-05-30 Yazaki Corporation Electronic component module and method of manufacturing the same
CN103959922A (zh) * 2011-11-22 2014-07-30 矢崎总业株式会社 电子元件模块和该电子元件模块的制造方法

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WO2008132814A1 (ja) 部品内蔵基板と、これを用いた電子モジュール及び電子機器

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