KR102097261B1 - 감광성 수지 조성물 - Google Patents

감광성 수지 조성물 Download PDF

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Publication number
KR102097261B1
KR102097261B1 KR1020187001598A KR20187001598A KR102097261B1 KR 102097261 B1 KR102097261 B1 KR 102097261B1 KR 1020187001598 A KR1020187001598 A KR 1020187001598A KR 20187001598 A KR20187001598 A KR 20187001598A KR 102097261 B1 KR102097261 B1 KR 102097261B1
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KR
South Korea
Prior art keywords
resin composition
photosensitive resin
compound
alkali
mass
Prior art date
Application number
KR1020187001598A
Other languages
English (en)
Korean (ko)
Other versions
KR20180019678A (ko
Inventor
마사노리 요시다
신이치 구니마츠
히데아키 니시모토
Original Assignee
아사히 가세이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아사히 가세이 가부시키가이샤 filed Critical 아사히 가세이 가부시키가이샤
Publication of KR20180019678A publication Critical patent/KR20180019678A/ko
Application granted granted Critical
Publication of KR102097261B1 publication Critical patent/KR102097261B1/ko

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
KR1020187001598A 2015-08-25 2016-08-19 감광성 수지 조성물 KR102097261B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2015-165836 2015-08-25
JP2015165836 2015-08-25
PCT/JP2016/074276 WO2017033868A1 (ja) 2015-08-25 2016-08-19 感光性樹脂組成物

Publications (2)

Publication Number Publication Date
KR20180019678A KR20180019678A (ko) 2018-02-26
KR102097261B1 true KR102097261B1 (ko) 2020-04-06

Family

ID=58100137

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187001598A KR102097261B1 (ko) 2015-08-25 2016-08-19 감광성 수지 조성물

Country Status (5)

Country Link
JP (2) JP6637511B2 (ja)
KR (1) KR102097261B1 (ja)
CN (1) CN107924128B (ja)
TW (1) TWI620015B (ja)
WO (1) WO2017033868A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020076945A (ja) * 2018-09-21 2020-05-21 旭化成株式会社 感光性樹脂組成物
WO2021172341A1 (ja) * 2020-02-27 2021-09-02 川崎化成工業株式会社 光ラジカル重合性組成物
JPWO2022163301A1 (ja) * 2021-01-29 2022-08-04

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009227959A (ja) 2008-02-26 2009-10-08 Hitachi Chem Co Ltd 感光性接着剤組成物、接着シート、接着剤パターン、接着剤層付半導体ウェハ、並びに半導体装置及びその製造方法
JP2012220686A (ja) * 2011-04-07 2012-11-12 Asahi Kasei E-Materials Corp 感光性樹脂組成物及びその積層体

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EP1008911A1 (en) * 1998-12-11 2000-06-14 Shipley Company LLC Photoimageable compositions having improved flexibility and stripping ability
US6322951B1 (en) * 1998-12-11 2001-11-27 Norton International, Inc. Photoimageable compositions having improved flexibility and stripping ability
JP2000314958A (ja) * 1999-03-03 2000-11-14 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP2003131370A (ja) * 2001-10-24 2003-05-09 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント
JP4149769B2 (ja) 2002-09-05 2008-09-17 旭化成エレクトロニクス株式会社 感光性樹脂組成物とその積層体
JP2005031583A (ja) * 2003-07-11 2005-02-03 Hitachi Chem Co Ltd 感光性樹脂組成物及びプリント配線板の製造方法
JP2006011371A (ja) * 2004-05-26 2006-01-12 Fuji Photo Film Co Ltd パターン形成方法
KR101141841B1 (ko) * 2005-10-25 2012-05-08 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물, 이것을 이용한 감광성 엘리먼트,레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법
JP5043516B2 (ja) * 2007-06-04 2012-10-10 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びそれを用いて得られるプリント配線
JP5221543B2 (ja) 2007-08-15 2013-06-26 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びその積層体
JP2010217903A (ja) * 2010-04-19 2010-09-30 Hitachi Chem Co Ltd 感光性樹脂組成物及びプリント配線板の製造方法
JP2011233769A (ja) 2010-04-28 2011-11-17 Mec Co Ltd 銅配線パターンの形成方法
JP5760711B2 (ja) * 2010-08-10 2015-08-12 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法及びプリント配線板の製造方法
KR101907714B1 (ko) * 2011-06-17 2018-10-12 다이요 잉키 세이조 가부시키가이샤 난연성 경화성 수지 조성물, 이를 이용한 드라이 필름 및 인쇄 배선판
JP6064493B2 (ja) 2011-10-26 2017-01-25 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP5458215B1 (ja) * 2013-03-11 2014-04-02 太陽インキ製造株式会社 光硬化性樹脂組成物、そのドライフィルムおよび硬化物、並びにそれらを用いて形成された硬化皮膜を有するプリント配線板
CN104049457B (zh) * 2013-03-11 2016-01-27 太阳油墨制造株式会社 光固化性树脂组合物、其干膜和固化物、以及具有使用它们形成的固化皮膜的印刷电路板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009227959A (ja) 2008-02-26 2009-10-08 Hitachi Chem Co Ltd 感光性接着剤組成物、接着シート、接着剤パターン、接着剤層付半導体ウェハ、並びに半導体装置及びその製造方法
JP2012220686A (ja) * 2011-04-07 2012-11-12 Asahi Kasei E-Materials Corp 感光性樹脂組成物及びその積層体

Also Published As

Publication number Publication date
JPWO2017033868A1 (ja) 2018-03-15
CN107924128B (zh) 2020-11-06
JP2020079930A (ja) 2020-05-28
TW201715303A (zh) 2017-05-01
KR20180019678A (ko) 2018-02-26
CN107924128A (zh) 2018-04-17
TWI620015B (zh) 2018-04-01
JP6637511B2 (ja) 2020-01-29
WO2017033868A1 (ja) 2017-03-02

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