KR102091726B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

Info

Publication number
KR102091726B1
KR102091726B1 KR1020170040535A KR20170040535A KR102091726B1 KR 102091726 B1 KR102091726 B1 KR 102091726B1 KR 1020170040535 A KR1020170040535 A KR 1020170040535A KR 20170040535 A KR20170040535 A KR 20170040535A KR 102091726 B1 KR102091726 B1 KR 102091726B1
Authority
KR
South Korea
Prior art keywords
substrate
processing liquid
shielding plate
processing
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020170040535A
Other languages
English (en)
Korean (ko)
Other versions
KR20170113388A (ko
Inventor
노부오 고바야시
고노스케 사사히라
가츠히로 야마자키
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바우라 메카트로닉스 가부시끼가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Publication of KR20170113388A publication Critical patent/KR20170113388A/ko
Application granted granted Critical
Publication of KR102091726B1 publication Critical patent/KR102091726B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H01L21/02052—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/041—Cleaning travelling work
    • H01L21/67051—
    • H01L21/6715—
    • H01L21/68764—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
KR1020170040535A 2016-03-31 2017-03-30 기판 처리 장치 및 기판 처리 방법 Active KR102091726B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2016-073352 2016-03-31
JP2016073352 2016-03-31
JPJP-P-2017-040452 2017-03-03
JP2017040452A JP6934732B2 (ja) 2016-03-31 2017-03-03 基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
KR20170113388A KR20170113388A (ko) 2017-10-12
KR102091726B1 true KR102091726B1 (ko) 2020-03-20

Family

ID=60044245

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170040535A Active KR102091726B1 (ko) 2016-03-31 2017-03-30 기판 처리 장치 및 기판 처리 방법

Country Status (4)

Country Link
JP (1) JP6934732B2 (https=)
KR (1) KR102091726B1 (https=)
CN (1) CN107275260B (https=)
TW (1) TWI687971B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7045867B2 (ja) * 2018-01-26 2022-04-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP7149118B2 (ja) * 2018-07-03 2022-10-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
FR3085603B1 (fr) * 2018-09-11 2020-08-14 Soitec Silicon On Insulator Procede pour le traitement d'un susbtrat soi dans un equipement de nettoyage monoplaque
JP6979935B2 (ja) * 2018-10-24 2021-12-15 三菱電機株式会社 半導体製造装置および半導体製造方法
JP7353079B2 (ja) * 2019-07-04 2023-09-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI756850B (zh) * 2019-09-30 2022-03-01 日商芝浦機械電子裝置股份有限公司 基板處理裝置
JP7233624B1 (ja) * 2022-08-08 2023-03-06 株式会社荏原製作所 プリウェットモジュール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015192050A (ja) * 2014-03-28 2015-11-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3698567B2 (ja) 1998-10-23 2005-09-21 大日本スクリーン製造株式会社 基板処理装置
US6402401B1 (en) * 1999-10-19 2002-06-11 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
JP3808719B2 (ja) * 2001-04-17 2006-08-16 大日本スクリーン製造株式会社 基板処理装置
JP4325831B2 (ja) * 2001-07-26 2009-09-02 大日本スクリーン製造株式会社 基板処理装置ならびに基板処理装置に備えられた回転板および周囲部材の洗浄方法
JP4074814B2 (ja) * 2002-01-30 2008-04-16 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4494840B2 (ja) * 2003-06-27 2010-06-30 大日本スクリーン製造株式会社 異物除去装置、基板処理装置および基板処理方法
JP4762098B2 (ja) * 2006-09-28 2011-08-31 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP5242242B2 (ja) * 2007-10-17 2013-07-24 株式会社荏原製作所 基板洗浄装置
WO2013031390A1 (ja) * 2011-08-26 2013-03-07 東京エレクトロン株式会社 液処理装置及び液処理方法
JP5666414B2 (ja) * 2011-10-27 2015-02-12 東京エレクトロン株式会社 液処理装置、液処理方法および記憶媒体
JP6017999B2 (ja) * 2013-03-15 2016-11-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR101579507B1 (ko) * 2013-05-08 2015-12-22 세메스 주식회사 기판 처리 장치
CN110060925B (zh) * 2014-03-28 2023-02-17 株式会社斯库林集团 基板处理方法
JP6626762B2 (ja) * 2016-03-30 2019-12-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015192050A (ja) * 2014-03-28 2015-11-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Also Published As

Publication number Publication date
JP2017188665A (ja) 2017-10-12
CN107275260A (zh) 2017-10-20
KR20170113388A (ko) 2017-10-12
TW201802870A (zh) 2018-01-16
JP6934732B2 (ja) 2021-09-15
TWI687971B (zh) 2020-03-11
CN107275260B (zh) 2021-08-24

Similar Documents

Publication Publication Date Title
KR102091726B1 (ko) 기판 처리 장치 및 기판 처리 방법
TWI652115B (zh) 基板處理裝置及噴嘴洗淨方法
TWI525686B (zh) 基板洗淨方法
TWI647754B (zh) 基板處理裝置、基板處理方法及記錄媒體
US7332055B2 (en) Substrate processing apparatus
JP4976949B2 (ja) 基板処理装置
US9508567B2 (en) Cleaning jig and cleaning method for cleaning substrate processing apparatus, and substrate processing system
CN109390252B (zh) 基板处理装置、基板处理方法以及存储介质
JP5726686B2 (ja) 液処理装置、及び液処理装置の制御方法
JP7197376B2 (ja) 基板処理方法及び基板処理装置
CN102891096A (zh) 基板处理装置以及基板处理方法
CN108573897B (zh) 基板处理方法以及基板处理装置
JP6319941B2 (ja) 基板処理装置および吐出ヘッド待機方法
KR102402297B1 (ko) 기판 처리 장치 및 기판 처리 방법
US20170287743A1 (en) Substrate treating device and substrate treating method
JP6762824B2 (ja) 基板処理方法および基板処理装置
JP2003017452A (ja) 基板処理方法及び基板処理装置
JP2003197718A (ja) 基板処理装置及び基板処理方法
JP7187268B2 (ja) 基板処理装置及び基板処理方法
TWI825994B (zh) 基板處理裝置
JP2003332284A (ja) 液処理装置および液処理方法
JP5970102B2 (ja) 液処理装置
JP2019125659A (ja) 基板処理装置および基板処理方法
TW202437372A (zh) 基板處理方法及基板處理系統
JPH09283420A (ja) 回転式基板処理装置

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

X091 Application refused [patent]
R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T13-X000 Administrative time limit extension granted

St.27 status event code: U-3-3-T10-T13-oth-X000

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PX0901 Re-examination

St.27 status event code: A-2-3-E10-E12-rex-PX0901

PX0701 Decision of registration after re-examination

St.27 status event code: A-3-4-F10-F13-rex-PX0701

X701 Decision to grant (after re-examination)
GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 7