KR102059703B1 - 폴리아믹산 용액 조성물, 및 폴리이미드 - Google Patents

폴리아믹산 용액 조성물, 및 폴리이미드 Download PDF

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KR102059703B1
KR102059703B1 KR1020147032506A KR20147032506A KR102059703B1 KR 102059703 B1 KR102059703 B1 KR 102059703B1 KR 1020147032506 A KR1020147032506 A KR 1020147032506A KR 20147032506 A KR20147032506 A KR 20147032506A KR 102059703 B1 KR102059703 B1 KR 102059703B1
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acid solution
polyamic
polyimide
degreec
solution composition
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KR1020147032506A
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Korean (ko)
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KR20150003355A (ko
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도모노리 나카야마
다케시게 나카야마
데츠지 가미네
나오키 기타야마
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우베 고산 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C7/00—Purification; Separation; Use of additives
    • C07C7/10—Purification; Separation; Use of additives by extraction, i.e. purification or separation of liquid hydrocarbons with the aid of liquids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/10—Transparent films; Clear coatings; Transparent materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Water Supply & Treatment (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020147032506A 2012-04-27 2013-04-25 폴리아믹산 용액 조성물, 및 폴리이미드 KR102059703B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-103920 2012-04-27
JP2012103920 2012-04-27
PCT/JP2013/062301 WO2013161970A1 (ja) 2012-04-27 2013-04-25 ポリアミック酸溶液組成物、及びポリイミド

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KR1020197029227A Division KR102145141B1 (ko) 2012-04-27 2013-04-25 폴리아믹산 용액 조성물, 및 폴리이미드

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KR20150003355A KR20150003355A (ko) 2015-01-08
KR102059703B1 true KR102059703B1 (ko) 2019-12-26

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KR1020197029227A KR102145141B1 (ko) 2012-04-27 2013-04-25 폴리아믹산 용액 조성물, 및 폴리이미드

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JP (1) JP6086118B2 (zh)
KR (2) KR102059703B1 (zh)
CN (1) CN104245845B (zh)
TW (1) TWI567108B (zh)
WO (1) WO2013161970A1 (zh)

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TWI654251B (zh) * 2014-03-12 2019-03-21 日商日鐵化學材料股份有限公司 顯示裝置及其製造方法、以及顯示裝置用的聚醯亞胺膜
JP6631804B2 (ja) * 2014-03-31 2020-01-15 日産化学株式会社 樹脂薄膜の製造方法および樹脂薄膜形成用組成物
KR102410985B1 (ko) 2014-10-20 2022-06-21 삼성디스플레이 주식회사 투명 표시 장치 및 이의 제조 방법
CN113136103B (zh) * 2015-03-13 2024-05-03 旭化成株式会社 聚酰亚胺前体树脂组合物
JP2016204569A (ja) * 2015-04-27 2016-12-08 宇部興産株式会社 ポリアミック酸溶液組成物およびポリイミドフィルム
WO2017119450A1 (ja) * 2016-01-08 2017-07-13 日産化学工業株式会社 フレキシブルデバイス基板形成用組成物
WO2017150377A1 (ja) * 2016-03-03 2017-09-08 大日本印刷株式会社 ポリイミドフィルム、ポリイミドフィルムの製造方法、及びポリイミド前駆体樹脂組成物
KR102281093B1 (ko) * 2016-06-24 2021-07-22 코오롱인더스트리 주식회사 내열성이 개선된 폴리아믹산 수지, 이로부터 제조된 폴리이미드 필름 및 이의 표시소자
JP2019052287A (ja) * 2017-09-15 2019-04-04 住友化学株式会社 タッチセンサーパネル用透明フィルム基材及びそれを用いたタッチセンサーパネル
KR102430152B1 (ko) * 2017-12-08 2022-08-08 주식회사 두산 폴리아믹산 용액, 이를 이용한 투명 폴리이미드 수지 필름 및 투명 기판
JP7217220B2 (ja) 2018-12-28 2023-02-02 日鉄ケミカル＆マテリアル株式会社 ポリイミド前駆体組成物及びそれから生じるポリイミドフィルム及びフレキシブルデバイス、ポリイミドフィルムの製造方法
KR102293269B1 (ko) * 2019-03-12 2021-08-24 한국자동차연구원 저유전손실 특성을 가지는 폴리이미드 복합필름의 제조방법 및 그로부터 제조된 폴리이미드 복합필름을 이용한 유연회로기판
CN112126090B (zh) * 2019-06-25 2023-06-13 爱思开迈克沃有限公司 聚酰胺-酰亚胺膜及其制备方法
RU2753691C1 (ru) * 2020-12-16 2021-08-19 Федеральное государственное бюджетное образовательное учреждение высшего образования "Волгоградский государственный технический университет" (ВолгГТУ) Оптически прозрачные адамантансодержащие полиимиды и сополиимиды на основе 5,5'-(1,1,1,3,3,3-гексафторпропан-2,2-диил)бис(2-бензофуран-1,3-диона), обладающие низкой диэлектрической постоянной
JPWO2022239494A1 (zh) 2021-05-12 2022-11-17

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JP6086118B2 (ja) 2017-03-01
CN104245845A (zh) 2014-12-24
CN104245845B (zh) 2017-06-06
KR20190116568A (ko) 2019-10-14
TWI567108B (zh) 2017-01-21
KR102145141B1 (ko) 2020-08-14
WO2013161970A1 (ja) 2013-10-31
TW201348298A (zh) 2013-12-01
JPWO2013161970A1 (ja) 2015-12-24
KR20150003355A (ko) 2015-01-08

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