KR102018414B1 - 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스 - Google Patents

도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스 Download PDF

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KR102018414B1
KR102018414B1 KR1020157036691A KR20157036691A KR102018414B1 KR 102018414 B1 KR102018414 B1 KR 102018414B1 KR 1020157036691 A KR1020157036691 A KR 1020157036691A KR 20157036691 A KR20157036691 A KR 20157036691A KR 102018414 B1 KR102018414 B1 KR 102018414B1
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transparent conductive
conductive thin
thin film
metal
laminated body
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KR20160005139A (ko
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노조미 후지노
모토키 하이시
고이치로 다다
요시마사 사카타
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닛토덴코 가부시키가이샤
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    • H—ELECTRICITY
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    • H05K1/00—Printed circuits
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    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3492—Variation of parameters during sputtering
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    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Physical Vapour Deposition (AREA)
  • Position Input By Displaying (AREA)
KR1020157036691A 2011-06-17 2012-06-14 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스 Expired - Fee Related KR102018414B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011135436A JP5473990B2 (ja) 2011-06-17 2011-06-17 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。
JPJP-P-2011-135436 2011-06-17
PCT/JP2012/065253 WO2012173192A1 (ja) 2011-06-17 2012-06-14 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020137030243A Division KR20140009493A (ko) 2011-06-17 2012-06-14 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1020187008395A Division KR20180032695A (ko) 2011-06-17 2012-06-14 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스
KR1020197025318A Division KR20190103489A (ko) 2011-06-17 2012-06-14 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스

Publications (2)

Publication Number Publication Date
KR20160005139A KR20160005139A (ko) 2016-01-13
KR102018414B1 true KR102018414B1 (ko) 2019-09-04

Family

ID=47357173

Family Applications (5)

Application Number Title Priority Date Filing Date
KR1020157036691A Expired - Fee Related KR102018414B1 (ko) 2011-06-17 2012-06-14 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스
KR1020197025318A Ceased KR20190103489A (ko) 2011-06-17 2012-06-14 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스
KR1020137030243A Ceased KR20140009493A (ko) 2011-06-17 2012-06-14 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스
KR1020187008395A Ceased KR20180032695A (ko) 2011-06-17 2012-06-14 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스
KR1020207018480A Ceased KR20200078719A (ko) 2011-06-17 2012-06-14 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스

Family Applications After (4)

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KR1020197025318A Ceased KR20190103489A (ko) 2011-06-17 2012-06-14 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스
KR1020137030243A Ceased KR20140009493A (ko) 2011-06-17 2012-06-14 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스
KR1020187008395A Ceased KR20180032695A (ko) 2011-06-17 2012-06-14 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스
KR1020207018480A Ceased KR20200078719A (ko) 2011-06-17 2012-06-14 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스

Country Status (7)

Country Link
US (1) US9674946B2 (enExample)
EP (1) EP2722853B1 (enExample)
JP (1) JP5473990B2 (enExample)
KR (5) KR102018414B1 (enExample)
CN (1) CN103608872B (enExample)
TW (2) TWI551925B (enExample)
WO (1) WO2012173192A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12171126B2 (en) 2021-03-31 2024-12-17 Hefei Xinsheng Optoelectronics Technology Group Co., Ltd. Display substrate, manufacturing method thereof, and display device

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5473990B2 (ja) 2011-06-17 2014-04-16 日東電工株式会社 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。
JP2014164882A (ja) * 2013-02-22 2014-09-08 Dainippon Printing Co Ltd 信頼性・加工性に優れた積層体およびフィルムセンサ並びに積層体製造方法
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