KR101948428B1 - 압착 장치 - Google Patents

압착 장치 Download PDF

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Publication number
KR101948428B1
KR101948428B1 KR1020170094591A KR20170094591A KR101948428B1 KR 101948428 B1 KR101948428 B1 KR 101948428B1 KR 1020170094591 A KR1020170094591 A KR 1020170094591A KR 20170094591 A KR20170094591 A KR 20170094591A KR 101948428 B1 KR101948428 B1 KR 101948428B1
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KR
South Korea
Prior art keywords
pressing
substrate
printed board
electronic component
holding
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KR1020170094591A
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English (en)
Korean (ko)
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KR20180019478A (ko
Inventor
아키타카 노다
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
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Publication of KR20180019478A publication Critical patent/KR20180019478A/ko
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Publication of KR101948428B1 publication Critical patent/KR101948428B1/ko
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H01L21/67092—
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Combinations Of Printed Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020170094591A 2016-08-16 2017-07-26 압착 장치 Active KR101948428B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016159611 2016-08-16
JPJP-P-2016-159611 2016-08-16
JP2017137441A JP6675357B2 (ja) 2016-08-16 2017-07-13 圧着装置
JPJP-P-2017-137441 2017-07-13

Publications (2)

Publication Number Publication Date
KR20180019478A KR20180019478A (ko) 2018-02-26
KR101948428B1 true KR101948428B1 (ko) 2019-02-14

Family

ID=61248548

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170094591A Active KR101948428B1 (ko) 2016-08-16 2017-07-26 압착 장치

Country Status (4)

Country Link
JP (1) JP6675357B2 (enExample)
KR (1) KR101948428B1 (enExample)
CN (1) CN107765454B (enExample)
TW (1) TWI644375B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102608963B1 (ko) * 2019-03-19 2023-12-05 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
CN110544655B (zh) * 2019-09-03 2021-09-14 云谷（固安）科技有限公司 绑定装置及绑定方法
CN112566485B (zh) * 2019-09-25 2022-05-13 芝浦机械电子装置株式会社 电子零件的安装装置
JP7424871B2 (ja) * 2020-03-12 2024-01-30 ニデックインスツルメンツ株式会社 検査装置
KR102888788B1 (ko) * 2020-03-24 2025-11-24 삼성디스플레이 주식회사 본딩 장치
JP7599089B2 (ja) * 2020-12-25 2024-12-13 パナソニックＩｐマネジメント株式会社 部品圧着装置および部品移送方法
CN113490406B (zh) * 2021-07-07 2022-09-16 广州市爱浦电子科技有限公司 一种微功率模块电源组成结构的自动化生产方法
CN116027577B (zh) * 2023-03-24 2023-06-13 中电科风华信息装备股份有限公司 可同时对应ab料邦定的高精度预压机构
CN116403949B (zh) * 2023-06-08 2023-08-15 深圳市磐锋精密技术有限公司 一种全自动cof邦定机智能传动控制系统及方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4627654B2 (ja) * 2004-12-09 2011-02-09 芝浦メカトロニクス株式会社 部品の組み立て装置及び組み立て方法
JP2008084952A (ja) * 2006-09-26 2008-04-10 Fujifilm Corp 配線板接続方法
JP4687624B2 (ja) * 2006-09-29 2011-05-25 オムロン株式会社 基板支持装置
KR20100092477A (ko) * 2007-12-04 2010-08-20 파나소닉 주식회사 부품 압착 장치 및 방법
US8646171B2 (en) * 2008-04-01 2014-02-11 Panasonic Corporation Component mounting apparatus and method
US20110180210A1 (en) * 2008-09-30 2011-07-28 Kazuo Mori Pressure bonding apparatus and method
JP2011040489A (ja) * 2009-08-07 2011-02-24 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP2012103305A (ja) * 2010-11-08 2012-05-31 Hitachi High-Technologies Corp Ｆｐｄモジュールの組立装置
JP5605215B2 (ja) * 2010-12-24 2014-10-15 パナソニック株式会社 テープ貼着装置及びテープ貼着方法
JP2015142120A (ja) * 2014-01-30 2015-08-03 デクセリアルズ株式会社 接続体の製造方法、電子部品の接続方法及び接続装置

Also Published As

Publication number Publication date
TW201807763A (zh) 2018-03-01
CN107765454A (zh) 2018-03-06
JP6675357B2 (ja) 2020-04-01
TWI644375B (zh) 2018-12-11
JP2018029172A (ja) 2018-02-22
KR20180019478A (ko) 2018-02-26
CN107765454B (zh) 2021-01-05

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