JP6675357B2 - 圧着装置 - Google Patents
圧着装置 Download PDFInfo
- Publication number
- JP6675357B2 JP6675357B2 JP2017137441A JP2017137441A JP6675357B2 JP 6675357 B2 JP6675357 B2 JP 6675357B2 JP 2017137441 A JP2017137441 A JP 2017137441A JP 2017137441 A JP2017137441 A JP 2017137441A JP 6675357 B2 JP6675357 B2 JP 6675357B2
- Authority
- JP
- Japan
- Prior art keywords
- unit
- electronic component
- pressing
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Combinations Of Printed Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170094591A KR101948428B1 (ko) | 2016-08-16 | 2017-07-26 | 압착 장치 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016159611 | 2016-08-16 | ||
| JP2016159611 | 2016-08-16 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018029172A JP2018029172A (ja) | 2018-02-22 |
| JP2018029172A5 JP2018029172A5 (enExample) | 2019-05-23 |
| JP6675357B2 true JP6675357B2 (ja) | 2020-04-01 |
Family
ID=61248548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017137441A Active JP6675357B2 (ja) | 2016-08-16 | 2017-07-13 | 圧着装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6675357B2 (enExample) |
| KR (1) | KR101948428B1 (enExample) |
| CN (1) | CN107765454B (enExample) |
| TW (1) | TWI644375B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102608963B1 (ko) * | 2019-03-19 | 2023-12-05 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
| CN110544655B (zh) * | 2019-09-03 | 2021-09-14 | 云谷(固安)科技有限公司 | 绑定装置及绑定方法 |
| CN112566485B (zh) * | 2019-09-25 | 2022-05-13 | 芝浦机械电子装置株式会社 | 电子零件的安装装置 |
| JP7424871B2 (ja) * | 2020-03-12 | 2024-01-30 | ニデックインスツルメンツ株式会社 | 検査装置 |
| KR102888788B1 (ko) * | 2020-03-24 | 2025-11-24 | 삼성디스플레이 주식회사 | 본딩 장치 |
| JP7599089B2 (ja) * | 2020-12-25 | 2024-12-13 | パナソニックIpマネジメント株式会社 | 部品圧着装置および部品移送方法 |
| CN113490406B (zh) * | 2021-07-07 | 2022-09-16 | 广州市爱浦电子科技有限公司 | 一种微功率模块电源组成结构的自动化生产方法 |
| CN116027577B (zh) * | 2023-03-24 | 2023-06-13 | 中电科风华信息装备股份有限公司 | 可同时对应ab料邦定的高精度预压机构 |
| CN116403949B (zh) * | 2023-06-08 | 2023-08-15 | 深圳市磐锋精密技术有限公司 | 一种全自动cof邦定机智能传动控制系统及方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4627654B2 (ja) * | 2004-12-09 | 2011-02-09 | 芝浦メカトロニクス株式会社 | 部品の組み立て装置及び組み立て方法 |
| JP2008084952A (ja) * | 2006-09-26 | 2008-04-10 | Fujifilm Corp | 配線板接続方法 |
| JP4687624B2 (ja) * | 2006-09-29 | 2011-05-25 | オムロン株式会社 | 基板支持装置 |
| KR20100092477A (ko) * | 2007-12-04 | 2010-08-20 | 파나소닉 주식회사 | 부품 압착 장치 및 방법 |
| US8646171B2 (en) * | 2008-04-01 | 2014-02-11 | Panasonic Corporation | Component mounting apparatus and method |
| US20110180210A1 (en) * | 2008-09-30 | 2011-07-28 | Kazuo Mori | Pressure bonding apparatus and method |
| JP2011040489A (ja) * | 2009-08-07 | 2011-02-24 | Shibaura Mechatronics Corp | 電子部品の実装装置及び実装方法 |
| JP2012103305A (ja) * | 2010-11-08 | 2012-05-31 | Hitachi High-Technologies Corp | Fpdモジュールの組立装置 |
| JP5605215B2 (ja) * | 2010-12-24 | 2014-10-15 | パナソニック株式会社 | テープ貼着装置及びテープ貼着方法 |
| JP2015142120A (ja) * | 2014-01-30 | 2015-08-03 | デクセリアルズ株式会社 | 接続体の製造方法、電子部品の接続方法及び接続装置 |
-
2017
- 2017-07-13 JP JP2017137441A patent/JP6675357B2/ja active Active
- 2017-07-26 KR KR1020170094591A patent/KR101948428B1/ko active Active
- 2017-08-03 CN CN201710658325.2A patent/CN107765454B/zh active Active
- 2017-08-08 TW TW106126622A patent/TWI644375B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201807763A (zh) | 2018-03-01 |
| KR101948428B1 (ko) | 2019-02-14 |
| CN107765454A (zh) | 2018-03-06 |
| TWI644375B (zh) | 2018-12-11 |
| JP2018029172A (ja) | 2018-02-22 |
| KR20180019478A (ko) | 2018-02-26 |
| CN107765454B (zh) | 2021-01-05 |
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