JP2018029172A5 - - Google Patents

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Publication number
JP2018029172A5
JP2018029172A5 JP2017137441A JP2017137441A JP2018029172A5 JP 2018029172 A5 JP2018029172 A5 JP 2018029172A5 JP 2017137441 A JP2017137441 A JP 2017137441A JP 2017137441 A JP2017137441 A JP 2017137441A JP 2018029172 A5 JP2018029172 A5 JP 2018029172A5
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JP
Japan
Prior art keywords
circuit board
printed circuit
unit
electronic component
pressing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017137441A
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English (en)
Japanese (ja)
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JP6675357B2 (ja
JP2018029172A (ja
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Publication date
Application filed filed Critical
Priority to KR1020170094591A priority Critical patent/KR101948428B1/ko
Publication of JP2018029172A publication Critical patent/JP2018029172A/ja
Publication of JP2018029172A5 publication Critical patent/JP2018029172A5/ja
Application granted granted Critical
Publication of JP6675357B2 publication Critical patent/JP6675357B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017137441A 2016-08-16 2017-07-13 圧着装置 Active JP6675357B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020170094591A KR101948428B1 (ko) 2016-08-16 2017-07-26 압착 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016159611 2016-08-16
JP2016159611 2016-08-16

Publications (3)

Publication Number Publication Date
JP2018029172A JP2018029172A (ja) 2018-02-22
JP2018029172A5 true JP2018029172A5 (enExample) 2019-05-23
JP6675357B2 JP6675357B2 (ja) 2020-04-01

Family

ID=61248548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017137441A Active JP6675357B2 (ja) 2016-08-16 2017-07-13 圧着装置

Country Status (4)

Country Link
JP (1) JP6675357B2 (enExample)
KR (1) KR101948428B1 (enExample)
CN (1) CN107765454B (enExample)
TW (1) TWI644375B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102608963B1 (ko) * 2019-03-19 2023-12-05 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
CN110544655B (zh) * 2019-09-03 2021-09-14 云谷（固安）科技有限公司 绑定装置及绑定方法
CN112566485B (zh) * 2019-09-25 2022-05-13 芝浦机械电子装置株式会社 电子零件的安装装置
JP7424871B2 (ja) * 2020-03-12 2024-01-30 ニデックインスツルメンツ株式会社 検査装置
KR102888788B1 (ko) * 2020-03-24 2025-11-24 삼성디스플레이 주식회사 본딩 장치
JP7599089B2 (ja) * 2020-12-25 2024-12-13 パナソニックＩｐマネジメント株式会社 部品圧着装置および部品移送方法
CN113490406B (zh) * 2021-07-07 2022-09-16 广州市爱浦电子科技有限公司 一种微功率模块电源组成结构的自动化生产方法
CN116027577B (zh) * 2023-03-24 2023-06-13 中电科风华信息装备股份有限公司 可同时对应ab料邦定的高精度预压机构
CN116403949B (zh) * 2023-06-08 2023-08-15 深圳市磐锋精密技术有限公司 一种全自动cof邦定机智能传动控制系统及方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4627654B2 (ja) * 2004-12-09 2011-02-09 芝浦メカトロニクス株式会社 部品の組み立て装置及び組み立て方法
JP2008084952A (ja) * 2006-09-26 2008-04-10 Fujifilm Corp 配線板接続方法
JP4687624B2 (ja) * 2006-09-29 2011-05-25 オムロン株式会社 基板支持装置
KR20100092477A (ko) * 2007-12-04 2010-08-20 파나소닉 주식회사 부품 압착 장치 및 방법
US8646171B2 (en) * 2008-04-01 2014-02-11 Panasonic Corporation Component mounting apparatus and method
US20110180210A1 (en) * 2008-09-30 2011-07-28 Kazuo Mori Pressure bonding apparatus and method
JP2011040489A (ja) * 2009-08-07 2011-02-24 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP2012103305A (ja) * 2010-11-08 2012-05-31 Hitachi High-Technologies Corp Ｆｐｄモジュールの組立装置
JP5605215B2 (ja) * 2010-12-24 2014-10-15 パナソニック株式会社 テープ貼着装置及びテープ貼着方法
JP2015142120A (ja) * 2014-01-30 2015-08-03 デクセリアルズ株式会社 接続体の製造方法、電子部品の接続方法及び接続装置

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