JP5755361B1 - 実装装置 - Google Patents
実装装置 Download PDFInfo
- Publication number
- JP5755361B1 JP5755361B1 JP2014136701A JP2014136701A JP5755361B1 JP 5755361 B1 JP5755361 B1 JP 5755361B1 JP 2014136701 A JP2014136701 A JP 2014136701A JP 2014136701 A JP2014136701 A JP 2014136701A JP 5755361 B1 JP5755361 B1 JP 5755361B1
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- JP
- Japan
- Prior art keywords
- mounting
- axis
- base
- pressure
- mounting head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
- H01L2021/60022—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process using bump connectors, e.g. for flip chip mounting
- H01L2021/60097—Applying energy, e.g. for the soldering or alloying process
- H01L2021/60172—Applying energy, e.g. for the soldering or alloying process using static pressure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
- H01L2224/75824—Translational mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Abstract
Description
Claims (3)
- 電子部品を基板上に実装する実装装置であって、
Y方向に移動可能なY軸移動ベースと、
前記Y軸移動ベースに取り付けられ、前記Y方向と直交する鉛直方向に移動可能なZ軸移動ベースと、
前記Z軸移動ベースに取り付けられ、前記電子部品を吸着保持する実装ツールを具備した実装ヘッドと、
弾性体を介して前記Y軸移動ベースに取り付けられる一方で、前記実装ヘッドとともに鉛直方向に移動しない加圧機構であって、前記実装ヘッドを昇降させるとともに前記実装ヘッドに鉛直下向きの力を付加する加圧機構と、
前記Y軸移動ベースおよびZ軸移動ベースと独立して設けられ、前記実装ツールが前記基板に当接した際に生じる前記鉛直方向上向きの反力を受けるとともに前記加圧機構に近接設置された受圧部材であって、前記加圧機構が前記Y軸ベースとともに前記Y方向に移動する際に、前記加圧機構が前記Y方向に摺動する受圧部材と、
を備え、
前記弾性体は、前記実装ヘッドを保持することなく前記加圧機構を重力に抗して保持しつつも、前記反力を受けて前記鉛直方向に撓むことにより、前記加圧機構の前記鉛直方向上向きへの移動を許容する、
ことを特徴とする実装装置。 - 請求項1に記載の実装装置であって、
前記受圧部材は、前記Z軸移動ベースの可動範囲全体をカバーするサイズである、ことを特徴とする実装装置。 - 請求項1または2に記載の実装装置であって、
前記Y軸移動ベースは、Y方向に延びるY軸レールに沿って移動し、
前記Y軸レールおよび受圧部材は、前記Y方向および前記鉛直方向に直交するX方向に移動可能なX軸移動ベースに取り付けられている、
ことを特徴とする実装装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014136701A JP5755361B1 (ja) | 2014-07-02 | 2014-07-02 | 実装装置 |
PCT/JP2014/076153 WO2016002095A1 (ja) | 2014-07-02 | 2014-09-30 | 実装装置 |
KR1020177002550A KR101918118B1 (ko) | 2014-07-02 | 2014-09-30 | 실장 장치 |
CN201480081486.4A CN106663635B (zh) | 2014-07-02 | 2014-09-30 | 安装装置 |
SG11201700010TA SG11201700010TA (en) | 2014-07-02 | 2014-09-30 | Mounting device |
TW103135594A TWI582899B (zh) | 2014-07-02 | 2014-10-15 | 安裝裝置 |
US15/396,997 US10477697B2 (en) | 2014-07-02 | 2017-01-03 | Mounting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014136701A JP5755361B1 (ja) | 2014-07-02 | 2014-07-02 | 実装装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015082536A Division JP6185955B2 (ja) | 2015-04-14 | 2015-04-14 | 実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5755361B1 true JP5755361B1 (ja) | 2015-07-29 |
JP2016015401A JP2016015401A (ja) | 2016-01-28 |
Family
ID=53759600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014136701A Active JP5755361B1 (ja) | 2014-07-02 | 2014-07-02 | 実装装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10477697B2 (ja) |
JP (1) | JP5755361B1 (ja) |
KR (1) | KR101918118B1 (ja) |
CN (1) | CN106663635B (ja) |
SG (1) | SG11201700010TA (ja) |
TW (1) | TWI582899B (ja) |
WO (1) | WO2016002095A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105261581A (zh) * | 2015-11-20 | 2016-01-20 | 王敕 | 适用于12寸晶圆的芯片封装设备 |
CN107852852A (zh) * | 2015-08-07 | 2018-03-27 | 富士机械制造株式会社 | 元件安装装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5755361B1 (ja) * | 2014-07-02 | 2015-07-29 | 株式会社新川 | 実装装置 |
DE102017010965A1 (de) * | 2017-11-27 | 2019-05-29 | Grenzebach Maschinenbau Gmbh | Vorrichtung und Verfahren zum nahezu verzögerungsfreien Ändern der Schweißrichtung der Schweißschulter einer Anlage zum Rührreibschweißen wenn die geometrische Anordnung der zu verschweißenden Fügepartner oder Materialunebenheiten dies erfordern |
CN110729217A (zh) * | 2019-10-22 | 2020-01-24 | 江苏佳晟精密设备科技有限公司 | 一种安装半导体芯片的装置 |
CN112366158B (zh) * | 2020-11-20 | 2021-12-03 | 深圳中科精工科技有限公司 | 一种高密度led固晶设备 |
TWI799111B (zh) * | 2022-01-26 | 2023-04-11 | 東佑達自動化科技股份有限公司 | 自動化生產線送料裝置 |
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US5333164A (en) | 1991-12-11 | 1994-07-26 | General Electric Company | Method and apparatus for acquiring and processing only a necessary volume of radon data consistent with the overall shape of the object for efficient three dimensional image reconstruction |
JP3599706B2 (ja) * | 1999-11-30 | 2004-12-08 | 東レエンジニアリング株式会社 | チップボンディング装置 |
JP2001332586A (ja) | 2000-05-24 | 2001-11-30 | Toshiba Corp | 半導体装置の製造方法及びその装置 |
JP2004136331A (ja) * | 2002-10-18 | 2004-05-13 | Hitachi Ltd | 摩擦攪拌接合装置及び接合方法 |
JP3743424B2 (ja) * | 2003-01-10 | 2006-02-08 | 松下電器産業株式会社 | 電子部品圧着装置および電子部品圧着方法 |
JP4644481B2 (ja) | 2004-12-24 | 2011-03-02 | Juki株式会社 | 電子部品圧着搭載装置 |
KR100609634B1 (ko) * | 2006-02-16 | 2006-08-08 | 주식회사 탑 엔지니어링 | 본딩 장비의 본딩 헤드 |
DE102006013786A1 (de) * | 2006-03-24 | 2007-09-27 | Wolff Cellulosics Gmbh & Co. Kg | Methylstärkeether in mineralischen Baustoffen |
JP4592637B2 (ja) | 2006-05-01 | 2010-12-01 | パナソニック株式会社 | 電子部品装着装置 |
JP4325875B2 (ja) * | 2006-11-06 | 2009-09-02 | 株式会社日立製作所 | 摩擦攪拌接合用ツール及び摩擦攪拌接合装置 |
JP2009027105A (ja) | 2007-07-24 | 2009-02-05 | Shibuya Kogyo Co Ltd | ボンディング装置 |
JP5613898B2 (ja) * | 2010-03-24 | 2014-10-29 | 公立大学法人大阪府立大学 | 摩擦加工装置及び摩擦加工方法 |
JP5252516B2 (ja) | 2010-11-30 | 2013-07-31 | 上野精機株式会社 | 電子部品保持装置、及びこれを備える電子部品検査装置、電子部品分類装置 |
JP5638978B2 (ja) * | 2011-02-18 | 2014-12-10 | Juki株式会社 | マウンタ装置の加圧制御ヘッド |
JP5755361B1 (ja) * | 2014-07-02 | 2015-07-29 | 株式会社新川 | 実装装置 |
-
2014
- 2014-07-02 JP JP2014136701A patent/JP5755361B1/ja active Active
- 2014-09-30 WO PCT/JP2014/076153 patent/WO2016002095A1/ja active Application Filing
- 2014-09-30 CN CN201480081486.4A patent/CN106663635B/zh active Active
- 2014-09-30 KR KR1020177002550A patent/KR101918118B1/ko active IP Right Grant
- 2014-09-30 SG SG11201700010TA patent/SG11201700010TA/en unknown
- 2014-10-15 TW TW103135594A patent/TWI582899B/zh active
-
2017
- 2017-01-03 US US15/396,997 patent/US10477697B2/en active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107852852A (zh) * | 2015-08-07 | 2018-03-27 | 富士机械制造株式会社 | 元件安装装置 |
EP3334266A4 (en) * | 2015-08-07 | 2018-08-22 | Fuji Machine Mfg. Co., Ltd. | Component-mounting device |
CN107852852B (zh) * | 2015-08-07 | 2019-11-15 | 株式会社富士 | 元件安装装置 |
CN105261581A (zh) * | 2015-11-20 | 2016-01-20 | 王敕 | 适用于12寸晶圆的芯片封装设备 |
CN105261581B (zh) * | 2015-11-20 | 2018-11-02 | 王敕 | 适用于12寸晶圆的芯片封装设备 |
Also Published As
Publication number | Publication date |
---|---|
JP2016015401A (ja) | 2016-01-28 |
CN106663635A (zh) | 2017-05-10 |
US10477697B2 (en) | 2019-11-12 |
CN106663635B (zh) | 2019-10-01 |
TWI582899B (zh) | 2017-05-11 |
SG11201700010TA (en) | 2017-02-27 |
US20170118843A1 (en) | 2017-04-27 |
KR20170024067A (ko) | 2017-03-06 |
KR101918118B1 (ko) | 2018-11-14 |
TW201603181A (zh) | 2016-01-16 |
WO2016002095A1 (ja) | 2016-01-07 |
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