CN107765454B - 压接装置 - Google Patents

压接装置 Download PDF

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Publication number
CN107765454B
CN107765454B CN201710658325.2A CN201710658325A CN107765454B CN 107765454 B CN107765454 B CN 107765454B CN 201710658325 A CN201710658325 A CN 201710658325A CN 107765454 B CN107765454 B CN 107765454B
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CN
China
Prior art keywords
electronic component
substrate
circuit board
printed circuit
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710658325.2A
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English (en)
Chinese (zh)
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CN107765454A (zh
Inventor
野田明孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN107765454A publication Critical patent/CN107765454A/zh
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Publication of CN107765454B publication Critical patent/CN107765454B/zh
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Combinations Of Printed Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN201710658325.2A 2016-08-16 2017-08-03 压接装置 Active CN107765454B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016159611 2016-08-16
JP2016-159611 2016-08-16

Publications (2)

Publication Number Publication Date
CN107765454A CN107765454A (zh) 2018-03-06
CN107765454B true CN107765454B (zh) 2021-01-05

Family

ID=61248548

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710658325.2A Active CN107765454B (zh) 2016-08-16 2017-08-03 压接装置

Country Status (4)

Country Link
JP (1) JP6675357B2 (enExample)
KR (1) KR101948428B1 (enExample)
CN (1) CN107765454B (enExample)
TW (1) TWI644375B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102608963B1 (ko) * 2019-03-19 2023-12-05 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
CN110544655B (zh) * 2019-09-03 2021-09-14 云谷（固安）科技有限公司 绑定装置及绑定方法
CN112566485B (zh) * 2019-09-25 2022-05-13 芝浦机械电子装置株式会社 电子零件的安装装置
JP7424871B2 (ja) * 2020-03-12 2024-01-30 ニデックインスツルメンツ株式会社 検査装置
KR102888788B1 (ko) * 2020-03-24 2025-11-24 삼성디스플레이 주식회사 본딩 장치
JP7599089B2 (ja) * 2020-12-25 2024-12-13 パナソニックＩｐマネジメント株式会社 部品圧着装置および部品移送方法
CN113490406B (zh) * 2021-07-07 2022-09-16 广州市爱浦电子科技有限公司 一种微功率模块电源组成结构的自动化生产方法
CN116027577B (zh) * 2023-03-24 2023-06-13 中电科风华信息装备股份有限公司 可同时对应ab料邦定的高精度预压机构
CN116403949B (zh) * 2023-06-08 2023-08-15 深圳市磐锋精密技术有限公司 一种全自动cof邦定机智能传动控制系统及方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101072656A (zh) * 2004-12-09 2007-11-14 芝浦机械电子株式会社 部件的组装装置及组装方法
JP2008084952A (ja) * 2006-09-26 2008-04-10 Fujifilm Corp 配線板接続方法
CN101933128A (zh) * 2007-12-04 2010-12-29 松下电器产业株式会社 部件压接装置及方法
CN101981681A (zh) * 2008-04-01 2011-02-23 松下电器产业株式会社 零件安装装置及方法
CN102171802A (zh) * 2008-09-30 2011-08-31 松下电器产业株式会社 压接装置及压接方法
CN102473652A (zh) * 2009-08-07 2012-05-23 芝浦机械电子株式会社 电子部件的安装装置及安装方法
JP2012103305A (ja) * 2010-11-08 2012-05-31 Hitachi High-Technologies Corp Ｆｐｄモジュールの組立装置
CN103270582A (zh) * 2010-12-24 2013-08-28 松下电器产业株式会社 带粘接装置及带粘接方法
JP2015142120A (ja) * 2014-01-30 2015-08-03 デクセリアルズ株式会社 接続体の製造方法、電子部品の接続方法及び接続装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4687624B2 (ja) * 2006-09-29 2011-05-25 オムロン株式会社 基板支持装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101072656A (zh) * 2004-12-09 2007-11-14 芝浦机械电子株式会社 部件的组装装置及组装方法
JP2008084952A (ja) * 2006-09-26 2008-04-10 Fujifilm Corp 配線板接続方法
CN101933128A (zh) * 2007-12-04 2010-12-29 松下电器产业株式会社 部件压接装置及方法
CN101981681A (zh) * 2008-04-01 2011-02-23 松下电器产业株式会社 零件安装装置及方法
CN102171802A (zh) * 2008-09-30 2011-08-31 松下电器产业株式会社 压接装置及压接方法
CN102473652A (zh) * 2009-08-07 2012-05-23 芝浦机械电子株式会社 电子部件的安装装置及安装方法
JP2012103305A (ja) * 2010-11-08 2012-05-31 Hitachi High-Technologies Corp Ｆｐｄモジュールの組立装置
CN103270582A (zh) * 2010-12-24 2013-08-28 松下电器产业株式会社 带粘接装置及带粘接方法
JP2015142120A (ja) * 2014-01-30 2015-08-03 デクセリアルズ株式会社 接続体の製造方法、電子部品の接続方法及び接続装置

Also Published As

Publication number Publication date
TW201807763A (zh) 2018-03-01
KR101948428B1 (ko) 2019-02-14
CN107765454A (zh) 2018-03-06
JP6675357B2 (ja) 2020-04-01
TWI644375B (zh) 2018-12-11
JP2018029172A (ja) 2018-02-22
KR20180019478A (ko) 2018-02-26

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