TWI644375B - 壓接裝置 - Google Patents

壓接裝置 Download PDF

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Publication number
TWI644375B
TWI644375B TW106126622A TW106126622A TWI644375B TW I644375 B TWI644375 B TW I644375B TW 106126622 A TW106126622 A TW 106126622A TW 106126622 A TW106126622 A TW 106126622A TW I644375 B TWI644375 B TW I644375B
Authority
TW
Taiwan
Prior art keywords
substrate
electronic component
circuit board
printed circuit
pressing portion
Prior art date
Application number
TW106126622A
Other languages
English (en)
Chinese (zh)
Other versions
TW201807763A (zh
Inventor
野田明孝
Akitaka Noda
Original Assignee
日商芝浦機械電子裝置股份有限公司
Shibaura Mechatronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商芝浦機械電子裝置股份有限公司, Shibaura Mechatronics Corporation filed Critical 日商芝浦機械電子裝置股份有限公司
Publication of TW201807763A publication Critical patent/TW201807763A/zh
Application granted granted Critical
Publication of TWI644375B publication Critical patent/TWI644375B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Combinations Of Printed Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)
TW106126622A 2016-08-16 2017-08-08 壓接裝置 TWI644375B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016159611 2016-08-16
JP2016-159611 2016-08-16

Publications (2)

Publication Number Publication Date
TW201807763A TW201807763A (zh) 2018-03-01
TWI644375B true TWI644375B (zh) 2018-12-11

Family

ID=61248548

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106126622A TWI644375B (zh) 2016-08-16 2017-08-08 壓接裝置

Country Status (4)

Country Link
JP (1) JP6675357B2 (enExample)
KR (1) KR101948428B1 (enExample)
CN (1) CN107765454B (enExample)
TW (1) TWI644375B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102608963B1 (ko) * 2019-03-19 2023-12-05 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
CN110544655B (zh) * 2019-09-03 2021-09-14 云谷（固安）科技有限公司 绑定装置及绑定方法
CN112566485B (zh) * 2019-09-25 2022-05-13 芝浦机械电子装置株式会社 电子零件的安装装置
JP7424871B2 (ja) * 2020-03-12 2024-01-30 ニデックインスツルメンツ株式会社 検査装置
KR102888788B1 (ko) * 2020-03-24 2025-11-24 삼성디스플레이 주식회사 본딩 장치
JP7599089B2 (ja) * 2020-12-25 2024-12-13 パナソニックＩｐマネジメント株式会社 部品圧着装置および部品移送方法
CN113490406B (zh) * 2021-07-07 2022-09-16 广州市爱浦电子科技有限公司 一种微功率模块电源组成结构的自动化生产方法
CN116027577B (zh) * 2023-03-24 2023-06-13 中电科风华信息装备股份有限公司 可同时对应ab料邦定的高精度预压机构
CN116403949B (zh) * 2023-06-08 2023-08-15 深圳市磐锋精密技术有限公司 一种全自动cof邦定机智能传动控制系统及方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101155506A (zh) * 2006-09-29 2008-04-02 欧姆龙株式会社 基板支撑装置
TW200946432A (en) * 2008-04-01 2009-11-16 Panasonic Corp Component mounting apparatus and method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4627654B2 (ja) * 2004-12-09 2011-02-09 芝浦メカトロニクス株式会社 部品の組み立て装置及び組み立て方法
JP2008084952A (ja) * 2006-09-26 2008-04-10 Fujifilm Corp 配線板接続方法
KR20100092477A (ko) * 2007-12-04 2010-08-20 파나소닉 주식회사 부품 압착 장치 및 방법
US20110180210A1 (en) * 2008-09-30 2011-07-28 Kazuo Mori Pressure bonding apparatus and method
JP2011040489A (ja) * 2009-08-07 2011-02-24 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP2012103305A (ja) * 2010-11-08 2012-05-31 Hitachi High-Technologies Corp Ｆｐｄモジュールの組立装置
JP5605215B2 (ja) * 2010-12-24 2014-10-15 パナソニック株式会社 テープ貼着装置及びテープ貼着方法
JP2015142120A (ja) * 2014-01-30 2015-08-03 デクセリアルズ株式会社 接続体の製造方法、電子部品の接続方法及び接続装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101155506A (zh) * 2006-09-29 2008-04-02 欧姆龙株式会社 基板支撑装置
TW200946432A (en) * 2008-04-01 2009-11-16 Panasonic Corp Component mounting apparatus and method

Also Published As

Publication number Publication date
TW201807763A (zh) 2018-03-01
KR101948428B1 (ko) 2019-02-14
CN107765454A (zh) 2018-03-06
JP6675357B2 (ja) 2020-04-01
JP2018029172A (ja) 2018-02-22
KR20180019478A (ko) 2018-02-26
CN107765454B (zh) 2021-01-05

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