KR101920972B1 - 전자 부품의 제조 방법 - Google Patents

전자 부품의 제조 방법 Download PDF

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Publication number
KR101920972B1
KR101920972B1 KR1020160167370A KR20160167370A KR101920972B1 KR 101920972 B1 KR101920972 B1 KR 101920972B1 KR 1020160167370 A KR1020160167370 A KR 1020160167370A KR 20160167370 A KR20160167370 A KR 20160167370A KR 101920972 B1 KR101920972 B1 KR 101920972B1
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South Korea
Prior art keywords
porous metal
mold
resin
chip
substrate
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KR1020160167370A
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English (en)
Korean (ko)
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KR20170092096A (ko
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신 다케우치
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토와 가부시기가이샤
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    • H01L21/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H01L23/29—
    • H01L23/3107—
    • H01L23/3736—
    • H01L23/4334—
    • H01L23/562—
    • H01L25/18—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
KR1020160167370A 2016-02-02 2016-12-09 전자 부품의 제조 방법 Active KR101920972B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-017681 2016-02-02
JP2016017681A JP6639931B2 (ja) 2016-02-02 2016-02-02 電子部品の製造装置及び製造方法並びに電子部品

Publications (2)

Publication Number Publication Date
KR20170092096A KR20170092096A (ko) 2017-08-10
KR101920972B1 true KR101920972B1 (ko) 2018-11-21

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Country Status (4)

Country Link
JP (1) JP6639931B2 (https=)
KR (1) KR101920972B1 (https=)
CN (1) CN107026107B (https=)
TW (1) TW201806097A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11195800B2 (en) 2019-03-06 2021-12-07 Samsung Electro-Mechanics Co., Ltd. Electronic device module and method of manufacturing the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN208093541U (zh) * 2017-12-05 2018-11-13 合肥矽迈微电子科技有限公司 封装体
JP2019165173A (ja) * 2018-03-20 2019-09-26 株式会社東芝 半導体装置および半導体装置の製造方法
CN109326527B (zh) * 2018-09-27 2020-10-13 泉州智慧果技术服务有限公司 一种功率元件封装模块及其制备方法
US11037883B2 (en) * 2018-11-16 2021-06-15 Analog Devices International Unlimited Company Regulator circuit package techniques
WO2020188806A1 (ja) * 2019-03-20 2020-09-24 三菱電機株式会社 半導体装置
JP7192970B2 (ja) * 2019-04-15 2022-12-20 株式会社村田製作所 電子部品モジュール
KR102345062B1 (ko) * 2019-11-20 2021-12-30 (주)에이티세미콘 반도체 패키지 및 그 제조 방법
CN218730889U (zh) * 2020-03-06 2023-03-24 株式会社村田制作所 散热构造体以及电子设备
CN111834238A (zh) * 2020-08-10 2020-10-27 李元雄 一种采用凸块与倒装的大功率半导体器件封装方法
CN111952206B (zh) * 2020-08-14 2022-09-13 深圳市天成照明有限公司 一种电子元器件生产用封装装置
JP7428384B2 (ja) * 2020-10-06 2024-02-06 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
CN116802795A (zh) * 2021-01-19 2023-09-22 佐佐木贝慈 电子装置及产品
CN113299566B (zh) * 2021-05-20 2023-01-24 合肥速芯微电子有限责任公司 封装结构及其制备方法
CN114496808B (zh) * 2022-01-25 2024-03-12 河北博威集成电路有限公司 倒装式塑封的装配方法、屏蔽系统、散热系统及应用
JP7813591B2 (ja) * 2022-01-27 2026-02-13 ヤマハロボティクス株式会社 樹脂封止装置及び樹脂封止方法
CN114823370B (zh) * 2022-05-10 2022-10-14 山东汉旗科技有限公司 指纹识别芯片封装结构及其封装的方法
TWI844243B (zh) * 2023-01-18 2024-06-01 宏碁股份有限公司 電子封裝結構
JP2024156325A (ja) * 2023-04-24 2024-11-06 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
TWI864819B (zh) * 2023-06-13 2024-12-01 南茂科技股份有限公司 薄膜覆晶封裝結構
CN117457618B (zh) * 2023-12-25 2024-04-09 长电集成电路(绍兴)有限公司 芯片封装结构及芯片封装方法

Citations (2)

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JP2000101004A (ja) * 1998-09-24 2000-04-07 Tomoegawa Paper Co Ltd 放熱シート
JP2002158316A (ja) * 2000-11-16 2002-05-31 Towa Corp 半導体装置及びその製造方法

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JP4253992B2 (ja) * 2000-03-16 2009-04-15 株式会社デンソー 樹脂封止型半導体装置
CN101587887A (zh) * 2008-05-23 2009-11-25 富准精密工业(深圳)有限公司 发光二极管结构
JP5740995B2 (ja) * 2011-01-17 2015-07-01 富士通株式会社 半導体装置及びその製造方法
JP6169516B2 (ja) * 2014-03-31 2017-07-26 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP6017492B2 (ja) * 2014-04-24 2016-11-02 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法、突起電極付き板状部材、及び樹脂封止電子部品
JP6298719B2 (ja) * 2014-06-09 2018-03-20 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP5944445B2 (ja) * 2014-07-18 2016-07-05 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法、突起電極付き板状部材、樹脂封止電子部品、及び突起電極付き板状部材の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000101004A (ja) * 1998-09-24 2000-04-07 Tomoegawa Paper Co Ltd 放熱シート
JP2002158316A (ja) * 2000-11-16 2002-05-31 Towa Corp 半導体装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11195800B2 (en) 2019-03-06 2021-12-07 Samsung Electro-Mechanics Co., Ltd. Electronic device module and method of manufacturing the same

Also Published As

Publication number Publication date
CN107026107A (zh) 2017-08-08
TW201806097A (zh) 2018-02-16
KR20170092096A (ko) 2017-08-10
CN107026107B (zh) 2020-08-18
JP2017139278A (ja) 2017-08-10
JP6639931B2 (ja) 2020-02-05

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