CN106358415B - 电子装置模块及其制造方法 - Google Patents
电子装置模块及其制造方法 Download PDFInfo
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- CN106358415B CN106358415B CN201610236970.0A CN201610236970A CN106358415B CN 106358415 B CN106358415 B CN 106358415B CN 201610236970 A CN201610236970 A CN 201610236970A CN 106358415 B CN106358415 B CN 106358415B
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Abstract
提供了一种电子装置模块及其制造方法。在一个总的方面中,电子装置模块包括:第一板;第一器件,安装在第一板的第一表面上;第二板,设置在第一板之下;多个第二器件,设置在第一板与第二板之间,其中,所述多个第二器件中的每个第二器件的一个表面结合到第一板的第二表面,并且每个第二器件的另一表面结合到第二板。
Description
本申请要求于2015年7月13日在韩国知识产权局提交的第10-2015-0099286号韩国专利申请的优先权和权益,所述韩国专利申请的全部公开内容出于所有目的通过引用被包含于此。
技术领域
下面的描述涉及一种尺寸显著地减小的电子装置模块及其制造方法。
背景技术
在电子产品市场中,对便携式装置的需求已持续增加。因此,已不断地要求安装在电子产品中的电子装置的小型化和轻量化。为了实现如上所述的电子装置的小型化和轻量化,需要系统级芯片(SOC)技术(实现了在一个芯片上安装多个独立的器件)、系统级封装(SIP)技术(使多个独立的器件集成在一个封装件中)等以及用于减小安装组件的单个尺寸的技术。
为了制造在具有紧凑尺寸的同时具有高性能的电子装置模块,已研发了一种使器件堆叠并安装在其中的结构。然而,由于如上所述的对器件进行堆叠,使得电子装置模块的总尺寸增大,从而妨碍了便携式装置的小型化。
发明内容
提供该发明内容以简化形式来介绍选择的构思,以下在具体实施方式中进一步描述该构思。本发明内容无意限定所要求保护的主题的主要特征或必要特征,也无意用于帮助确定所要求保护的主题的范围。
在一个总的方面中,一种电子装置模块包括:第一板;第一器件,安装在第一板的第一表面上;第二板,设置在第一板之下;多个第二器件,设置在第一板与第二板之间,其中,所述多个第二器件中的每个第二器件的一个表面结合到第一板的第二表面,并且每个第二器件的另一表面结合到第二板。
电子装置模块还可包括设置在第二板的下表面上的多个外部连接端子。
连接端子可形成在所述多个第二器件中的每个第二器件的所述一个表面和所述另一表面上,并且所述多个第二器件通过连接端子结合到第一板和第二板。第一板和第二板可通过所述多个第二器件的连接端子彼此电连接。
所述多个第二器件可包括呈六面体形状的电子组件,并且第二器件中的每个具有彼此相同或相似的厚度。
第二器件可包括至少一个电子组件和至少一个虚设器件。
电子装置模块还可包括包封第一器件和第二器件的包封部。第一板可嵌在包封部中,第一板的侧表面可暴露于外部。
在另一总的方面中,一种制造电子装置模块的方法包括:将第一器件安装在第一板的一个表面上;将多个第二器件结合到第一板的另一表面上;将第二器件结合到第二板。
所述方法还可包括形成包封至少一个第一器件并包封第二器件的包封部。
第二器件的第一表面可结合到第一板的所述另一表面,第二器件的第二表面可结合到第二板。
第二器件可包括具有彼此相同的厚度的多个电子组件。
第一板和第二板可以是条状类型的板,其中,条状类型的板中重复地布置有多个安装区域。可对安装区域之间的第一板和第二板以及包封部进行切割。
在另一总的方面中,一种电子装置模块包括:第一板;第一器件,安装在第一板的第一表面上;第二板,设置在第一板之下;多个第二器件,设置在第一板与第二板之间,其中,所述多个第二器件中的每个第二器件的一个表面结合到第一板的第二表面,并且所述多个第二器件的每个第二器件的另一表面结合到第二板,以在第一板与第二板之间形成多个间隙;包封部,包封第一板并包封第二板的一个表面,其中,第一板与第二板之间的间隙容纳包封部的一部分。
所述多个第二器件还可包括连接端子。连接端子可连接到第一板和第二板。
第一器件的表面可暴露于外部。第一板和第二板的侧表面可暴露于外部。
其它特征和方面将通过下面的具体实施方式、附图和权利要求而明显。
附图说明
图1是示意性地示出根据一个或更多个实施例的电子装置模块的截面图;
图2是示出根据一个或更多个实施例的电子装置模块的内部的局部剖切透视图;
图3是根据一个或更多个实施例的电子装置模块的分解透视图;
图4至图9是示出根据一个或更多个实施例的制造电子装置模块的方法的截面图;
图10是示意性地示出根据另一实施例的电子装置模块的截面图;
图11是示意性地示出根据另一实施例的电子装置模块的截面图。
在整个附图和具体实施方式中,相同的标号指示相同的元件。附图可不按照比例绘制,为了清楚、说明和便利起见,可能会夸大附图中元件的相对尺寸、比例和描绘。
具体实施方式
提供以下的具体实施方式,以帮助读者获得对在此描述的方法、设备和/或系统的全面理解。然而,在此描述的方法、设备和/或系统的各种改变、修改以及等同物对于本领域的普通技术人员来说将是明显的。在此描述的操作的顺序仅仅是示例,而且其并不局限于在此阐述的,而是除了必须以特定顺序进行的操作之外,可做出对于本领域的普通技术人员将是明显的改变。此外,为了更加清楚和简洁,可省略本领域的普通技术人员公知的功能和结构的描述。
在此描述的特征可按照不同的形式实施,并且不应该被解释为局限于在此描述的示例。更确切地说,提供在此描述的示例,以使本公开将是彻底的和完整的,并将本公开的全部范围传达给本领域的普通技术人员。
将明显的是,虽然可在此使用术语“第一”、“第二”、“第三”等来描述各种构件、组件、区域、层和/或部分,但是这些构件、组件、区域、层和/或部分不应被这些术语限制。这些术语仅用于将一个构件、组件、区域、层或部分与另一构件、组件、区域、层或部分区分开。因此,在不脱离实施例的教导的情况下,下面论述的第一构件、组件、区域、层或部分可称作第二构件、组件、区域、层或部分。
除非另外指明,否则第一层“在”第二层或基板“上”的表述将被解释为涵盖第一层直接接触第二层或基板的情况以及一个或更多个其它层设置在第一层与第二层或基板之间的情况。
描述相对空间关系的词语(例如,“在……之下”、“在……下面”、“在……下方”、“下面”、“底部”、“在……之上”、“在……上方”、“上面”、“顶部”、“左”和“右”)可用于方便地描述一个装置或元件与其它装置或元件的空间关系。这样的词语应解释为包含如图所示定位的以及在使用或操作中处于其它方位的装置。例如,基于图中示出的装置的方位包括设置在第一层之上的第二层的装置的示例也包括当装置在使用或操作时被上下翻转的装置。
在此使用的术语仅用于描述特定实施例,并且无意限制本发明构思。除非上下文中另外清楚地指明,否则如在此使用的单数形式也意于包括复数形式。还将理解的是,在本说明书中使用的术语“包括”和/或“包含”时,列举存在所述的特征、整体、步骤、操作、构件、元件和/或它们的组合,而不排除存在或增加一个或更多个其它特征、整体、步骤、操作、构件、元件和/或它们的组合。
图1是示意性地示出根据一个或更多个实施例的电子装置模块的截面图。此外,图2是示出图1中所示的电子装置模块的内部的局部剖切透视图,图3是图1中示出的电子装置模块的分解透视图。
参照图1至图3,根据实施例的电子装置模块100包括:电子器件1、第一板10、第二板20和包封部30。
电子器件1包括至少一个第一器件2和至少一个第二器件3。电子器件1可以是任何电子组件,只要其可安装在第一板10上即可。例如,电子器件1可以是有源器件或无源器件。
第一器件2可以是具有大的安装面积的器件。例如,第一器件2可以是具有其安装面积占据第一板10的面积的至少一半的尺寸并且具有形成得平坦的上表面的器件。然而,第一器件2不限于此,并且可以进行改变。
根据实施例的第一器件2包括平坦的主体2a,并且可通过设置在主体2a的下表面上的多个连接端子2b结合到第一板10的一个表面。因此,可使用有源器件(例如,集成电路(IC)或封装器件)作为第一器件2,连接端子2b可由焊球或焊料凸点形成。
第一器件2可按照倒装芯片的形式安装在第一板10上。然而,第一器件2不限于此,并且可进行改变。例如,如果需要,则第一器件2可通过键合线(bonding wire)电连接到第一板10。
第二器件3可以是其连接端子3b设置在主体3a的上表面和下表面这二者上的器件。连接端子3b可用作分隔件和连接端子。
多个第二器件3可设置在第二板20的一个表面上,并且介于第一板10与第二板20之间,从而将第一板10和第二板20彼此电连接。例如,在第二器件3中,形成在上表面上的连接端子3b和形成在下表面上的连接端子3b彼此电连接。此外,第二器件3可设置在第一板10与第二板20之间,以保持第一板10与第二板20之间的恒定的间隔。因此,第二器件3具有彼此相同的高度。
与第一器件2相比,第二器件是具有相对小的尺寸的电子组件。例如,第二器件3可具有盒形的外观,第二器件3可包括呈六面体形状的电子组件(例如,电容器、电感器或电阻器),并且第二器件3中的每个可具有彼此相同或相似的厚度。然而,第二器件3不限于此,并且可以进行改变。
第二器件3的连接端子3b可以是平面的或具有突起,并且可通过导电粘合剂(例如,焊料)结合到板10和板20。然而,第二器件3的结合方法不限于此,并且可以进行改变。例如,第二器件3可通过倒装芯片结合法安装在板10或板20上。
此外,根据实施例的电子器件1可包括至少一个虚设器件4。虚设器件4是形成为具有与第二器件3的外观相同的外观但本质上不执行任何功能的器件。因此,虚设器件4可与第二器件3一起安装在第二板20上用作分隔件和连接端子,但不用作电子组件。
如上所述的虚设器件4可被设置为将第一板10和第二板20简单地电连接或使第一板10和第二板20彼此分开,或者将第一板10和第二板20简单地电连接并使第一板10和第二板20彼此分开。当第一板10和第二板20仅使用电子组件彼此完全电连接或者在没有虚设器件4的情况下第一板10和第二板20彼此稳固地分开时,可省略虚设器件4。
根据一个或更多个实施例的电子器件1不限于第一器件2和第二器件3,并且除了第一器件和第二器件之外还可包括各种其它器件。例如,电子器件1可包括各种器件,例如,围绕第一器件安装在第一板10上的器件或者安装在第二板20上并且具有比第二器件3的厚度小得多的厚度的器件。
第一板10可以是各种类型的板(例如,陶瓷板、印刷电路板、玻璃板或柔性板)。此外,用于安装电子器件1的电极垫13或将电极垫13彼此电连接的布线图案可形成在第一板10的两个表面上。
第一板10可以是包括多个层的多层板,用于形成电连接的电路图案15形成在各个层之间。
此外,第一板10包括将形成在其两个表面上的电极垫13连接到形成在第一板10中的电路图案15的导电过孔14。
此外,根据一个或更多个实施例的第一板10具有比下面将要描述的第二板20的面积小的面积。因此,第一板10可被完全包封在下面将要描述的包封部30中。因此,仅电子装置模块100的包封部30和第二板20暴露于外部。然而,第一板10不限于此,如果需要,则第一板10可部分地暴露于外部。
第二板20设置在第一板10之下,并且可通过第二器件3电连接且物理地连接到第一板10。与第一板10相似,各种类型的板(例如,陶瓷板、印刷电路板、玻璃板或柔性板)可用作第二板20,第二板20可具有与第一板的结构相同或不同的结构。然而,第二板20不限于此,并且可进行改变。
如果需要,则外部连接端子28可形成在第二板20的下表面上。外部连接端子28可将电子装置模块100电连接且物理地连接到电子装置模块100安装在其上的主板。因此,安装在第一板10上的第一器件2可通过第二器件3电连接到第二板20和外部连接端子28。
外部连接端子28可形成为焊球形状。然而,外部连接端子28不限于此,并且可形成为各种形状,例如,焊料凸点形状、焊垫形状等。
包封部30对安装在第一板10上的电子器件1的全部进行包封。此外,包封部30还可设置在安装于第一板10和第二板20上的电子器件1之间,因此包封部30可在围住电子器件1的外部的同时防止电子器件1之间发生电短路,并且还可将电子组件1固定到第一板10上,从而稳妥地保护电子器件免受外部冲击。
包封部30可由绝缘树脂(例如,环氧树脂)形成。此外,包封部30可通过将其上安装有电子器件1的第一板10放置在模具中并且将树脂注入到模具中而形成。
根据一个或更多个实施例的包封部30形成为使得第一器件2完全嵌入在其中。然而,包封部30不限于此,并且可形成为使得安装在第一板10上的电子器件1中的至少一个部分地暴露于外部。此外,包封部30还可设置在于第一板10与第二板20之间形成的全部空间中。
包封部30可通过注射成型方法或另一成型方法形成。例如,环氧塑封料(EMC)可用作包封部30的材料。然而,包封部30的形成方法不限于此,为了形成包封部30,如果需要,则可使用各种方法,例如,对半固化的树脂进行压制的方法。
在如上所述的根据一个或更多个实施例的电子装置模块100中,电子器件1可安装在第一板10的两个表面上。此外,外部连接端子28可形成在设置于第一板10的下表面之下的第二板20上。因此,由于多个电子器件1可安装在第一板10的两个表面上,因此可增大器件的集成度。此外,由于第一板10与第二板20之间的分开距离与第二器件3(为电子组件)的厚度相同,因此可显著减小电子装置模块100的总厚度。因此,即使电子装置模块包括大量的电子器件,电子装置模块也可容易被用在薄的电子设备中。
接下来,将描述根据一个或更多个实施例的制造电子装置模块的方法。
图4至图9是示出根据一个或更多个实施例的制造电子装置模块的方法的截面图。
首先,如图4所示,可制备第一板10。如上所述,第一板10可以是多层板,可在第一板10的两个表面上形成电极垫13。
第一板10可以是条状类型的板(在下文中称作条状板)。这里,条状板10是其中重复地布置有彼此相同的多个安装区域的板,以同时制造多个独立的电子装置模块100。详细地讲,条状板10可呈具有宽区域的四边形形状或长条形状。在这种情况下,可在多个安装区域中的每个中制造电子装置模块100。
参照图5,在第一板10的一个表面上安装第一器件2。可通过如下方法来执行第一器件2的安装:在第一板10的一个表面上设置至少一个第一器件2、对第一器件2施加热以使第一器件2的连接端子2b熔化并使其固化。
参照图6,在第一板10的另一表面上安装第二器件3。可通过如下方法来执行第二器件3的安装:利用丝网印刷方法在形成于第一板10的另一表面上的电极垫13上印刷焊膏,在焊膏上设置第二器件3,并且对焊膏施加热,从而使焊膏固化。从而,将电子器件1安装在第一板10的两个表面上。
参照图7,可通过第二器件3将第一板10安装在第二板20的一个表面上。为了使第二器件3结合到第二板20,可通过丝网印刷方法在形成于第二板20上的电极垫23上印刷焊膏。然后,将第一板10和第二器件3设置在第二板20和印刷的焊膏上。随后,可通过对焊膏施加热以使其熔化并使焊膏固化来使第二器件3与第二板20彼此结合。因此,通过第二器件3和焊膏将第一板10连接到第二板20。
仅作为示例,在第一板10为条状板的情况下,在将第二器件3结合到第二板20之前,按照安装区域中的每个对条状板进行切割,以形成单个模块。然而,顺序不限于此,并且可进行改变。例如,在将第二器件3结合到第二板20之后,可同时对第一板10和第二板20进行切割,或者在形成下面将要描述的包封部之后,可执行切割。在这种情况下,与第一板10相似,可使用条状类型的板作为第二板20。
接下来,形成包封部30。在形成包封部30时,将其上安装有电子器件1的第一板10设置在如图8所示的模具90中。可通过将成型树脂注入到模具90中来形成包封部30。在这种情况下,由于在第二板的下表面接触模具90的内表面的状态下注入成型树脂,因此第二板的下表面不会嵌入在包封部30中,而是可暴露于外部,如图9所示。
此外,在注入成型树脂时,成型树脂还可设置在于第一板10与第二板20之间形成的空间中。如上所述,第一板10可具有比第二板20的面积小的面积。因此,成型树脂可填充在第一板10上、第一板10和第二板20之间的全部空间以及第一板10与模具之间的间隙中。
因此,第一板10和第二板20可通过设置在第一板10与第二板20之间的包封部30而彼此绝缘,并且可增大第一板10与第二板20之间的结合强度。
根据一个或更多个实施例的包封部30可由环氧塑封料(EMC)形成。然而,包封部30的形成方法不限于此,为了形成包封部30,可使用各种方法,例如,对半固化的树脂进行压制的方法、在分配方案(dispensing scheme)中注入液态树脂并使注入的树脂固化的方法。
接下来,可在第二板20的下表面上形成外部连接端子28,从而完成图1中示出的电子装置模块。外部连接端子28按照凸点形状形成在形成于第二板20的下表面上的电极垫23上。然而,外部连接端子28不限于此,并且可形成为诸如焊球的各种形状。此外,在不需要外部连接端子的情况下,可省略外部连接端子的形成步骤。
在如上所述的根据一个或更多个实施例的制造电子装置模块的方法中,可通过单个工艺步骤在第一板的上部和下部这二者上形成包封部。此外,由于使用表面贴装技术(SMT)将第一板和第二板彼此电连接,因此可容易制造电子装置模块。
电子装置模块及其制造方法不限于上面描述的实施例,并且可进行各种修改。
图10是示意地示出根据另一实施例的电子装置模块的安装结构的截面图。参照图10,在根据另一实施例的电子装置模块200中,第一器件2的上表面从包封部30暴露于外部。
在这种情况下,由于包封部30不形成在第一器件2的外部(即,上部)上,因此形成在第一板10上的包封部30的厚度与第一器件2的安装高度对应。因此,可显著减小包封部30的厚度,因此,还可显著减小电子装置模块200的厚度。
图11是示意性地示出根据另一实施例的电子装置模块的安装结构的截面图。参照图11,在根据另一实施例的电子装置模块300中,第一板10和第二板20形成为具有彼此相同的面积,因此,第一板10的侧表面从包封部30暴露于外部。
在这种情况下,包封部30分为形成在第一板10上的第一包封部31和形成在第二板20上的第二包封部32。此外,电子器件1包括安装在第一板10上的第三器件5。第三器件5可以是与第二器件3相同或相似的电子组件或无源器件。然而,第三器件5不限于此,并且可进行改变。
电子装置模块300的结构可通过使用条状板制造第一板10和第二板20这二者而形成。更详细地讲,根据一个或更多个实施例的制造电子装置模块的方法可与上面描述的制造电子装置模块的方法相似地执行,并且条状板可用作第一板10和第二板20。
此外,在堆叠第一板10和第二板20并对其进行包封之后,可按照单个模块100的安装区域中的每个对包封的第一板和第二板进行切割。在切割时,可同时对包封部30、第一板10和第二板20进行切割,因此,第一板10的侧表面从包封部30暴露于外部。
如上所述,根据一个或更多个实施例,由于电子器件安装在第一板的两个表面上,因此电子装置模块可增大器件的集成度。此外,由于第一板与第二板之间的分开距离与第二器件的厚度相同,因此可显著减小电子装置模块的总厚度,因此,电子装置模块可容易被用在薄的电子设备中。
虽然本公开包括具体示例,但是对本领域的普通技术人员将明显的是,在不脱离权利要求以及其等同物的精神和范围的情况下,可在形式和细节方面对这些示例做出各种改变。在此描述的示例仅被视为描述意义,而非出于限制的目的。在每个示例中的特征或方面的描述被视为适用于其它示例中的类似的特征或方面。如果按照不同的顺序执行描述的技术、和/或如果按照不同的方式来组合所描述的系统、结构、装置或电路、和/或由其它组件或其等同物来替换或增补所描述的系统、结构、装置或电路,则可实现合理的结果。因此,本公开的范围不由具体实施方式限定,而是由权利要求及其等同物限定,并且权利要求及其等同物的范围内的全部修改将被理解为包括在本公开中。
Claims (16)
1.一种电子装置模块,包括:
第一板;
第一器件,安装在第一板的第一表面上;
第二板,设置在第一板之下;
多个第二器件,设置在第一板与第二板之间,其中,所述多个第二器件中的每个第二器件的一个表面结合到第一板的第二表面,并且每个第二器件的另一表面结合到第二板的上表面,
其中,所述多个第二器件形成为具有六面体形状,并且第二器件中的每个具有彼此相同或相似的厚度,
其中,所述多个第二器件包括至少一个电子组件和本质上不执行任何功能的至少一个虚设器件,并且
其中,每个虚设器件包括主体和设置在所述主体的上表面和下表面上的连接端子。
2.如权利要求1所述的电子装置模块,所述电子装置模块还包括设置在第二板的下表面上的多个外部连接端子。
3.如权利要求1所述的电子装置模块,其中,每个电子组件包括主体和设置在所述主体的上表面和下表面上的连接端子,所述多个第二器件通过连接端子结合到第一板和第二板。
4.如权利要求3所述的电子装置模块,其中,第一板和第二板通过所述多个第二器件的连接端子彼此电连接。
5.如权利要求1所述的电子装置模块,所述电子装置模块还包括包封第一器件和第二器件的包封部。
6.如权利要求5所述的电子装置模块,其中,第一板嵌在包封部中。
7.如权利要求5所述的电子装置模块,其中,第一板的侧表面暴露于外部。
8.一种制造电子装置模块的方法,所述方法包括:
将第一器件安装在第一板的一个表面上;
将多个第二器件结合到第一板的另一表面上;
将所述多个第二器件结合到第二板,使得所述多个第二器件设置在第一板与第二板之间,
其中,所述多个第二器件形成为具有六面体形状,并且第二器件中的每个具有彼此相同或相似的厚度,
其中,所述多个第二器件包括至少一个电子组件和本质上不执行任何功能的至少一个虚设器件,并且
其中,每个虚设器件包括主体和设置在所述主体的上表面和下表面上的连接端子。
9.如权利要求8所述的方法,所述方法还包括形成包封至少一个第一器件并包封第二器件的包封部。
10.如权利要求8所述的方法,其中,第二器件的第一表面结合到第一板的所述另一表面,第二器件的第二表面结合到第二板。
11.如权利要求9所述的方法,其中,第一板和第二板为条状类型的板,其中,条状类型的板中重复地布置有多个安装区域。
12.如权利要求11所述的方法,所述方法还包括对安装区域之间的第一板和第二板以及包封部进行切割。
13.一种电子装置模块,包括:
第一板;
第一器件,安装在第一板的第一表面上;
第二板,设置在第一板之下;
多个第二器件,设置在第一板与第二板之间,其中,所述多个第二器件中的每个第二器件的一个表面结合到第一板的第二表面,并且所述多个第二器件的每个第二器件的另一表面结合到第二板的上表面,以在第一板与第二板之间形成多个间隙;
包封部,包封第一板并包封第二板的一个表面,其中,第一板与第二板之间的间隙容纳包封部的一部分,
其中,所述多个第二器件形成为具有六面体形状,并且第二器件中的每个具有彼此相同或相似的厚度,
其中,所述多个第二器件包括至少一个电子组件和本质上不执行任何功能的至少一个虚设器件,并且
其中,每个虚设器件包括主体和设置在所述主体的上表面和下表面上的连接端子。
14.如权利要求13所述的电子装置模块,其中,第一器件的表面暴露于外部。
15.如权利要求13所述的电子装置模块,其中,第一板和第二板的侧表面暴露于外部。
16.如权利要求13所述的电子装置模块,其中,每个电子组件包括主体和设置在所述主体的上表面和下表面上的连接端子,连接端子连接到第一板和第二板。
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